Tunable antifuse elements
    1.
    发明授权
    Tunable antifuse elements 有权
    可调谐反熔丝元件

    公开(公告)号:US07700996B2

    公开(公告)日:2010-04-20

    申请号:US12361944

    申请日:2009-01-29

    IPC分类号: H01L29/94

    摘要: A tunable antifuse element (102, 202, 204, 504, 952) includes a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) includes a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a rupture region (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.

    摘要翻译: 可调谐反熔断元件(102,202,204,504,952)包括具有形成在表面中的有源区域(106)的基板材料(101),栅电极(104),其至少部分位于有源区域 (106)和设置在栅电极(104)和有源区(106)之间的电介质层(110)。 电介质层(110)包括可调阶梯结构(127)。 在操作期间,施加在栅极电极(104)和有源区域(106)之间的电压产生穿过电介质层(110)的电流路径以及在破裂区域(130)中电介质层(110)的破裂。 电介质层(110)可以通过改变阶梯层厚度和层的几何形状来调节。

    BACK END OF LINE METAL-TO-METAL CAPACITOR STRUCTURES AND RELATED FABRICATION METHODS
    2.
    发明申请
    BACK END OF LINE METAL-TO-METAL CAPACITOR STRUCTURES AND RELATED FABRICATION METHODS 审中-公开
    金属 - 金属电容器结构的背面和相关制造方法

    公开(公告)号:US20110261500A1

    公开(公告)日:2011-10-27

    申请号:US12765575

    申请日:2010-04-22

    IPC分类号: H01G4/00 B05D5/12

    摘要: Apparatus and related fabrication methods are provided for capacitor structures. One embodiment of a capacitor structure comprises a plurality of consecutive metal layers and another metal layer. Each via layer of a plurality of via layers is interposed between metal layers of the plurality of metal layers. The plurality of metal layers and the plurality of via layers are cooperatively configured to provide a first plurality of vertical conductive structures corresponding to a first electrode and a second plurality of vertical conductive structures corresponding to a second electrode. The plurality of consecutive metal layers form a plurality of vertically-aligned regions and provide intralayer electrical interconnections among the first plurality of vertical conductive structures. The first metal layer provides an intralayer electrical interconnection among the second plurality of vertical conductive structures, wherein each vertically-aligned region has a vertical conductive structure of the second plurality of vertical conductive structures disposed therein.

    摘要翻译: 为电容器结构提供了装置和相关的制造方法。 电容器结构的一个实施例包括多个连续的金属层和另一个金属层。 多个通孔层的每个通孔层插入在多个金属层的金属层之间。 多个金属层和多个通孔层协作地构造成提供对应于对应于第二电极的第一电极和第二多个垂直导电结构的第一多个垂直导电结构。 多个连续的金属层形成多个垂直排列的区域,并且在第一多个垂直导电结构之间提供层间电互连。 第一金属层在第二多个垂直导电结构之间提供内层电互连,其中每个垂直对齐区域具有设置在其中的第二多个垂直导电结构的垂直导电结构。

    TUNABLE ANTIFUSE ELEMENTS
    3.
    发明申请
    TUNABLE ANTIFUSE ELEMENTS 有权
    可避免的元素

    公开(公告)号:US20090127587A1

    公开(公告)日:2009-05-21

    申请号:US12361944

    申请日:2009-01-29

    IPC分类号: H01L29/78 H01L29/86 H01L25/07

    摘要: A tunable antifuse element (102, 202, 204, 504, 952) includes a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) includes a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a rupture region (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.

    摘要翻译: 可调谐反熔断元件(102,202,204,504,952)包括具有形成在表面中的有源区域(106)的基板材料(101),栅电极(104),其至少部分位于有源区域 (106)和设置在栅电极(104)和有源区(106)之间的电介质层(110)。 电介质层(110)包括可调阶梯结构(127)。 在操作期间,施加在栅极电极(104)和有源区域(106)之间的电压产生穿过电介质层(110)的电流路径以及在破裂区域(130)中电介质层(110)的破裂。 电介质层(110)可以通过改变阶梯层厚度和层的几何形状来调节。

    Tunable antifuse element and method of manufacture
    4.
    发明授权
    Tunable antifuse element and method of manufacture 有权
    可调谐反熔丝元件及其制造方法

    公开(公告)号:US07528015B2

    公开(公告)日:2009-05-05

    申请号:US11169962

    申请日:2005-06-28

    IPC分类号: H01L21/82 H01L21/44 H01L21/31

    摘要: A tunable antifuse element (102, 202, 204, 504, 952) and method of fabricating the tunable antifuse element, including a substrate material (101) having an active area (106) formed in a surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a dielectric layer (110) disposed between the gate electrode (104) and the active area (106). The dielectric layer (110) including the fabrication of one of a tunable stepped structure (127). During operation, a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the dielectric layer (110) and a rupture of the dielectric layer (110) in a plurality of rupture regions (130). The dielectric layer (110) is tunable by varying the stepped layer thicknesses and the geometry of the layer.

    摘要翻译: 一种可调谐反熔断元件(102,202,204,504,952)和制造可调谐反熔丝元件的方法,包括在表面上形成有源区(106)的基片材料(101),具有 位于有源区域(106)上方的至少一部分,和设置在栅电极(104)和有源区域(106)之间的电介质层(110)。 介电层(110)包括制造可调阶梯结构(127)之一。 在操作期间,施加在栅极电极(104)和有源区域(106)之间的电压产生穿过介电层(110)的电流路径,并且多个断裂区域(130)中的电介质层(110)的破裂, 。 电介质层(110)可以通过改变阶梯层厚度和层的几何形状来调节。

    Single poly NVM devices and arrays
    7.
    发明授权
    Single poly NVM devices and arrays 有权
    单一的NV NV设备和阵列

    公开(公告)号:US08344443B2

    公开(公告)日:2013-01-01

    申请号:US12109736

    申请日:2008-04-25

    摘要: A single-poly non-volatile memory includes a PMOS select transistor (210) formed with a select gate (212), and P+ source and drain regions (211, 213) formed in a shared n-well region (240), a serially connected PMOS floating gate transistor (220) formed with part of a p-type floating gate layer (222) and P+ source and drain regions (221, 223) formed in the shared n-well region (240), and a coupling capacitor (230) formed over a p-well region (250) and connected to the PMOS floating gate transistor (220), where the coupling capacitor (230) includes a first capacitor plate formed with a second part of the p-type floating gate layer (222) and an underlying portion of the p-well region (250).

    摘要翻译: 单多晶非易失性存储器包括形成有选择栅极(212)的PMOS选择晶体管(210),以及形成在共享的n阱区域(240)中的P +源区和漏区(211,213) 形成有形成在共用n阱区域(240)中的p型浮栅(222)和P +源区和漏区(221,223)的一部分的连接PMOS浮栅晶体管(220)和耦合电容器 230),其形成在p阱区(250)上并连接到PMOS浮栅晶体管(220),其中耦合电容器(230)包括形成有p型浮栅的第二部分的第一电容器板( 222)和p阱区(250)的下层部分。

    Semiconductor device and related fabrication methods
    9.
    发明授权
    Semiconductor device and related fabrication methods 有权
    半导体器件及相关制造方法

    公开(公告)号:US09553187B2

    公开(公告)日:2017-01-24

    申请号:US14567357

    申请日:2014-12-11

    摘要: Semiconductor device structures and related fabrication methods are provided. An exemplary semiconductor device structure includes a body well region having a first conductivity type, a drift region and a source region each having a second conductivity type, where a channel portion of the body well region resides laterally between the source region and a first portion of the drift region that is adjacent to the channel portion. A gate structure overlies the channel portion and the adjacent portion of the drift region. A portion of the gate structure overlying the channel portion proximate the source region has the second conductivity type. Another portion of the gate structure that overlies the adjacent portion of the drift region has a different doping, and overlaps at least a portion of the channel portion, with the threshold voltage associated with the gate structure being influenced by the amount of overlap.

    摘要翻译: 提供半导体器件结构和相关的制造方法。 示例性的半导体器件结构包括具有第一导电类型的主体阱区域,漂移区域和各自具有第二导电类型的源极区域,其中主体阱区域的沟道部分横向位于源极区域和源极区域的第一部分之间 与沟道部分相邻的漂移区域。 栅极结构覆盖了沟道部分和漂移区域的相邻部分。 覆盖靠近源极区的沟道部分的栅极结构的一部分具有第二导电类型。 覆盖漂移区域的相邻部分的栅极结构的另一部分具有不同的掺杂,并且与沟道部分的至少一部分重叠,与栅极结构相关联的阈值电压受重叠量的影响。