公开(公告)号：US20190157524A1

公开(公告)日：2019-05-23

申请号：US16240584

申请日：2019-01-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus PINDL ,  Thomas SCHWARZ ,  Frank SINGER ,  Sandra SOBCZYK

IPC: H01L33/54 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L21/568 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US20170002988A1

公开(公告)日：2017-01-05

申请号：US15113017

申请日：2015-01-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Sandra SOBCZYK ,  Frank SINGER ,  Wolfgang MÖNCH ,  Matthias SABATHIL

IPC: F21K9/64 ,  F21V3/02

CPC classification number: F21K9/64 ,  F21K9/61 ,  F21K9/90 ,  F21V3/02 ,  F21V5/043 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: The invention relates to a lighting means (1), comprising: an optical element (3), which has a main extension direction (Z), a radiation inlet surface (3a), and a radiation outlet surface (3b); and at least two light-emitting diodes (2), which each comprise at least one light-emitting diode chip (21) and a radiation passage surface (2a), which extends along a main extension plane (XZ); wherein the at least two lighting-emitting diodes (2) are arranged along the main extension direction (Z) of the optical element. (3), the radiation inlet surface (3a) of the optical element (3) faces the radiation passage surfaces (2a) of the at least two light-emitting diodes (2), the optical element (3) is formed as a solid body, the radiation inlet surface (3a) of the optical element (3) is flat or convexly curved, and the radiation outlet surface (3b) of the optical element (3) comprises at least one recess (4) in the optical element (3).

Abstract translation: 本发明涉及一种照明装置（1），包括：具有主延伸方向（Z），辐射入口表面（3a）和辐射出射表面（3b）的光学元件（3） 和至少两个发光二极管（2），每个发光二极管（2）分别包括至少一个沿着主延伸面（XZ）延伸的发光二极管芯片（21）和辐射通道表面（2a）; 其中所述至少两个发光二极管（2）沿着所述光学元件的主延伸方向（Z）布置。 （3）中，所述光学元件（3）的所述辐射入射面（3a）面向所述至少两个发光二极管（2）的所述辐射通路面（2a），所述光学元件（3）形成为固体 光学元件（3）的辐射入口表面（3a）是平坦的或凸起的，并且光学元件（3）的辐射出射表面（3b）包括在光学元件（3）中的至少一个凹部（4） 3）。

公开(公告)号：US20160293812A1

公开(公告)日：2016-10-06

申请号：US15036413

申请日：2014-10-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Markus PINDL ,  Thomas SCHWARZ ,  Frank SINGER ,  Sandra SOBCZYK

IPC: H01L33/54 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L21/568 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

Abstract translation: 本发明涉及一种用于制造多个光电子半导体元件的方法，包括以下步骤：制备在横向彼此间隔开的多个半导体芯片; 形成壳体主体组件，其至少一个区域布置在所述半导体芯片之间; 形成多个圆角，每个圆角相邻半导体芯片，并且由每个半导体芯片和壳体主体组件的侧表面沿横向方向界定; 并且将所述壳体主体组件分离成多个光电子部件，每个部件具有至少一个半导体芯片和所述壳体主体组件的一部分作为壳体主体，并且每个半导体芯片不被所述壳体的材料覆盖在辐射 该表面与安装表面相对的半导体部件的发射表面。 本发明还涉及半导体部件。