公开(公告)号：US06239486B1

公开(公告)日：2001-05-29

申请号：US09443434

申请日：1999-11-19

申请人： Nobutaka Shimizu ,  Takao Nishimura ,  Atsushi Kikuchi ,  Takao Akai ,  Takumi Ihara

发明人： Nobutaka Shimizu ,  Takao Nishimura ,  Atsushi Kikuchi ,  Takao Akai ,  Takumi Ihara

IPC分类号： H01L2336

CPC分类号： H01L23/055 ,  H01L23/3675 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

摘要： The semiconductor device includes a substrate, a semiconductor component, and a cap covering the semiconductor component and attached to the substrate. The cap has a top wall, a plurality of side walls 14 extending downward from the top wall and a bottom wall. Opening are provided in the side walls of the cap at corners thereof. Due to the provision of openings, the cap can be manufactured without deformation thereof. Air or liquid can flow into, or out of, the interior of the cap, after the semiconductor deviced is completed.

摘要翻译： 半导体器件包括衬底，半导体部件和覆盖半导体部件并附着到衬底的帽。 盖具有顶壁，从顶壁向下延伸的多个侧壁14和底壁。 在其角部的帽的侧壁设有开口。 由于提供开口，可以制造帽而不变形。 在半导体发电完成之后，空气或液体可以流入或离开盖的内部。

公开(公告)号：US06875638B2

公开(公告)日：2005-04-05

申请号：US10100011

申请日：2002-03-19

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/36 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K1/16 ,  H01L21/44

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

摘要翻译： 包含无源元件的半导体器件的制造方法包括以下步骤：再分布板形成步骤在基板上形成包含无源元件的再分布板; 半导体元件安装步骤安装相对于基板在形成在再分布板的相对侧表面上的至少一个半导体元件; 基板分离步骤将基板与再分布板分离并暴露再分布板的另一个表面; 再分布板安装步骤通过从再分布板的另一表面暴露的电极焊盘将再分布板安装在封装板上。

公开(公告)号：US20080261336A1

公开(公告)日：2008-10-23

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/66 ,  H01L21/56

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US06995044B2

公开(公告)日：2006-02-07

申请号：US10650692

申请日：2003-08-29

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

公开(公告)号：US06794273B2

公开(公告)日：2004-09-21

申请号：US10331560

申请日：2002-12-31

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L2178

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

公开(公告)号：US06566748B1

公开(公告)日：2003-05-20

申请号：US09615728

申请日：2000-07-13

申请人： Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaharu Minamizawa

发明人： Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaharu Minamizawa

IPC分类号： H01L2312

CPC分类号： H01L23/06 ,  H01L21/563 ,  H01L23/04 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105

摘要： A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than about 20 GPa and a thermal conductivity exceeding about 100 W/(m·K).

摘要翻译： BGA半导体器件包括在其上承载有面朝下状态的半导体芯片的封装基板和覆盖封装基板上的半导体芯片的盖构件，其中该盖构件具有小于约20GPa的优化的杨氏模量和导热系数 超过100W /（mK）。

公开(公告)号：US07754534B2

公开(公告)日：2010-07-13

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US20190283431A1

公开(公告)日：2019-09-19

申请号：US16356561

申请日：2019-03-18

申请人： Atsushi Kikuchi

发明人： Atsushi Kikuchi

IPC分类号： B41J2/165

摘要： A head cleaning device includes a first wiping member, a first drive mechanism, a second wiping member, a second drive mechanism, a common drive source, and control circuitry. The first wiping member wipes a nozzle face of each of a plurality of liquid discharge heads. The first drive mechanism moves the first wiping member to a first wiping position at which the first wiping member wipes the nozzle face and a first retraction position spaced apart from the nozzle face. The second wiping member wipes the nozzle face. The second drive mechanism moves the second wiping member to a second wiping position at which the second wiping member wipes the nozzle face and a second retraction position spaced apart from the nozzle face. The common drive source drives the first drive mechanism and the second drive mechanism. The control circuitry controls the common drive source.

公开(公告)号：US09102191B2

公开(公告)日：2015-08-11

申请号：US14054108

申请日：2013-10-15

申请人： Toshiki Yamada ,  Ken Takenouchi ,  Atsushi Kikuchi

发明人： Toshiki Yamada ,  Ken Takenouchi ,  Atsushi Kikuchi

IPC分类号： B44C1/22 ,  B44C1/00 ,  B44C1/18 ,  B32B1/02 ,  B32B3/26 ,  B32B7/02 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B65D1/02 ,  B32B33/00 ,  G02B1/04 ,  F21V8/00 ,  G02B3/00 ,  B32B38/06 ,  B32B37/14

CPC分类号： B44C1/228 ,  B32B1/02 ,  B32B3/26 ,  B32B7/02 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B33/00 ,  B32B38/06 ,  B32B2037/148 ,  B32B2250/24 ,  B32B2250/42 ,  B32B2307/402 ,  B32B2307/4026 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/418 ,  B32B2307/558 ,  B32B2307/704 ,  B32B2439/06 ,  B32B2439/60 ,  B32B2553/00 ,  B44C1/005 ,  B44C1/18 ,  B44C1/22 ,  B65D1/0215 ,  G02B1/04 ,  G02B3/0012 ,  G02B6/0065 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/1379 ,  Y10T428/24942

摘要： In a method for decorating a plastic package, on at least a part of a surface of the plastic package, portions which are different in optical characteristics from the surface are periodically arranged to decorate the surface.

摘要翻译： 在用于装饰塑料包装的方法中，在塑料包装的表面的至少一部分上，周期性地布置与表面不同的光学特性的部分以装饰表面。

公开(公告)号：US09045310B2

公开(公告)日：2015-06-02

申请号：US14020961

申请日：2013-09-09

申请人： Kiyoshi Hata ,  Keisuke Sugiyama ,  Atsushi Kikuchi ,  Tomomichi Hoshino ,  Mamoru Kambayashi ,  Shohichi Satoh ,  Makoto Hidaka ,  Satoshi Saito

发明人： Kiyoshi Hata ,  Keisuke Sugiyama ,  Atsushi Kikuchi ,  Tomomichi Hoshino ,  Mamoru Kambayashi ,  Shohichi Satoh ,  Makoto Hidaka ,  Satoshi Saito

IPC分类号： B65H45/12 ,  B65H45/04 ,  B31F1/00 ,  B65H37/06 ,  B65H37/04 ,  B65H45/18

CPC分类号： B65H45/12 ,  B31F1/00 ,  B31F1/0035 ,  B65H37/04 ,  B65H37/06 ,  B65H45/04 ,  B65H45/18 ,  B65H2301/51232 ,  B65H2701/13212 ,  B65H2801/27

摘要： A sheet processing apparatus includes: a folding unit that folds a sheet bundle; a pressing unit that presses a fold part of the sheet bundle, which has been folded by the folding unit, in a thickness direction of the sheet bundle to enhance folding of the fold part; and a moving unit that advances and returns the pressing unit in a width direction of the sheet bundle. The pressing unit starts pressing from a predetermined position in the width direction of the sheet bundle during advancing movement, and releases pressing after going past one end of the sheet bundle. The pressing unit starts pressing from the predetermined position during return movement and goes past the other end of the sheet bundle.

摘要翻译： 一种片材处理设备包括：折叠片材捆的折叠单元; 挤压单元，其在片材摞的厚度方向上按压由折叠单元折叠的片材摞的折叠部分，以增强折叠部分的折叠; 以及移动单元，其在片材摞的宽度方向上前进并返回按压单元。 按压单元在推进运动期间从片材束的宽度方向上的预定位置开始按压，并且在经过片材束的一端之后释放按压。 按压单元在返回移动期间从预定位置开始按压，并且越过纸摞的另一端。