公开(公告)号：US20170002988A1

公开(公告)日：2017-01-05

申请号：US15113017

申请日：2015-01-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Sandra SOBCZYK ,  Frank SINGER ,  Wolfgang MÖNCH ,  Matthias SABATHIL

IPC: F21K9/64 ,  F21V3/02

CPC classification number: F21K9/64 ,  F21K9/61 ,  F21K9/90 ,  F21V3/02 ,  F21V5/043 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: The invention relates to a lighting means (1), comprising: an optical element (3), which has a main extension direction (Z), a radiation inlet surface (3a), and a radiation outlet surface (3b); and at least two light-emitting diodes (2), which each comprise at least one light-emitting diode chip (21) and a radiation passage surface (2a), which extends along a main extension plane (XZ); wherein the at least two lighting-emitting diodes (2) are arranged along the main extension direction (Z) of the optical element. (3), the radiation inlet surface (3a) of the optical element (3) faces the radiation passage surfaces (2a) of the at least two light-emitting diodes (2), the optical element (3) is formed as a solid body, the radiation inlet surface (3a) of the optical element (3) is flat or convexly curved, and the radiation outlet surface (3b) of the optical element (3) comprises at least one recess (4) in the optical element (3).

Abstract translation: 本发明涉及一种照明装置（1），包括：具有主延伸方向（Z），辐射入口表面（3a）和辐射出射表面（3b）的光学元件（3） 和至少两个发光二极管（2），每个发光二极管（2）分别包括至少一个沿着主延伸面（XZ）延伸的发光二极管芯片（21）和辐射通道表面（2a）; 其中所述至少两个发光二极管（2）沿着所述光学元件的主延伸方向（Z）布置。 （3）中，所述光学元件（3）的所述辐射入射面（3a）面向所述至少两个发光二极管（2）的所述辐射通路面（2a），所述光学元件（3）形成为固体 光学元件（3）的辐射入口表面（3a）是平坦的或凸起的，并且光学元件（3）的辐射出射表面（3b）包括在光学元件（3）中的至少一个凹部（4） 3）。

公开(公告)号：US20180197841A1

公开(公告)日：2018-07-12

申请号：US15328007

申请日：2015-07-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tony ALBRECHT ,  Tamas LAMFALUSI ,  Roland SCHULZ ,  Frank SINGER ,  Matthias SABATHIL

IPC: H01L25/075 ,  H01L33/60

CPC classification number: H01L25/0753 ,  F21K9/64 ,  H01L33/405 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The invention relates to a lighting module (1) comprising an assembly body (3) extending between a rear side (31) and a front side (30) opposite the rear side, and comprising a plurality of semiconductor components (2) provided for generating radiation, wherein: the assembly body has a plurality of recesses (35) on the rear side, in which the semiconductor components are arranged; the assembly body is permeable to the radiation generated in the semiconductor components, and said radiation passes out of the front side of the assembly body; a contact layer (5) is arranged on the rear side of the assembly body, to which the semiconductor components are connected in an electrically conductive manner via connecting lines; and a reflector layer (6) is arranged on the rear side of the assembly body, said reflector layer entirely covering at least the recesses.

公开(公告)号：US20170077070A1

公开(公告)日：2017-03-16

申请号：US15310428

申请日：2015-03-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas SCHWARZ ,  Frank SINGER ,  Juergen MOOSBURGER ,  Georg BOGNER ,  Herbert BRUNNER ,  Matthias SABATHIL ,  Norwin VON MALM

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/25 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a moulded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the moulded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.

Abstract translation: 本发明涉及一种半导体部件（1），包括：多个半导体芯片（2），每个具有半导体层序列（200），具有用于产生辐射的有源区（20） 辐射输出侧（10），其平行于有源区域（20）延伸; 安装侧表面（11），其设置用于固定所述半导体部件，并且沿横向或垂直于所述辐射输出侧的方向延伸; 成形体（4），其形成在所述半导体芯片上的位置，并且至少部分地形成所述安装侧表面; 以及布置在成型体上并且以导电方式连接多个半导体芯片中的至少两个半导体芯片的接触结构（50）。 本发明还涉及一种照明装置（9）及其制造方法。

公开(公告)号：US20180261730A1

公开(公告)日：2018-09-13

申请号：US15755527

申请日：2016-09-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Lutz HOEPPEL ,  Matthias SABATHIL ,  Norwin VON MALM

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/44

CPC classification number: H01L33/486 ,  H01L33/44 ,  H01L33/52 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A mount (10) and an optoelectronic component (100) with the mount (10) are provided, wherein the mount (10) comprises a moulding (5), at least one through-contact (41, 42) and a plurality of reinforcing fibres (52), wherein the moulding (5) is formed from an electrically insulating moulding material (53), the through-contact (41, 42) is formed from an electrically conductive material, and the reinforcing fibres (52) produce a mechanical connection between the moulding (5) and the through-contact (41, 42) by the reinforcing fibres (52) being arranged in certain regions of the moulding (5) and arranged in certain regions of the through-contact (41, 42). A method for producing a mount or a component with such a mount is also provided.

公开(公告)号：US20160370513A1

公开(公告)日：2016-12-22

申请号：US15255068

申请日：2016-09-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander LINKOV ,  Matthias SABATHIL

IPC: G02B5/02 ,  H01L33/50 ,  H01L33/56

Abstract: The invention relates to an optoelectronic device (101), comprising: a semiconductor layer sequence (103) comprising an emitter layer (105) for emitting electromagnetic radiation, a converter (113) for converting electromagnetic radiation with a first wavelength into an electromagnetic radiation with a second wavelength which differs from the first wavelength, a scattering body (109) for scattering at least a part of the electromagnetic radiation emitted by the emitter layer (105) in the direction of the converter (113) in order to convert at least a part of the emitted electromagnetic radiation, wherein the scattering body (109) comprises a positive, temperature-dependent scattering cross-section and so, as the temperature increases, scattering of the electromagnetic radiation in the scattering body (109) in the direction of the converter can be increased. The invention also relates to a scattering body (109).

Abstract translation: 本发明涉及一种光电子器件（101），包括：半导体层序列（103），包括用于发射电磁辐射的发射极层（105），用于将具有第一波长的电磁辐射转换为电磁辐射的转换器（113） 与第一波长不同的第二波长，散射体（109），用于在转换器（113）的方向上散射由发射极层（105）发射的电磁辐射的至少一部分，以便将至少一个 发射的电磁辐射的一部分，其中散射体（109）包括正的温度依赖的散射截面，因此随着温度的升高，散射体（109）中的电磁辐射在 转换器可以增加。 本发明还涉及散射体（109）。

公开(公告)号：US20160247966A1

公开(公告)日：2016-08-25

申请号：US15144728

申请日：2016-05-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias SABATHIL ,  Andreas PLÖßL ,  Hans-Jürgen LUGAUER ,  Alexander LINKOV ,  Patrick RODE

IPC: H01L33/08 ,  H01L33/00 ,  H01L33/06 ,  H01L33/50 ,  H01L33/22 ,  H01L33/32

CPC classification number: H01L33/08 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/22 ,  H01L33/26 ,  H01L33/32 ,  H01L33/502 ,  H01L33/504

Abstract: The invention relates to a light-emitting semiconductor component, comprising—a first semiconductor body (1), which comprises an active zone (11) in which during the operation of the light-emitting semiconductor component electromagnetic radiation is generated, at least some of which leaves the first semiconductor body (1) through a radiation exit surface (1a), and—a second semiconductor body (2), which is suitable for converting the electromagnetic radiation into converted electromagnetic radiation having a longer wavelength, wherein—the first semiconductor body (1) and the second semiconductor body (2) are produced separately from each other,—the second semiconductor body (2) is electrically inactive, and—the second semiconductor body (2) is in direct contact with the radiation exit surface (1a) and is attached there to the first semiconductor body (1) without connecting means.

Abstract translation: 本发明涉及一种发光半导体部件，包括：第一半导体本体（1），其包括活性区（11），其中在发光半导体部件产生电磁辐射的操作期间，产生至少一些 所述第一半导体本体（1）通过辐射出射表面（1a）离开所述第一半导体本体（1），以及 - 第二半导体本体（2），其适于将所述电磁辐射转换为具有较长波长的转换电磁辐射，其中，所述第一半导体 主体（1）和第二半导体本体（2）彼此分开制造， - 第二半导体体（2）是电不活动的，并且第二半导体本体（2）与辐射出口表面 1a），并且在没有连接装置的情况下附接到第一半导体本体（1）。