公开(公告)号：US20160005940A1

公开(公告)日：2016-01-07

申请号：US14766420

申请日：2014-01-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Walter WEGLEITER ,  Paola ALTIERI-WEIMAR ,  Juergen MOOSBURGER ,  Stefan STEGMEIER ,  Karl WEIDNER

IPC: H01L33/62 ,  H01L31/024 ,  H01L31/0203 ,  H01L33/64 ,  H01L33/48 ,  H01L31/02

CPC classification number: H01L33/62 ,  H01L24/18 ,  H01L24/24 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/024 ,  H01L33/483 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/15153

Abstract: The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.

Abstract translation: 本发明涉及一种包括至少一个光电子半导体部件（2）和衬底（5）的器件（1），其上布置有半导体部件，其中绝缘层（4）邻近侧面（25 ）限制了半导体元件; 接触轨道（6）布置在半导体部件的辐射通道表面上并且以导电方式连接到半导体部件; 接触轨道延伸超过半导体部件的侧表面并且布置在绝缘层上; 并且相对于垂直于侧面发生的热机械负载释放接触轨迹。

公开(公告)号：US20170062687A1

公开(公告)日：2017-03-02

申请号：US15353687

申请日：2016-11-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Juergen MOOSBURGER

IPC: H01L33/64 ,  H01L33/62 ,  H01L23/00 ,  H01L33/48

CPC classification number: H01L33/641 ,  H01L24/48 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A method for producing an optoelectronic device comprises steps for providing a package with a first surface and a second surface, wherein an electrically conductive chip carrier is embedded in the package and is accessible at the first surface and at the second surface, and for applying an insulation layer on the second surface of the package by means of aerosol deposition.

Abstract translation: 一种用于制造光电子器件的方法包括用于提供具有第一表面和第二表面的封装的步骤，其中导电芯片载体被嵌入封装中并且可在第一表面和第二表面处接近，并且用于施加 通过气溶胶沉积在包装的第二表面上的绝缘层。

公开(公告)号：US20170077070A1

公开(公告)日：2017-03-16

申请号：US15310428

申请日：2015-03-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas SCHWARZ ,  Frank SINGER ,  Juergen MOOSBURGER ,  Georg BOGNER ,  Herbert BRUNNER ,  Matthias SABATHIL ,  Norwin VON MALM

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/25 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a moulded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the moulded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.

Abstract translation: 本发明涉及一种半导体部件（1），包括：多个半导体芯片（2），每个具有半导体层序列（200），具有用于产生辐射的有源区（20） 辐射输出侧（10），其平行于有源区域（20）延伸; 安装侧表面（11），其设置用于固定所述半导体部件，并且沿横向或垂直于所述辐射输出侧的方向延伸; 成形体（4），其形成在所述半导体芯片上的位置，并且至少部分地形成所述安装侧表面; 以及布置在成型体上并且以导电方式连接多个半导体芯片中的至少两个半导体芯片的接触结构（50）。 本发明还涉及一种照明装置（9）及其制造方法。

公开(公告)号：US20170005079A1

公开(公告)日：2017-01-05

申请号：US15113749

申请日：2015-01-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Lutz HOEPPEL ,  Juergen MOOSBURGER ,  Andreas PLOESSL ,  Patrick RODE ,  Peter NAGEL ,  Dominik SCHOLZ

IPC: H01L25/16 ,  H01L33/58 ,  H01L31/147 ,  H01L31/0232 ,  H01L25/00 ,  H01L31/18

CPC classification number: H01L25/167 ,  H01L25/50 ,  H01L31/02327 ,  H01L31/147 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/96 ,  H01L2933/0033 ,  H01L2933/0091

Abstract: A method for producing a plurality of optoelectronic semiconductor components (100) is provided, comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (10), wherein each of the semiconductor chips has a carrier body (12) and a semiconductor body (4) arranged on an upper side (22) of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (L) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (18), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (20); f) removing the auxiliary carrier (2); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components (100).

Abstract translation: 提供了一种用于制造多个光电子半导体部件（100）的方法，包括以下步骤：a）提供辅助载体（2）; b）提供多个半导体芯片（10），其中每个半导体芯片具有布置在载体主体的上侧（22）上的载体主体（12）和半导体本体（4） c）将多个半导体芯片附接在辅助载体上，其中半导体芯片在横向（L）上彼此间隔开，并且其中半导体主体面向辅助载体，如从载体主体所见; d）至少在相邻半导体芯片的半导体主体之间的区域中形成散射层（18）; e）形成复合包装（20）; f）拆下辅助载体（2）; 以及g）将所述复合封装单独地分离成多个光电子半导体部件（100）。