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公开(公告)号：US5643056A
公开(公告)日：1997-07-01
申请号：US550117
申请日：1995-10-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.
摘要翻译： 用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。 相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。 结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和 设备成本
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公开(公告)号：US5616063A
公开(公告)日：1997-04-01
申请号：US309193
申请日：1994-09-20
申请人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Masako Kodera , Shirou Mishima , Atsushi Shigeta , Masayoshi Hirose , Norio Kimura , Seiji Ishikawa
发明人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Masako Kodera , Shirou Mishima , Atsushi Shigeta , Masayoshi Hirose , Norio Kimura , Seiji Ishikawa
IPC分类号： H01L21/302 , B08B1/04 , B24B27/00 , B24B37/04 , B24B37/34 , B24B51/00 , B24B55/12 , H01L21/00 , H01L21/677 , B24B49/00
CPC分类号： H01L21/67167 , B08B1/04 , B08B13/00 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67161 , H01L21/67219 , H01L21/67745
摘要： A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.
摘要翻译： 抛光装置是具有执行各种操作的多个单元的集群类型的装置。 抛光装置包括具有用于传送工件的至少一个臂的通用传送机器人，设置在通用传送机器人周围的多个单元，并且包括用于接收被抛光工件的装载单元，用于抛光工件的至少一个抛光单元 至少一个用于清洗已经被抛光的工件的洗涤单元和用于接收清洁的工件的卸载单元。 离散机构分别在单元之间传送清洁的工件和脏工件。
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公开(公告)号：US5954570A
公开(公告)日：1999-09-21
申请号：US656643
申请日：1996-05-31
申请人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Noburu Shimizu
发明人： Hiroyuki Yano , Katsuya Okumura , Norio Kimura , Noburu Shimizu
IPC分类号： B24B53/007 , B24B53/017 , B24B53/12 , H01L21/304 , B24B29/00
CPC分类号： B24B53/017 , B24B53/12
摘要： A conditioner assembly for a polishing machine includes a carrier, a conditioning element attached to the carrier, and an elastic element arranged between the conditioning element and the carrier. The conditioner assembly improves the polishing uniformity across the surface of a workpiece.
摘要翻译： 用于抛光机的调节器组件包括载体，附着到载体的调节元件和布置在调节元件和载体之间的弹性元件。 调节器组件改善了穿过工件表面的抛光均匀性。
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公开(公告)号：US5398459A
公开(公告)日：1995-03-21
申请号：US156641
申请日：1993-11-24
申请人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
发明人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
CPC分类号： B24B37/102 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.
摘要翻译： 诸如半导体晶片的工件位于转盘和顶环之间，并且当顶环被压靠在转盘上时，其通过研磨布在转盘上抛光。 顶环具有用于防止工件偏离顶环的下表面的保持环，并且保持环的内径大于工件的外径。 转台的转动使平台于转台上表面的方向向工件施加压力，使得工件的外周与保持环的内周接触，并且保持环的旋转赋予转动 使工件相对于保持环中的顶环执行行星运动。
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公开(公告)号：US5476414A
公开(公告)日：1995-12-19
申请号：US124550
申请日：1993-09-22
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B37/10 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： H01L21/02024 , B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译： 诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。 顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。 在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。 扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。
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公开(公告)号：USRE38228E1
公开(公告)日：2003-08-19
申请号：US08789304
申请日：1997-01-30
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
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公开(公告)号：USRE38878E1
公开(公告)日：2005-11-15
申请号：US08993893
申请日：1997-12-18
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
CPC分类号： B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译： 诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。 顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。 在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。 扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。
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公开(公告)号：US5384986A
公开(公告)日：1995-01-31
申请号：US124648
申请日：1993-09-22
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , B41J11/62
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
摘要翻译： 安装有研磨布的转盘和位于转盘上方的顶环可独立地可旋转地设置。 顶环保持要抛光的工件，并将工件压在研磨布上。 转盘和顶环旋转以将工件的表面抛光到研磨布上的平整镜面上。 压在研磨布上的可旋转刷子围绕基本上垂直于研磨布平面的轴线旋转，并且在磨料布的径向内部和外部位置之间基本径向摆动。 将清洁溶液从喷嘴喷射到研磨布上。 转台沿其外圆周边缘具有一个堤，用于防止当转台静止时供给磨料以保持磨料湿润并防止磨损的保护溶液流出转台。
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公开(公告)号：US5989107A
公开(公告)日：1999-11-23
申请号：US857252
申请日：1997-05-16
申请人： Noburu Shimizu , Norio Kimura
发明人： Noburu Shimizu , Norio Kimura
CPC分类号： B24B37/042 , B24B27/0023 , B24B37/07 , B24B37/10 , B24B37/11
摘要： A polishing method and a compact apparatus for the method are presented for efficient production of a polished workpiece for manufacturing high technology devices. The polishing method comprises a first and second steps for polishing a work surface. In the first polishing step, the work surface is pressed against an abrading surface of a first polishing tool which is being rotated. In the second step, the work surface is pressed against a rubbing surface of a second polishing tool which is being moved in a planar translation motion relatively to the work surface.
摘要翻译： 提出了用于该方法的抛光方法和紧凑的装置，用于有效地生产用于制造高技术装置的抛光工件。 抛光方法包括用于抛光工作表面的第一和第二步骤。 在第一抛光步骤中，将工作表面按压在正在旋转的第一抛光工具的研磨表面上。 在第二步骤中，工作表面被压在相对于工作表面平面移动运动的第二抛光工具的摩擦表面上。
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公开(公告)号：US07011569B2
公开(公告)日：2006-03-14
申请号：US10134513
申请日：2002-04-30
申请人： Noburu Shimizu , Norio Kimura
发明人： Noburu Shimizu , Norio Kimura
IPC分类号： B24B1/00
CPC分类号： B24B37/26 , B08B1/04 , B24B27/0023 , B24B37/042 , B24B37/105 , B24B37/12 , B24B37/16 , B24B37/245 , B24B37/345 , H01L21/30625 , H01L21/67173 , H01L21/67219 , H01L21/68785 , H01L21/68792
摘要： A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.
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