公开(公告)号：US09960204B2

公开(公告)日：2018-05-01

申请号：US15272913

申请日：2016-09-22

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: H01Q13/02 ,  H01L27/146 ,  H01L21/762 ,  H01L23/66 ,  H01Q23/00 ,  H01P11/00 ,  H01L31/18 ,  H01L23/055 ,  H01L23/14 ,  H01L23/00

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

公开(公告)号：US20170018597A1

公开(公告)日：2017-01-19

申请号：US15272913

申请日：2016-09-22

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: H01L27/146 ,  H01P11/00 ,  H01Q13/02 ,  H01L31/18

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选，仅允许已知的芯片集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。

公开(公告)号：US09478458B2

公开(公告)日：2016-10-25

申请号：US14149965

申请日：2014-01-08

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: H01Q13/02 ,  H01L21/762 ,  H01L23/66 ,  H01Q23/00 ,  H01L23/055 ,  H01L23/14 ,  H01P11/00 ,  H01L23/00

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选，仅允许已知的芯片集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。

公开(公告)号：US09054500B2

公开(公告)日：2015-06-09

申请号：US13865921

申请日：2013-04-18

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Patty Chang-Chien ,  Kelly Jill Hennig ,  Xianglin Zeng ,  Jeffrey M. Yang

IPC: H01T4/16 ,  H03G11/00 ,  H01P1/14 ,  H01L23/60

CPC classification number: H01T4/16 ,  H01L23/60 ,  H01L2924/0002 ,  H01P1/14 ,  H03G11/002 ,  H03G11/004 ,  H01L2924/00

Abstract: A plasma power limiter fabricated using wafer-level fabrication techniques with other circuit elements. The plasma limiter includes a signal substrate and a trigger substrate defining a hermetically sealed cavity therebetween in which is encapsulated an ionizable gas. The signal substrate includes a signal line within the cavity and the trigger substrate includes at least one trigger probe extending from the trigger substrate towards the transmission line. If a signal propagating on the transmission line exceeds a power threshold, the gas within the cavity is ionized creating a conduction path between the transmission line and the trigger probe that draws off the high power current.

Abstract translation: 使用晶圆级制造技术与其他电路元件制造的等离子体功率限制器。 等离子体限制器包括信号基板和触发基板，其在其间限定密封腔，其中封装有可电离气体。 信号衬底包括腔内的信号线，并且触发衬底包括从触发衬底朝向传输线延伸的至少一个触发探针。 如果在传输线上传播的信号超过功率阈值，则空腔内的气体被电离，在传输线和触发探头之间产生一个导通路径，从而消除高功率电流。

公开(公告)号：US20140254979A1

公开(公告)日：2014-09-11

申请号：US14149965

申请日：2014-01-08

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: G02B6/42 ,  G02B6/13 ,  H01L21/762

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选，仅允许已知的芯片集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。