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    MULTI-PIXEL DISPLAY DEVICE
    5.
    发明申请
    MULTI-PIXEL DISPLAY DEVICE 有权

    公开(公告)号：US20210384170A1

    公开(公告)日：2021-12-09

    申请号：US17289114

    申请日：2019-11-08

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas SCHWARZ ,  Frank SINGER

    IPC: H01L25/075 ,  H01L33/58 ,  H01L33/10 ,  H01L33/62

    Abstract: A multi-pixel display device with an integrated circuit, a plurality of light-emitting semiconductor chips disposed on the integrated circuit, a display area having a plurality of pixels, each of the light-emitting semiconductor chips being associated with one of the pixels, a light-directing element disposed between the plurality of light-emitting semiconductor chips and the display area and adapted to direct the light of each light-emitting semiconductor chip from the plurality of light-emitting semiconductor chips to its associated pixel.

    LIGHTING MODULE
    7.
    发明申请
    LIGHTING MODULE 审中-公开

    公开(公告)号：US20180197841A1

    公开(公告)日：2018-07-12

    申请号：US15328007

    申请日：2015-07-07

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tony ALBRECHT ,  Tamas LAMFALUSI ,  Roland SCHULZ ,  Frank SINGER ,  Matthias SABATHIL

    IPC: H01L25/075 ,  H01L33/60

    CPC classification number: H01L25/0753 ,  F21K9/64 ,  H01L33/405 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: The invention relates to a lighting module (1) comprising an assembly body (3) extending between a rear side (31) and a front side (30) opposite the rear side, and comprising a plurality of semiconductor components (2) provided for generating radiation, wherein: the assembly body has a plurality of recesses (35) on the rear side, in which the semiconductor components are arranged; the assembly body is permeable to the radiation generated in the semiconductor components, and said radiation passes out of the front side of the assembly body; a contact layer (5) is arranged on the rear side of the assembly body, to which the semiconductor components are connected in an electrically conductive manner via connecting lines; and a reflector layer (6) is arranged on the rear side of the assembly body, said reflector layer entirely covering at least the recesses.

    SEMICONDUCTOR COMPONENT, LIGHTING DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
    9.
    发明申请
    SEMICONDUCTOR COMPONENT, LIGHTING DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT 有权
    半导体元件，照明器件及制造半导体元件的方法

    公开(公告)号：US20170077070A1

    公开(公告)日：2017-03-16

    申请号：US15310428

    申请日：2015-03-31

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas SCHWARZ ,  Frank SINGER ,  Juergen MOOSBURGER ,  Georg BOGNER ,  Herbert BRUNNER ,  Matthias SABATHIL ,  Norwin VON MALM

    IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L24/25 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

    Abstract: The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a moulded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the moulded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.

    Abstract translation: 本发明涉及一种半导体部件（1），包括：多个半导体芯片（2），每个具有半导体层序列（200），具有用于产生辐射的有源区（20） 辐射输出侧（10），其平行于有源区域（20）延伸; 安装侧表面（11），其设置用于固定所述半导体部件，并且沿横向或垂直于所述辐射输出侧的方向延伸; 成形体（4），其形成在所述半导体芯片上的位置，并且至少部分地形成所述安装侧表面; 以及布置在成型体上并且以导电方式连接多个半导体芯片中的至少两个半导体芯片的接触结构（50）。 本发明还涉及一种照明装置（9）及其制造方法。

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