摘要:
The manufacturing process comprises a first step of formation of an N type sink on a single-crystal silicon substrate, a second step of formation of an active area on the surface of said sink, a third step of implantation of N- dopant in a surface region of the sink inside said active area, a fourth step of growth of a layer of gate oxide over said region with N- dopant, a fifth step of N+ implantation inside said N- region, a sixth step of P+ implantation in a laterally displaced position with respect to said N+ region and a seventh step of formation of external contacts for said N+ and P+ regions. There is thus obtained a zener diode limiter, having a cut-off voltage which is stable over time and not much dependent on temperature and which does not require the addition of process steps with respect to those usually necessary for the accomplishment of EEPROM memory cells.
摘要:
A method for forming thin oxide portions in electrically erasable and programmable read-only memory cells, including the use of the enhanced oxidation effect and the lateral diffusion of heavy doping, for obtaining a tunnel portion whose dimensions are smaller than the resolution of the photolithographic method used.
摘要:
The cell is formed of a selection transistor, a detection transistor and a tunnel condenser. The detection Transistor has its own control gate formed with an n+ diffusion which is closed and isolated from those of the other cells of the same memory.
摘要:
The process for manufacturing EEPROM memory cells having a single level of polysilicon and thin oxide with selection transistor, sensing transistor having a floating gate, control gate with a capacitive coupling to the floating gate and a tunnel area with thin oxide, comprises a first step involving the definition of active areas free of field oxide, a second step involving an ionic implantation at a coupling area between the control gate and the floating gate, a third step involving the creation of gate oxide at the active areas, a fourth step involving an additional ionic implantation at said coupling area between the control gate and the floating gate and at said tunnel area, a fifth step involving the removal of the gate oxide superimposed over said areas, a sixth step involving the differentiated growth of coupling oxide and tunnel oxide at said coupling areas and tunnel areas and a seventh step involving the deposition of a layer of polysilicon constituting the floating gate.
摘要:
A method for producing electrically erasable and programmable read-only memory cells with a single polysilicon level, including the use of a sacrificial layer of silicon oxide to produce a high-thickness silicon oxide layer on the active area. The active area of the cell is protected from heavy source and drain implantation in order to improve reliability.
摘要:
A method for forming thin oxide portions in electrically erasable and programmable read-only memory cells, including the use of the enhanced oxidation effect and the lateral diffusion of heavy doping, for obtaining a tunnel portion whose dimensions are smaller than the resolution of the photolithographic method used.
摘要:
The cell is formed of a selection transistor, a detection transistor and a tunnel condenser. The detection Transistor has its own control gate formed with an n.sup.+ diffusion which is closed and isolated from those of the other cells of the same memory.
摘要:
A method for producing electrically erasable and programmable read-only memory cells with a single polysilicon level, including the use of a sacrificial layer of silicon oxide to produce a high-thickness silicon oxide layer on the active area. The active area of the cell is protected from heavy source and drain implantation in order to improve reliability.
摘要:
An HV transistor integrated in a semiconductor substrate with a first type of conductivity, comprising a gate region included between corresponding drain and source regions, and being of the type wherein at least said drain region is lightly doped with a second type of conductivity. The drain region comprises a contact region with the second type of conductivity but being more heavily doped, from which a contact pad extends.
摘要:
A process for the formation of a device edge morphological structure for protecting and sealing peripherally an electronic circuit integrated in a major surface of a substrate of semiconductor material. The electronic circuit is of the type that calls for formation above the major surface of at least one dielectric multilayer. The dielectric multilayer includes a layer of amorphous planarizing material having a continuous portion extending between two contiguous areas with a more internal first area and a more external second area in the morphological structure. The device edge morphological structure includes in the substrate an excavation on the side of the major surface at the more internal first area of the morphological structure in a zone in which is present the continuous portion of the dielectric multilayer.