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公开(公告)号：US06262513B1
公开(公告)日：2001-07-17
申请号：US08973858
申请日：1997-12-30
IPC分类号： H01L4108
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
摘要翻译： 一种用于制造电子装置的电子装置和制造方法，该电子装置包括： 具有主表面的表面声波装置3具有换能器部分4和电连接到换能器部分的布线图案5; 印刷电路板1，其布线图案2至少形成在其一个主表面上; 多个导电凸块6，其电连接两个相互相对的布线图案，并在表面声波装置3和印刷电路板1之间形成空间部分10; 树脂部11通过加热/熔化和硬化与装置的其他主表面紧密接触并涂覆装置3并与印刷电路板1一起密封装置3，其中通过采用高度触变性和 粘性热固性树脂与常规树脂相比，可以提供具有简单结构的电子器件，并且可以简化用于制造电子器件的制造工艺。
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公开(公告)号：US06628043B2
公开(公告)日：2003-09-30
申请号：US09774047
申请日：2001-01-31
IPC分类号： H01L4108
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
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公开(公告)号：US06754950B2
公开(公告)日：2004-06-29
申请号：US09772859
申请日：2001-01-31
IPC分类号： H05K330
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
摘要翻译： 一种用于制造电子装置的电子装置和制造方法，该电子装置包括： 具有主表面的表面声波装置3具有换能器部分4和电连接到换能器部分的布线图案5; 印刷电路板1，其布线图案2至少形成在其一个主表面上; 多个导电凸块6，其电连接两个相互相对的布线图案，并在表面声波装置3和印刷电路板1之间形成空间部分10; 树脂部11通过加热/熔化和硬化与装置的其他主表面紧密接触并涂覆装置3并与印刷电路板1一起密封装置3，其中通过采用高度触变性和 粘性热固性树脂与常规树脂相比，可以提供具有简单结构的电子器件，并且可以简化用于制造电子器件的制造工艺。
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公开(公告)号：US4364017A
公开(公告)日：1982-12-14
申请号：US217147
申请日：1980-12-16
CPC分类号： H03H9/0585 , H03H3/08 , H03H9/02866
摘要： An elastic surface wave device comprises a piezoelectric substrate having an input electrode and an output electrode on the surface, said input and output electrodes being in comb shape and opposing each other; a sound absorbing resin layer formed on at least part of the bottom surface of said piezoelectric substrate; and an adhesive resin layer in contact with said sound absorbing resin layer and said piezoelectric substrate for adhering said piezoelectric substrate to a stem.
摘要翻译： 弹性表面波装置包括具有输入电极和表面上的输出电极的压电基片，所述输入和输出电极处于梳状并且彼此相对; 形成在所述压电基板的底面的至少一部分上的吸声树脂层; 以及与所述吸声树脂层和所述压电基板接触的粘合树脂层，用于将所述压电基板粘合到杆上。
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