公开(公告)号：US20050167006A1

公开(公告)日：2005-08-04

申请号：US10506260

申请日：2003-12-25

申请人： Nobuko Mineji ,  Tadashi Inoue ,  Tatsuhiko Hiratani ,  Kenji Tahara ,  Noritaka Takahashi ,  Hiroaki Kato ,  Teruo Takeuchi ,  Kenichiro Takayanagi ,  Chohachi Sato ,  Masamichi Okada

发明人： Nobuko Mineji ,  Tadashi Inoue ,  Tatsuhiko Hiratani ,  Kenji Tahara ,  Noritaka Takahashi ,  Hiroaki Kato ,  Teruo Takeuchi ,  Kenichiro Takayanagi ,  Chohachi Sato ,  Masamichi Okada

IPC分类号： C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  H01F1/147

CPC分类号： C22C38/02 ,  C22C38/002 ,  C22C38/004 ,  C22C38/04 ,  H01J2229/87

摘要： A steel sheet for an explosion-proof band contains 0.001 to 0.05% by mass of C, 0.2 to 1% by mass of Si, 0.5 to 2.3% by mass of Mn, 0.02 to 0.12% by mass of P, not higher than 0.005% by mass of 0, not higher than 0.020% by mass of S, and not higher than 0.005% by mass of N, and has not higher than 100% of a P segregation rate within the steel sheet, which is represented by (Pmax−Pave)×100/Pave, where Pmax denotes the maximum P concentration within the steel sheet, and Pave denotes the average P concentration within the steel sheet, 10 to 25 μm of an average ferrite grain size, and not lower than 10,000 of an anhysteretic magnetic permeability.

摘要翻译： 用于防爆带的钢板包含0.001至0.05质量％的C，0.2至1质量％的Si，0.5至2.3质量％的Mn，0.02至0.12质量％的P，不高于0.005 质量％0，不高于0.020质量％的S，不高于0.005质量％的N，并且不高于钢板内的P偏析率的100％，其由（P 其中P最大值表示钢板内的最大P浓度 ，P＆lt; ave＆lt; / SUB＆gt;表示钢板内的平均P浓度，平均铁素体晶粒尺寸为10〜25μm，非磁滞磁导率为10000以上。

公开(公告)号：US06554917B1

公开(公告)日：2003-04-29

申请号：US09744139

申请日：2001-03-19

申请人： Nobuo Yamagami ,  Kunikazu Tomita ,  Yasuyuki Takada ,  Yoshihiko Oda ,  Chohachi Sato ,  Teruo Takeuchi ,  Ichiro Saito ,  Hiroaki Kato

发明人： Nobuo Yamagami ,  Kunikazu Tomita ,  Yasuyuki Takada ,  Yoshihiko Oda ,  Chohachi Sato ,  Teruo Takeuchi ,  Ichiro Saito ,  Hiroaki Kato

IPC分类号： C22C3802

CPC分类号： H01F1/14775 ,  C21D8/0226 ,  C21D8/0236 ,  C21D8/0273 ,  C21D8/12 ,  C22C38/002 ,  C22C38/004 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  H01J29/867 ,  H01J2229/003

摘要： A steel sheet for preparing a heat shrink band effective for preventing the color drift is provided by a steel sheet having 24 kg/mm2 or higher of yield stress and 400 or higher of the product between the permeability &mgr; under a magnetic field of 0.3 Oe and the sheet thickness.

摘要翻译： 用于制备有效防止颜色漂移的热收缩带的钢板是由在0.3Oe的磁场和渗透率μμ之间的产品在屈服应力为24kg / mm2的钢板和400或更高的产品之间提供的， 片材厚度。

公开(公告)号：US6129992A

公开(公告)日：2000-10-10

申请号：US348227

申请日：1999-07-06

申请人： Yasuharu Sakuma ,  Satoru Tanaka ,  Kazuo Koyama ,  Yujiro Miyauchi ,  Takeshi Kubota ,  Atsushi Itami ,  Hiroaki Kato ,  Chohachi Sato ,  Teruo Takeuchi

发明人： Yasuharu Sakuma ,  Satoru Tanaka ,  Kazuo Koyama ,  Yujiro Miyauchi ,  Takeshi Kubota ,  Atsushi Itami ,  Hiroaki Kato ,  Chohachi Sato ,  Teruo Takeuchi

IPC分类号： C21D8/02 ,  C21D8/12 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  H01F1/00

CPC分类号： C22C38/004 ,  C21D8/0236 ,  C21D8/1233 ,  C21D8/1277 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C21D8/1222 ,  C21D8/1272 ,  Y10S428/90 ,  Y10S428/928 ,  Y10S428/935 ,  Y10T428/12465 ,  Y10T428/12799 ,  Y10T428/12937 ,  Y10T428/12951

摘要： Provided are a high strength cold rolled steel sheet and a high strength plated steel sheet possessing improved geomagnetic shielding properties, that is, having a high relative permeability in a d.c. magnetic field around 0.3 Oe, a process for producing the same, and an explosion-proof band or an outer magnetic shielding material, for television cathode-ray tubes, using the steel sheet. An ultra low carbon steel, which has a carbon content of not more than 0.0060% and has been subjected to solid solution strengthening utilizing silicon and magnesium without relying upon precipitation strengthening, is deoxidized with silicon so that aluminum is substantially absent in the steel. Alternatively, when the ultra low carbon steel is deoxidized with aluminum, boron is added to inhibit the precipitation of AlN. Next, the deoxidized steel is finish rolled at 750 to 980.degree. C., cold rolled with a reduction ratio of 60 to 90%, and then annealed in the temperature range of 750.degree. C. to the Ac.sub.3 point in a continuous annealing equipment or an in-line annealing type continuous galvanizing equipment to bring the ferrite grain diameter in the metallographic structure to 10 to 200 .mu.m.

摘要翻译： 本发明提供一种具有改善的地磁屏蔽性能的高强度冷轧钢板和高强度电镀钢板，即在直流电场中具有高的相对磁导率。 约0.3Oe的磁场，其制造方法，以及使用该钢板的电视阴极射线管的防爆带或外部磁屏蔽材料。 碳含量不大于0.0060％的超低碳钢，用硅和镁进行固溶强化而不依赖于析出强化，用硅进行脱氧，从而钢中基本上不存在铝。 或者，当超低碳钢用铝脱氧时，加入硼以抑制AlN的沉淀。 接着，将脱氧钢在750〜980℃精轧，以60〜90％的压下率进行冷轧，然后在连续退火设备中在750℃的温度范围内退火至Ac3点， 在线退火型连续镀锌设备使金相组织中的铁素体晶粒直径达到10〜200μm。

公开(公告)号：US07202593B2

公开(公告)日：2007-04-10

申请号：US10476403

申请日：2003-02-18

申请人： Hideki Matsuoka ,  Reiko Sugihara ,  Kenji Tahara ,  Noriko Kubo ,  Keisuke Fukumizu ,  Teruo Takeuchi ,  Hiroaki Kato

发明人： Hideki Matsuoka ,  Reiko Sugihara ,  Kenji Tahara ,  Noriko Kubo ,  Keisuke Fukumizu ,  Teruo Takeuchi ,  Hiroaki Kato

IPC分类号： H01J29/80

CPC分类号： C22C38/004 ,  B21B3/02 ,  C21D8/12 ,  C22C38/02 ,  C22C38/04 ,  H01F1/16 ,  H01J29/06 ,  H01J2229/8634

摘要： A steel sheet for an inner magnetic shield has a ratio of the anhysteretic magnetic permeability in the rolling direction to the anhysteretic magnetic permeability in the transversal direction, which is not higher than 0.7 or not lower than 1.4, preferably not higher than 0.5 or not lower than 2.0. A higher value of the two anhysteretic magnetic permeability values in the rolling direction and in the transversal direction is not lower than 18000. The inner magnetic shield formed of the particular steel sheet has a substantially truncated pyramid body which has a pair of short side members of a screen and a pair of long side members of a screen. The short side members are joined to the long side members at edge portions of the truncated pyramidal inner magnetic shield. The direction, in which the anhysteretic magnetic permeability of the steel sheet is the higher value, corresponds to the horizontal plane direction of the short side member. In addition, the direction, in which the anhysteretic magnetic permeability of the steel sheet is the higher value, corresponds to as required to the horizontal plane direction of the long side member.

摘要翻译： 内磁屏蔽用钢板的横向的非磁滞磁导率与横向的非磁滞磁导率之比为0.7以下，优选为0.7以上，优选为0.5以下， 超过2.0。 两个非磁滞磁导率值在轧制方向和横向方向上的值越高越好，不小于18000.由特定钢板形成的内磁屏蔽件具有基本截头棱锥体，该主体具有一对短边构件 屏幕和一对屏幕的长边成员。 短边构件在截顶锥形内磁屏蔽的边缘部分处连接到长边构件。 钢板的非磁滞磁导率越高的方向对应于短边部件的水平面方向。 此外，钢板的非磁滞磁导率为更高值的方向对应于长边构件的水平面方向的要求。

公开(公告)号：US5871851A

公开(公告)日：1999-02-16

申请号：US920174

申请日：1997-08-25

申请人： Keisuke Fukumizu ,  Hiroaki Kato ,  Teruo Takeuchi ,  Takahide Shimazu ,  Yasuo Sato ,  Tatsuo Amaike ,  Ryoichi Yoshihara ,  Takeshi Harada

发明人： Keisuke Fukumizu ,  Hiroaki Kato ,  Teruo Takeuchi ,  Takahide Shimazu ,  Yasuo Sato ,  Tatsuo Amaike ,  Ryoichi Yoshihara ,  Takeshi Harada

IPC分类号： C21D8/02 ,  C21D8/12 ,  H01J29/06 ,  B32B15/18

CPC分类号： H01J29/06 ,  C21D8/0236 ,  C21D8/1277 ,  C21D8/0278 ,  C21D8/1233 ,  Y10T428/12854 ,  Y10T428/12937

摘要： A 0.1 to 0.5 mm-thick plated steel sheet having high coercive force and magnetic flux density is provided by hot rolling a slab comprising by weight carbon: 0.01 to 0.09%, silicon: not more than 1.0%, phosphorus: not more than 0.3%, manganese: not more than 1.5%, sulfur: not more than 0.04%, aluminum: not more than 1.0%, and nitrogen: not more than 0.01% with the balance consisting of iron and unavoidable impurities, cold rolling the hot rolled sheet, annealing the cold rolled sheet to prepare a steel sheet having an average grain diameter of 3 to 15 .mu.m, temper rolling the steel sheet with a reduction ratio of not more than 3%, and plating the temper rolled sheet with chromium or nickel. This enables the provision of a magnetic shielding material having no significant drift and very good electron beam landing properties.

摘要翻译： 通过热轧含有重量百分比为0.01〜0.09％的硅，不超过1.0％的磷，不超过0.3％的平板，提供具有高矫顽力和磁通密度的0.1〜0.5mm厚的镀覆钢板， ，锰：不大于1.5％，硫：不大于0.04％，铝：不大于1.0％，氮：不大于0.01％，余量由铁和不可避免的杂质组成，冷轧热轧板， 对冷轧板进行退火，制备平均粒径为3〜15μm的钢板，以3％以下的压下率对钢板进行回火处理，并对铬或镍进行镀层。 这使得能够提供没有显着漂移的磁屏蔽材料和非常好的电子束着陆性能。

公开(公告)号：US08686464B2

公开(公告)日：2014-04-01

申请号：US13053525

申请日：2011-03-22

申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  H01L24/73 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.

摘要翻译： 根据一个实施例，LED模块包括衬底，互连层，发光二极管（LED）封装和反射构件。 互连层设置在基板上。 LED封装安装在互连层上。 反射构件设置在基板中未安装LED封装的区域上，具有反射从LED封装件发出的光的性质。 LED封装包括第一引线框架，第二引线框架，LED芯片和树脂体。 第一引线框架和第二引线框架在同一平面上彼此分开布置。 LED芯片设置在第一引线框架和第二引线框架的上方，其中一个端子连接到第一引线框架，另一个端子连接到第二引线框架。 所述树脂体覆盖所述LED芯片，覆盖所述第一引线框架和所述第二引线框架的上表面，下表面的一部分和端面的一部分，并且暴露所述下表面的剩余部分， 端面的剩余部分。

公开(公告)号：USD649942S1

公开(公告)日：2011-12-06

申请号：US29381737

申请日：2010-12-22

申请人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Kazuhiro Inoue ,  Teruo Takeuchi

设计人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Kazuhiro Inoue ,  Teruo Takeuchi

公开(公告)号：US20110186901A1

公开(公告)日：2011-08-04

申请号：US12875566

申请日：2010-09-03

申请人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

发明人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。

公开(公告)号：US20110186875A1

公开(公告)日：2011-08-04

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US20110186868A1

公开(公告)日：2011-08-04

申请号：US12886911

申请日：2010-09-21

申请人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi ,  Iwao Matsumoto

发明人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi ,  Iwao Matsumoto

IPC分类号： H01L33/50 ,  H01L33/62

CPC分类号： H01L24/49 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/05599 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一和第二引线框架的上方，并且具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 线将一个端子连接到第一引线框架。 树脂体覆盖第一和第二引线框架，LED芯片和导线。 第一引线框架包括基部和多个延伸部分。 从上方观察，线的接合位置位于连接两个或更多个延伸部分的根部的多边形区域之一内。 树脂体的外观是LED封装的外观的一部分。