公开(公告)号：US20110233758A1

公开(公告)日：2011-09-29

申请号：US13033251

申请日：2011-02-23

Applicant: Osamu MACHIDA ,  Michiyoshi Izawa

Inventor： Osamu MACHIDA ,  Michiyoshi Izawa

IPC: H01L23/34 ,  H01L23/48

CPC classification number: H01L29/7813 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0605 ,  H01L27/085 ,  H01L29/2003 ,  H01L29/42316 ,  H01L29/7786 ,  H01L29/872 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2224/48824 ,  H01L2224/48744

Abstract: A semiconductor devices includes a first die pad having the conductivity connected to one end of a DC power source, a second die pad having the conductivity connected to the other end of the DC power source, a first switching element provided on the first die pad, receiving DC power from the DC power source via the first die pad, and having a terminal opposite to the first die pad connected to a first output terminal, and a second switching element provided on the second die pad, receiving the DC power from the DC power source via the second die pad, and connected to the first output terminal, and having a terminal opposite to the second die pad.

Abstract translation: 半导体器件包括具有连接到DC电源的一端的导电性的第一管芯焊盘，具有连接到DC电源的另一端的导电性的第二管芯焊盘，设置在第一管芯焊盘上的第一开关元件， 从直流电源经由第一管芯焊盘接收直流电力，并且具有与连接到第一输出端子的第一管芯焊盘相对的端子和设置在第二管芯焊盘上的第二开关元件，从DC接收直流电力 电源，并且连接到第一输出端子，并且具有与第二管芯焊盘相对的端子。

公开(公告)号：US08546937B2

公开(公告)日：2013-10-01

申请号：US13033251

申请日：2011-02-23

Applicant: Osamu Machida ,  Michiyoshi Izawa

Inventor： Osamu Machida ,  Michiyoshi Izawa

IPC: H01L23/34 ,  H01L23/48

CPC classification number: H01L29/7813 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0605 ,  H01L27/085 ,  H01L29/2003 ,  H01L29/42316 ,  H01L29/7786 ,  H01L29/872 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2224/48824 ,  H01L2224/48744

Abstract: A semiconductor devices includes a first die pad having the conductivity connected to one end of a DC power source, a second die pad having the conductivity connected to the other end of the DC power source, a first switching element provided on the first die pad, receiving DC power from the DC power source via the first die pad, and having a terminal opposite to the first die pad connected to a first output terminal, and a second switching element provided on the second die pad, receiving the DC power from the DC power source via the second die pad, and connected to the first output terminal, and having a terminal opposite to the second die pad.

Abstract translation: 半导体器件包括具有连接到DC电源的一端的导电性的第一管芯焊盘，具有连接到DC电源的另一端的导电性的第二管芯焊盘，设置在第一管芯焊盘上的第一开关元件， 从直流电源经由第一管芯焊盘接收直流电力，并且具有与连接到第一输出端子的第一管芯焊盘相对的端子和设置在第二管芯焊盘上的第二开关元件，从DC接收直流电力 电源，并且连接到第一输出端子，并且具有与第二管芯焊盘相对的端子。