公开(公告)号：US06239486B1

公开(公告)日：2001-05-29

申请号：US09443434

申请日：1999-11-19

申请人： Nobutaka Shimizu ,  Takao Nishimura ,  Atsushi Kikuchi ,  Takao Akai ,  Takumi Ihara

发明人： Nobutaka Shimizu ,  Takao Nishimura ,  Atsushi Kikuchi ,  Takao Akai ,  Takumi Ihara

IPC分类号： H01L2336

CPC分类号： H01L23/055 ,  H01L23/3675 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

摘要： The semiconductor device includes a substrate, a semiconductor component, and a cap covering the semiconductor component and attached to the substrate. The cap has a top wall, a plurality of side walls 14 extending downward from the top wall and a bottom wall. Opening are provided in the side walls of the cap at corners thereof. Due to the provision of openings, the cap can be manufactured without deformation thereof. Air or liquid can flow into, or out of, the interior of the cap, after the semiconductor deviced is completed.

摘要翻译： 半导体器件包括衬底，半导体部件和覆盖半导体部件并附着到衬底的帽。 盖具有顶壁，从顶壁向下延伸的多个侧壁14和底壁。 在其角部的帽的侧壁设有开口。 由于提供开口，可以制造帽而不变形。 在半导体发电完成之后，空气或液体可以流入或离开盖的内部。

公开(公告)号：US20070192119A1

公开(公告)日：2007-08-16

申请号：US11498746

申请日：2006-08-04

申请人： Takao Akai

发明人： Takao Akai

IPC分类号： G06Q10/00 ,  G05B19/418 ,  G06F15/173

CPC分类号： G06Q10/00 ,  G06Q10/063 ,  G06Q10/10 ,  G06Q10/103 ,  Y02P90/265

摘要： There is disclosed a deliberation request allocation system, deliberation request allocation program, and deliberation request allocation method, which are capable of calling all the divisions that are related to a standard to a deliberation, when a new standard is established or an existing standard is revised. The system comprises: a state-of-use obtaining section 1 that obtains, as electronic data, a state of use including users of the standard and the numbers of uses of the standard; a use result calculation section 4 that calculates a use result of the standard, by use of electronic data, based on the state of use obtained by the state-of-use obtaining section 1; and a deliberation request allocation section 6 that decides and allocates a party deliberation request target, who should attend a deliberation to revise the standard or to establish a new standard similar to the standard, by use of electronic data, based on the use result calculated by the use result calculation section 4.

摘要翻译： 公开了一种审议请求分配制度，审议请求分配方案和审议请求分配方法，能够在建立新标准或修订现有标准时，将所有与标准相关的部门调用为审议意见 。 该系统包括：使用获取部分1，其获取包括标准的用户和标准的使用数量的电子数据的使用状态; 使用结果计算部4，其根据由使用状态获取部1获得的使用状况，使用电子数据计算标准的使用结果; 以及审议请求分配部分6，其根据以下计算的使用结果，使用电子数据来决定和分配一方审议请求目标，该目标应参加审议以修改标准或建立类似标准的新标准 使用结果计算部分4。

公开(公告)号：US06828676B2

公开(公告)日：2004-12-07

申请号：US10291497

申请日：2002-11-12

申请人： Takao Akai

发明人： Takao Akai

IPC分类号： H01L2334

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/36 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511

摘要： The present invention relates to a manufacturing method of a semiconductor device having a lid implemented on a semiconductor chip. The semiconductor device and the semiconductor device unit are capable of maintaining high thermal dissipation efficiency as well as the semiconductor chip having improved reliability. Specifically, upon manufacturing the above semiconductor device having a semiconductor chip mounted on a substrate and a lid thermally connected to this semiconductor chip, a stiffener, which controls the deformation of the semiconductor chip, is implemented on the side of the semiconductor chip that accommodates the lid; after which heating is performed so as to bond the semiconductor chip accommodating the stiffener to the substrate; followed by the bonding of the lid to the stiffener.

摘要翻译： 本发明涉及具有在半导体芯片上实现的盖的半导体器件的制造方法。 半导体器件和半导体器件单元能够保持高散热效率以及具有提高的可靠性的半导体芯片。 具体地，在制造具有安装在基板上的半导体芯片的上述半导体器件和与该半导体芯片热连接的盖子时，在半导体芯片的容纳该半导体芯片的侧面上实施控制半导体芯片的变形的加强件 盖; 之后进行加热以将容纳加强件的半导体芯片接合到基板上; 然后将盖子粘合到加强件上。

公开(公告)号：US20080066291A1

公开(公告)日：2008-03-20

申请号：US11705744

申请日：2007-02-14

申请人： Takao Akai

发明人： Takao Akai

IPC分类号： H01S4/00

CPC分类号： G06Q10/10 ,  Y10T29/49

摘要： A hazardous substance guarantee acquiring method acquires a hazardous substance guarantee of a part forming a product. The method registers information that enables a part to be specified in correspondence with information that enables judgement as to whether or not a guarantee has been acquired for the part, merges a parts table indicating parts forming the product at a designing stage and a parts table indicating parts forming the product at a manufacturing stage to create a merged parts table, judges whether or not there exists a part for which the guarantee has not been acquired, within the parts forming the product, by collating the parts indicated on the merged parts table and the parts guaranteed by the registered guarantees, and automatically requests issuance of the guarantee for the part for which the guarantee has not been acquired when it is judged that the guarantee has not been acquired for the part.

摘要翻译： 有害物质保证取得方法获得形成产品的部件的危险物质保证。 该方法记录使得能够根据能够判断是否已经获得了该部分的保证的信息来指定零件的信息，并将指示在设计阶段形成产品的零件的零件表合并在一起，并指示 在制造阶段形成产品的部件，以形成合并零件表，通过将合并零件表中指示的零件整理在一起，判断在形成产品的零件中是否存在未获得担保的零件 由担保情况所保证的部分，在判定未获得担保的情况下，自动要求发放未获得担保部分的担保。

公开(公告)号：US06347037B2

公开(公告)日：2002-02-12

申请号：US09185716

申请日：1998-11-04

申请人： Makoto Iijima ,  Tetsushi Wakabayashi ,  Toshio Hamano ,  Masaharu Minamizawa ,  Masashi Takenaka ,  Taturou Yamashita ,  Masataka Mizukoshi ,  Masaru Nukiwa ,  Takao Akai

发明人： Makoto Iijima ,  Tetsushi Wakabayashi ,  Toshio Hamano ,  Masaharu Minamizawa ,  Masashi Takenaka ,  Taturou Yamashita ,  Masataka Mizukoshi ,  Masaru Nukiwa ,  Takao Akai

IPC分类号： H05H720

CPC分类号： H01L23/10 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

摘要翻译： 半导体器件包括通过面朝下接合连接到板的上表面的板和半导体芯片。 半导体器件还包括框架状构件，其利用第一粘合剂连接到板的上表面，并且具有用于容纳半导体芯片的开口以及覆盖半导体芯片的板状构件， 框状构件，并且用第二粘合剂连接到半导体芯片和框架状构件，其中框架构件具有足够的坚固性，以防止热膨胀引起的板和板状构件的变形， 形状成员。