公开(公告)号：US20170263830A1

公开(公告)日：2017-09-14

申请号：US15509507

申请日：2015-09-08

Applicant: OSRAM OPTO Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Günter Spath

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/62 ,  H01L33/48

CPC classification number: E05F15/73 ,  E05F15/40 ,  E05F2015/765 ,  E05Y2400/54 ,  E05Y2800/352 ,  E05Y2900/10 ,  E06B9/11 ,  E06B9/171 ,  E06B2009/6836 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/44 ,  H01L33/486 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73215 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.

公开(公告)号：US10276762B2

公开(公告)日：2019-04-30

申请号：US15509507

申请日：2015-09-08

Applicant: OSRAM OPTO Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Günter Spath

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/44 ,  H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L33/56

CPC classification number: H01L33/58 ,  E05F15/40 ,  E05F15/73 ,  E05F2015/765 ,  E05Y2400/54 ,  E05Y2800/352 ,  E05Y2900/10 ,  E06B9/11 ,  E06B9/171 ,  E06B2009/6836 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/44 ,  H01L33/486 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73215 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.

公开(公告)号：US20180114883A1

公开(公告)日：2018-04-26

申请号：US15565523

申请日：2016-04-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Richter ,  Martin Brandl ,  Markus Burger ,  Günter Spath

IPC: H01L33/50

CPC classification number: H01L33/50 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0091

Abstract: A converter component for an opto-electronic lighting device includes an auxiliary carrier, wherein a layer stack including a base layer and a converter layer is formed on a surface of the auxiliary carrier. An opto-electronic lighting device includes a light-emitting semiconductor component and the converter component for an opto-electronic light device including an auxiliary carrier, wherein a layer stack including a base layer and a converter layer is formed on a surface of the auxiliary carrier with a removed auxiliary carrier.

公开(公告)号：US11824143B2

公开(公告)日：2023-11-21

申请号：US17285905

申请日：2019-10-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Günter Spath ,  Daniel Leisen ,  Simon Jerebic ,  Matthias Kiessling

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L33/502 ,  H01L33/56 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0091

Abstract: In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.

公开(公告)号：US20210376199A1

公开(公告)日：2021-12-02

申请号：US17285905

申请日：2019-10-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Günter Spath ,  Daniel Leisen ,  Simon D. Jerebic ,  Matthias Kiessling

IPC: H01L33/50 ,  H01L33/56

Abstract: In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.

公开(公告)号：US20180166614A1

公开(公告)日：2018-06-14

申请号：US15571084

申请日：2016-05-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Richter ,  Martin Brandl ,  Markus Burger ,  Günter Spath

IPC: H01L33/50 ,  B29D11/00

CPC classification number: H01L33/505 ,  B29D11/00798 ,  B29K2083/00 ,  B29K2105/16 ,  G02B5/0242 ,  H01L33/507 ,  H01L33/56 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091

Abstract: A method of producing a converter component for an optoelectronic lighting apparatus includes forming a layer stack having an injection-molded or extruded conversion layer and an injection-molded or extruded diffuser layer. A converter component for an optoelectronic lighting apparatus includes a layer stack including an injection-molded or extruded conversion layer, and an injection-molded or extruded diffuser layer.

公开(公告)号：US09978916B2

公开(公告)日：2018-05-22

申请号：US15509507

申请日：2015-09-08

Applicant: OSRAM OPTO Semiconductors GmbH

Inventor： David Racz ,  Michael Zitzlsperger ,  Günter Spath

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/44 ,  H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L33/56

Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.