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11 条记录 (耗时 0.02 秒)

    MANUFACTURING METHOD FOR HYDROFLUOROOLEFIN OR FLUOROOLEFIN
    2.
    发明申请
    MANUFACTURING METHOD FOR HYDROFLUOROOLEFIN OR FLUOROOLEFIN 有权

    公开(公告)号：US20230014347A1

    公开(公告)日：2023-01-19

    申请号：US17895529

    申请日：2022-08-25

    申请人： DAIKIN INDUSTRIES, LTD. ,  OSAKA UNIVERSITY

    发明人： Yuuta HASUMOTO ,  Tatsuya TAKAKUWA ,  Osamu YAMAMOTO ,  Hideki NAKAYA ,  Masao NOUMI ,  Kazuyuki SATOU ,  Kohei YAMANOI ,  Akihiro OSHIMA

    IPC分类号： C07C17/278

    摘要： This disclosure provides a method for producing a hydrofluoroolefin (HFO) or fluoroolefin (FO), which is a target compound, with high selectivity, without requiring a high temperature and a catalyst in a synthesis process of the target compound. Specifically, the present disclosure provides a method for producing a hydrofluoroolefin or fluoroolefin having two, three, or four carbon atoms, comprising irradiating at least one starting material compound selected from the group consisting of hydrofluorocarbons having one or two carbon atoms and hydrofluoroolefin As having two or three carbon atoms with ionizing radiation and/or an ultraviolet ray having a wavelength of 300 nm or less, with the proviso that when the at least one starting material compound is the hydrofluoroolefin A, the resulting hydrofluoroolefin is different from the hydrofluoroolefin A.

    METHOD FOR PRODUCING LOW-MOLECULAR-WEIGHT POLYTETRAFLUOROETHYLENE
    3.
    发明申请
    METHOD FOR PRODUCING LOW-MOLECULAR-WEIGHT POLYTETRAFLUOROETHYLENE 有权

    公开(公告)号：US20210347953A1

    公开(公告)日：2021-11-11

    申请号：US17259859

    申请日：2019-07-12

    申请人： OSAKA UNIVERSITY ,  DAIKIN INDUSTRIES, LTD.

    发明人： Akihiro OSHIMA ,  Takayuki TANAKA ,  Hideki NAKAYA ,  Kazuyuki SATOH ,  Ryosuke SENBA

    IPC分类号： C08J3/28 ,  C08F8/50 ,  C08F114/26

    摘要： Provided is a method for producing low-molecular-weight polytetrafluoroethylene which is less likely to generate C6-C14 perfluorocarboxylic acids and salts thereof. The disclosure relates to a method for producing low-molecular-weight polytetrafluoroethylene having a melt viscosity at 380° C. of 1.0×102 to 7.0×105 Pa·s. The method includes (1) irradiating high-molecular-weight polytetrafluoroethylene with radiation in a substantially oxygen-free state and decomposing the high-molecular-weight polytetrafluoroethylene into a low-molecular-weight component and (2) deactivating, in a substantially oxygen-free state, at least part of main-chain radicals and end radicals generated by the irradiation and providing the low-molecular-weight polytetrafluoroethylene.

    MICROSTRUCTURAL MATERIALS AND FABRICATION METHOD THEREOF
    6.
    发明申请
    MICROSTRUCTURAL MATERIALS AND FABRICATION METHOD THEREOF 审中-公开
    微结构材料及其制造方法

    公开(公告)号：US20160193756A1

    公开(公告)日：2016-07-07

    申请号：US15072640

    申请日：2016-03-17

    申请人： DAIKIN INDUSTRIES, LTD.

    发明人： Akihiro OSHIMA ,  Seiichi TAGAWA ,  Masakazu WASHIO ,  Tomoko OYAMA ,  Tomohiro TAKAHASHI ,  Satoshi OKUBO ,  Akinobu KOBAYASHI ,  Naotsugu NAGASAWA ,  Mitsumasa TAGUCHI

    IPC分类号： B29C35/08 ,  B29C39/38 ,  B29C39/02

    CPC分类号： B29C35/0866 ,  B29C39/026 ,  B29C39/38 ,  B29C2035/0844 ,  B29C2035/085 ,  B29C2035/0872 ,  B29C2035/0877 ,  B29C2035/0883 ,  B29K2027/18 ,  B29L2031/767 ,  B81C99/0085 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479

    摘要： There are provided a microstructural material allowing a concavo-convex pattern of a mold to be imprinted thereon by hardening a pattern formative layer through an unprecedented method, and a fabrication method thereof. A PTFE dispersion liquid is used in a pattern formative layer 2a forming an imprint section 2, thereby allowing such pattern formative layer 2a formed on a concavo-convex pattern of a mold 5 to be hardened when irradiated with an ionizing radiation. Accordingly, the fabrication method of a microstructural material 1 of the present invention employs an imprinting method allowing the pattern formative layer 2a to be hardened through an ionizing radiation R, which is completely different from a thermal imprinting and an optical imprinting. That is, the pattern formative layer 2a can be hardened, and the concavo-convex pattern of the mold 5 can thus be imprinted thereon, through an unprecedented method.

    摘要翻译： 提供了通过前所未有的方法硬化图案形成层，允许模具的凹凸图案印刷在其上的微结构材料及其制造方法。 在形成压印部分2的图案形成层2a中使用PTFE分散液，从而允许在用电离辐射照射时使形成在模具5的凹凸图案上的图案形成层2a硬化。 因此，本发明的微结构材料1的制造方法采用压印方法，允许图案形成层2a通过与热压印和光学印记完全不同的电离辐射R硬化。 也就是说，图案形成层2a可以被硬化，并且可以通过前所未有的方法将模具5的凹凸图案印刷在其上。

    SUBSTRATE TREATMENT SYSTEM
    7.
    发明申请
    SUBSTRATE TREATMENT SYSTEM 有权
    基板处理系统

    公开(公告)号：US20170031245A1

    公开(公告)日：2017-02-02

    申请号：US15106915

    申请日：2014-12-15

    申请人： Tokyo Electron Limited ,  Osaka University

    发明人： Seiji NAGAHARA ,  Gousuke SHIRAISHI ,  Satoru SHIMURA ,  Kousuke YOSHIHARA ,  Shinichiro KAWAKAMI ,  Masaru TOMONO ,  Seiichi TAGAWA ,  Akihiro OSHIMA

    IPC分类号： G03F7/20 ,  H01L21/67

    CPC分类号： G03F7/2004 ,  G03F7/20 ,  H01L21/67098 ,  H01L21/67115 ,  H01L21/67196 ,  H01L21/67225

    摘要： A substrate treatment system for treating a substrate, includes: a treatment station in which a plurality of treatment apparatuses which treat the substrate are provided; an interface station which directly or indirectly delivers the substrate between an exposure apparatus which is provided outside the substrate treatment system and performs exposure of patterns on a resist film on the substrate, and the substrate treatment system; a light irradiation apparatus which performs post-exposure using UV light on the resist film on the substrate after the exposure of patterns is performed; and a post-exposure station which houses the light irradiation apparatus and is adjustable to a reduced pressure or inert gas atmosphere, wherein the post-exposure station is connected to the exposure apparatus directly or indirectly via a space which is adjustable to a reduced pressure or inert gas atmosphere.

    摘要翻译： 一种用于处理基板的基板处理系统，包括：设置有多个处理基板的处理装置的处理台; 接口站，其在设置在基板处理系统之外的曝光装置之间直接或间接地传送基板，并且在基板上的抗蚀剂膜上进行图案的曝光;以及基板处理系统; 执行曝光图案之后，使用UV光对基板上的抗蚀剂膜进行后曝光的光照射装置; 以及容纳光照射装置并且可以减压或惰性气体气氛调节的后曝光站，其中后曝光站通过可调节到减压的空间直接或间接连接到曝光装置，或 惰性气体气氛。

    PATTERN-FORMING METHOD
    8.
    发明申请
    PATTERN-FORMING METHOD 有权
    图案形成方法

    公开(公告)号：US20170052450A1

    公开(公告)日：2017-02-23

    申请号：US15241315

    申请日：2016-08-19

    申请人： OSAKA UNIVERSITY ,  TOKYO ELECTRON LIMITED

    发明人： Hisashi NAKAGAWA ,  Takehiko NARUOKA ,  Tomoki NAGAI ,  Seiichi TAGAWA ,  Akihiro OSHIMA ,  Seiji NAGAHARA

    IPC分类号： G03F7/20 ,  G03F7/039 ,  G03F7/32 ,  G03F7/16 ,  G03F7/38

    CPC分类号： G03F7/2022 ,  G03F7/0397 ,  G03F7/162 ,  G03F7/2032 ,  G03F7/30 ,  G03F7/322 ,  G03F7/38

    摘要： A pattern-forming method comprises applying a chemically amplified resist material on an antireflective film formed on a substrate to form a resist material film. The resist material film is patternwise exposed to ionizing radiation or nonionizing radiation having a wavelength of no greater than 400 nm. The resist material film patternwise exposed is floodwise exposed to nonionizing radiation having a wavelength greater than the nonionizing radiation for the patternwise exposing and greater than 200 nm. The resist material film floodwise exposed is baked. The resist material film baked is developed with a developer solution. An extinction coefficient of the antireflective film for the nonionizing radiation employed for the floodwise exposing is no less than 0.1. The chemically amplified resist material comprises a base component and a generative component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure.

    摘要翻译： 图案形成方法包括在形成在基板上的抗反射膜上施加化学放大的抗蚀剂材料以形成抗蚀剂材料膜。 抗蚀剂材料膜图案地暴露于波长不大于400nm的电离辐射或非离子化辐射。 图案曝光的抗蚀剂材料膜被洪泛地暴露于波长大于用于图案曝光的非离子化辐射的波长的大于200nm的非离子化辐射。 烘烤曝光的抗蚀剂材料膜。 用显影剂溶液显影烘烤的抗蚀剂材料膜。 用于液体曝光的非离子辐射防反射膜的消光系数不小于0.1。 化学放大抗蚀剂材料包括能够在曝光时产生辐射敏感敏化剂和酸的基础成分和生成成分。

    RESIST PATTERNING METHOD, LATENT RESIST IMAGE FORMING DEVICE, RESIST PATTERNING DEVICE, AND RESIST MATERIAL
    9.
    发明申请
    RESIST PATTERNING METHOD, LATENT RESIST IMAGE FORMING DEVICE, RESIST PATTERNING DEVICE, AND RESIST MATERIAL 审中-公开

    公开(公告)号：US20180231892A1

    公开(公告)日：2018-08-16

    申请号：US15956214

    申请日：2018-04-18

    申请人： OSAKA UNIVERSITY

    发明人： Seiichi TAGAWA ,  Akihiro OSHIMA

    IPC分类号： G03F7/20 ,  G03F7/38 ,  G03F7/32

    摘要： A resist patterning method according to the present invention includes: a resist layer forming step S101 of forming a resist layer (12) on a substrate (11); an activating step S103 of activating the resist layer by irradiation with an activating energy beam; a decay inhibiting step S105 of inhibiting decay of the activity of the resist layer; a latent pattern image forming step S107 of forming a latent pattern image in the activated resist layer by irradiation with a latent image forming energy beam; and a developing step S110 of developing the resist layer.