摘要:
The present invention relates to dispensers for disposable cutlery. The invention also relates to banded packets of disposable cutlery that can be used in the cutlery dispenser of the present invention, as well as other cutlery dispensers that do not use a cartridge therein. The present invention also relates to disposable cutlery that has been adapted to make it better suited to stacking, such as for use in cutlery dispensers that do not include a cartridge.
摘要:
The present invention relates to dispensers for disposable cutlery. The invention also relates to pluralities of disposable cutlery that can be used in the cutlery dispenser of the present invention, as well as other cutlery dispensers that do not use a cartridge therein. The present invention also relates to disposable cutlery that has been adapted to make it better suited to stacking such as for use in cutlery dispensers that do not include a cartridge.
摘要:
High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition are disclosed. The method generally includes the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. The methods provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.
摘要:
Methods, algorithms, processes, circuits, and/or structures for laser patterning suitable for customized RFID designs are disclosed. In one embodiment, a method of laser patterning of an identification device can include the steps of: (i) depositing a patternable resist formulation on a substrate having configurable elements and/or materials thereon; (ii) irradiating the resist formulation with a laser tool sufficiently to change the solubility characteristics of the resist in a developer; and (iii) developing exposed areas of the resist using the developer. Embodiments of the present invention can advantageously provide a relatively low cost and high throughput approach for customized RFID devices.
摘要:
A structure to form flooring transitions having outer surfaces comprising two disparate materials. In a preferred embodiment the flooring transitions includes a T-shaped molding and at least one attachment thereto. The outer surfaces of the T-molding and attachment may be comprised of different materials, even though they may sometimes have the same pattern or décor. For example, the T-molding may have a surface of real wood or veneer and the attachment may have an outer surface of abrasion resistant foil, metal, or even a visual perception element, such as lights or reflective tape. A kit is also disclosed.
摘要:
A method of providing a decorative laminate board is provided. The method includes providing a board having a decorative upper surface, treating a portion of the decorative upper surface with a laser for embossing the decorative upper surface, and coating the laser treated portion of the decorative upper surface.
摘要:
The present invention relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.
摘要:
An injection mold and a cooperating molding system and method that allows for the parting line of a molded vehicle bumper fascia to be hidden within the wheel arch portion thereof. The invention contemplates two different mold designs for producing such a parting line: a double-lifter design and a collapsing slide core design. The bumper fascia remains in the cavity portion of the mold after molding due to the presence of undercuts in the mold cavity. A robotic part removal device is used to remove the molded bumper fascia from the mold cavity after mold opening. The part removal device is adapted to temporarily deform the bumper fascia in the wheel arch flange areas thereof to facilitate its removal from the cavity.
摘要:
The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.
摘要:
Methods and software for correcting printable circuit layouts. The methods generally including steps of identifying shapes in an input circuit layout, applying a plurality of correction rules to the shapes, and producing an output printed circuit layout in accordance with the identified shapes and the correction rules. The input circuit layout generally comprises a bitmapped image or other description of at least one printable layer of at least one electronic component, device, or die. Embodiments of the present invention further allow for more precise control of spreading and effective coverage of features (e.g., source/drain terminal regions, gates, capacitors, diodes, interconnects, etc.) on a substrate by a printed ink composition including electronic materials.