公开(公告)号：US06239486B1

公开(公告)日：2001-05-29

申请号：US09443434

申请日：1999-11-19

申请人： Nobutaka Shimizu ,  Takao Nishimura ,  Atsushi Kikuchi ,  Takao Akai ,  Takumi Ihara

发明人： Nobutaka Shimizu ,  Takao Nishimura ,  Atsushi Kikuchi ,  Takao Akai ,  Takumi Ihara

IPC分类号： H01L2336

CPC分类号： H01L23/055 ,  H01L23/3675 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

摘要： The semiconductor device includes a substrate, a semiconductor component, and a cap covering the semiconductor component and attached to the substrate. The cap has a top wall, a plurality of side walls 14 extending downward from the top wall and a bottom wall. Opening are provided in the side walls of the cap at corners thereof. Due to the provision of openings, the cap can be manufactured without deformation thereof. Air or liquid can flow into, or out of, the interior of the cap, after the semiconductor deviced is completed.

摘要翻译： 半导体器件包括衬底，半导体部件和覆盖半导体部件并附着到衬底的帽。 盖具有顶壁，从顶壁向下延伸的多个侧壁14和底壁。 在其角部的帽的侧壁设有开口。 由于提供开口，可以制造帽而不变形。 在半导体发电完成之后，空气或液体可以流入或离开盖的内部。

公开(公告)号：US08659168B2

公开(公告)日：2014-02-25

申请号：US12047811

申请日：2008-03-13

申请人： Takao Nishimura ,  Yoshikazu Kumagaya

发明人： Takao Nishimura ,  Yoshikazu Kumagaya

IPC分类号： H01L23/48

CPC分类号： H05K3/3452 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0594 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring board includes a main surface where an electronic component is mounted in a face-down manner so that a surface of the electronic component having plurality of external connecting terminals faces the main surface of the wiring board, the electronic component being fixed to the wiring board by an adhesive; an insulating layer formed on the main surface where the electronic component is mounted; an opening part formed in the insulating layer so that a plurality of adjacent wiring patterns are commonly and partially opened, the adjacent wiring patterns having electrodes where electrodes of the electronic component are connected; wherein an outer periphery of the opening part situated at a center side of the wiring board is formed in an oblique direction against extending directions of the wiring patterns.

摘要翻译： 电路板包括主表面，其中电子部件以正面朝下的方式安装，使得具有多个外部连接端子的电子部件的表面面向布线板的主表面，电子部件固定到布线 用粘合剂板; 形成在安装有电子部件的主表面上的绝缘层; 形成在所述绝缘层中的开口部，使得多个相邻布线图案共同且部分地开放，所述相邻布线图形具有连接所述电子部件的电极的电极; 其特征在于，所述开口部的位于所述布线基板的中心侧的外周部沿相对于所述布线图案的延伸方向的倾斜方向形成。

公开(公告)号：US08048719B2

公开(公告)日：2011-11-01

申请号：US12418906

申请日：2009-04-06

申请人： Takao Nishimura ,  Tetsuya Hiraoka

发明人： Takao Nishimura ,  Tetsuya Hiraoka

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49589 ,  H01L23/49503 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L25/16 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/0695

摘要： A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the electrode terminals. A passive component is formed such that a vertical height of each electrode terminal is higher than that of an element part. More specifically, each cross-sectional area of the electrode terminals is slightly larger than that of the element part. Therefore, an upper part and lower part of each electrode terminal are slightly higher than (project from) the element part. Through an adhesive, the passive component is fixed such that the element part is located on the high position part so as to be nearly parallel to a substrate surface. Further, a part of each electrode terminal (bottom part) is located in each space within concave parts. Thus, a predetermined space is formed between each of the electrode terminals and the die pad.

摘要翻译： 一种半导体器件，其能够防止电极端子与芯片焊盘之间的接触，并且能够可靠地对电极端子进行引线接合。 无源部件形成为使得每个电极端子的垂直高度高于元件部件的垂直高度。 更具体地，电极端子的每个横截面面积略大于元件部分的横截面面积。 因此，每个电极端子的上部和下部略高于（突出）元件部分。 通过粘合剂，被动部件被固定，使得元件部件位于高位置部分上，以便几乎平行于基板表面。 此外，每个电极端子（底部）的一部分位于凹部内的每个空间中。 因此，在每个电极端子和管芯焊盘之间形成预定的空间。

公开(公告)号：US07528460B2

公开(公告)日：2009-05-05

申请号：US11414485

申请日：2006-05-01

申请人： Takao Nishimura ,  Tetsuya Hiraoka

发明人： Takao Nishimura ,  Tetsuya Hiraoka

IPC分类号： H01L29/00 ,  H01L23/495 ,  H01L23/02

CPC分类号： H01L23/49589 ,  H01L23/49503 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L25/16 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/0695

摘要： A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the electrode terminals. A passive component is formed such that a vertical height of each electrode terminal is higher than that of an element part. More specifically, each cross-sectional area of the electrode terminals is slightly larger than that of the element part. Therefore, an upper part and lower part of each electrode terminal are slightly higher than (project from) the element part. Through an adhesive, the passive component is fixed such that the element part is located on the high position part so as to be nearly parallel to a substrate surface. Further, a part of each electrode terminal (bottom part) is located in each space within concave parts. Thus, a predetermined space is formed between each of the electrode terminals and the die pad.

摘要翻译： 一种半导体器件，其能够防止电极端子与芯片焊盘之间的接触，并且能够可靠地对电极端子进行引线接合。 无源部件形成为使得每个电极端子的垂直高度高于元件部件的垂直高度。 更具体地，电极端子的每个横截面面积略大于元件部分的横截面面积。 因此，每个电极端子的上部和下部略高于（突出）元件部分。 通过粘合剂固定无源部件，使得元件部分位于高位置部分上，以便几乎平行于基板表面。 此外，每个电极端子（底部）的一部分位于凹部内的每个空间中。 因此，在每个电极端子和管芯焊盘之间形成预定的空间。

公开(公告)号：US20080150120A1

公开(公告)日：2008-06-26

申请号：US12071628

申请日：2008-02-25

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L2221/68327 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/3012 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： In a semiconductor chip, a first semiconductor chip 21 is provided on a chip-mounting component 11, and bonding wires 36 connected to electrode pads 21E of the first semiconductor chip 21 are fixed by being covered with a first insulating adhesive 31. A second semiconductor chip 22 is mounted by being stacked on the first semiconductor chip 21, with the first insulating adhesive 31 therebetween. This structure can prevent problems such as breaking and short-circuits of bonding wires of the chip disposed directly on a substrate when another chip is mounted by being stacked.

摘要翻译： 在半导体芯片中，第一半导体芯片21设置在芯片安装部件11上，并且与第一半导体芯片21的电极焊盘21E连接的接合线36被第一绝缘胶31覆盖。 第二半导体芯片22通过堆叠在第一半导体芯片21上而第一绝缘粘合剂31在其间安装。 这种结构可以防止当通过堆叠安装另一个芯片时直接设置在基板上的芯片的接合线的断裂和短路等问题。

公开(公告)号：US20080023831A1

公开(公告)日：2008-01-31

申请号：US11643836

申请日：2006-12-22

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48487 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4917 ,  H01L2224/49426 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2224/85181 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/4554

摘要： To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.

摘要翻译： 为了提供防止相邻导线之间的接触以提高布线布局设计的灵活性的小型高性能半导体器件，以及制造半导体器件的有效方法。 半导体器件包括其表面上布置有电极21A的衬底10; 以及第一半导体元件11A，其包括布置在其表面上并由衬底10支撑的电极22，其中第一线41通过第一凸块31连接到衬底10上的至少一个电极和半导体 元件11A（即，电极21和22中的至少一个），第二导线42通过第二凸块32连接到导线41的接合部分。

公开(公告)号：US07292940B2

公开(公告)日：2007-11-06

申请号：US10784201

申请日：2004-02-24

申请人： Akira Isogai ,  Eiji Teramura ,  Takao Nishimura

发明人： Akira Isogai ,  Eiji Teramura ,  Takao Nishimura

IPC分类号： B60T7/12

CPC分类号： B60T7/22 ,  B60T17/221

摘要： In a vehicle control system performing collision avoiding control when a collision with a preceding vehicle cannot be avoided by normal running condition control, driving safety is improved by prompting a driver to intervene in the vehicle's control in a reliable manner. When a set switch is turned on in the “cancel” state, the transition to the “in-control, inter-vehicle distance control” sub-state occurs and an inter-vehicle distance control is performed. If a collision with a preceding vehicle cannot be avoided by the inter-vehicle distance control (if the collision alarm flag XA=1), transition to the “in-control, collision alarm” sub-state occurs and a collision alarm is generated. If the acceleration required for avoiding collision is further increased (if the collision avoiding control flag XC=1), the state transits to the “in-control, collision avoiding control” sub-state, and a collision avoiding control is performed.

摘要翻译： 在通过正常行驶状态控制不能避免与前方车辆的碰撞时进行碰撞避免控制的车辆控制系统中，通过促使驾驶员可靠地介入车辆的控制来提高驾驶安全性。 当在“取消”状态下接通设定开关时，发生向“控制中车间距离控制”的状态的转变，并进行车间距离控制。 如果通过车间距离控制（如果碰撞报警标志XA = 1）不能避免与前一车辆的碰撞，则发生向“控制中的碰撞报警”子状态的转变，产生碰撞报警。 如果避免碰撞所需的加速度进一步增加（如果碰撞避免控制标志XC = 1），则状态转换到“控制中，防碰撞控制”子状态，进行碰撞避免控制。

公开(公告)号：US20070170600A1

公开(公告)日：2007-07-26

申请号：US11414485

申请日：2006-05-01

申请人： Takao Nishimura ,  Tetsuya Hiraoka

发明人： Takao Nishimura ,  Tetsuya Hiraoka

IPC分类号： H01L21/44

CPC分类号： H01L23/49589 ,  H01L23/49503 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L25/16 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/0695

摘要： A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the electrode terminals. A passive component is formed such that a vertical height of each electrode terminal is higher than that of an element part. More specifically, each cross-sectional area of the electrode terminals is slightly larger than that of the element part. Therefore, an upper part and lower part of each electrode terminal are slightly higher than (project from) the element part. Through an adhesive, the passive component is fixed such that the element part is located on the high position part so as to be nearly parallel to a substrate surface. Further, a part of each electrode terminal (bottom part) is located in each space within concave parts. Thus, a predetermined space is formed between each of the electrode terminals and the die pad.

摘要翻译： 一种半导体器件，其能够防止电极端子与芯片焊盘之间的接触，并且能够可靠地对电极端子进行引线接合。 无源部件形成为使得每个电极端子的垂直高度高于元件部件的垂直高度。 更具体地，电极端子的每个横截面面积略大于元件部分的横截面面积。 因此，每个电极端子的上部和下部略高于（突出）元件部分。 通过粘合剂固定无源部件，使得元件部分位于高位置部分上，以便几乎平行于基板表面。 此外，每个电极端子（底部）的一部分位于凹部内的每个空间中。 因此，在每个电极端子和管芯焊盘之间形成预定的空间。

公开(公告)号：US20060289972A1

公开(公告)日：2006-12-28

申请号：US11474406

申请日：2006-06-26

申请人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

发明人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

IPC分类号： H01L23/495

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17107 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。

公开(公告)号：US20050167812A1

公开(公告)日：2005-08-04

申请号：US11062735

申请日：2005-02-23

申请人： Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

发明人： Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

IPC分类号： H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L23/522 ,  H01L25/065 ,  H01L29/76

CPC分类号： H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/13008 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

摘要翻译： 提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。 在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。 通过蚀刻形成孔，电极焊盘用作蚀刻停止层。 埋入电极形成在孔中。 该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。