公开(公告)号：US20080054286A1

公开(公告)日：2008-03-06

申请号：US11895795

申请日：2007-08-27

申请人： Ban Loh ,  Peter Andrews ,  Nicholas Medendorp

发明人： Ban Loh ,  Peter Andrews ,  Nicholas Medendorp

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2924/00014

摘要： Light emitting device packages, light emitting diode (LED) packages and related methods are disclosed. According to one aspect, a light emitting device package is provided. The package includes a mounting pad adapted for attachment of a light emitting device. A lens coupler is attached to the mounting pad and defines an opening for containing the light emitting device and a quantity of encapsulant. The lens coupler includes a surface defining a depression which comprises at least one edge that shapes an outer surface of the encapsulant.

摘要翻译： 公开了发光器件封装，发光二极管（LED）封装和相关方法。 根据一个方面，提供一种发光器件封装。 该包装包括适于附接发光装置的安装垫。 透镜耦合器附接到安装焊盘并且限定用于容纳发光器件的开口和一定数量的密封剂。 透镜耦合器包括限定凹陷的表面，其包括形成密封剂的外表面的至少一个边缘。

公开(公告)号：US20070200127A1

公开(公告)日：2007-08-30

申请号：US11689868

申请日：2007-03-22

申请人： Peter Andrews ,  Ban Loh

发明人： Peter Andrews ,  Ban Loh

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

摘要翻译： 提供一种发光管芯封装，其包括在第一表面上具有第一表面和第一导电引线的金属基板。 第一导电引线通过绝缘膜与基板绝缘。 第一导电引线形成用于安装发光器件的安装焊盘。 该封装包括电连接到第一导电引线并远离第一表面延伸的金属引线。

公开(公告)号：US20080079017A1

公开(公告)日：2008-04-03

申请号：US11881683

申请日：2007-07-27

申请人： Ban Loh ,  Nicholas Medendorp ,  Peter Andrews ,  Yankun Fu ,  Micheal Laughner ,  Ronan Letoquin

发明人： Ban Loh ,  Nicholas Medendorp ,  Peter Andrews ,  Yankun Fu ,  Micheal Laughner ,  Ronan Letoquin

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00014

摘要： Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.

摘要翻译： 制造LED封装的方法包括提供LED芯片并用液体介质覆盖其至少一部分。 提供光学元件并放置在液体介质上。 允许光学元件沉降至所需水平并且液体介质固化。 还公开了使用所公开的方法制造的LED封装。

公开(公告)号：US08222381B2

公开(公告)日：2012-07-17

申请号：US10524048

申请日：2003-08-08

申请人： Michael West ,  Peter Andrews ,  Tracie Elizabeth Ramsdale ,  Wim Meutermans ,  Giang Thanh Le ,  Chris Clark ,  Giovanni Abbenante ,  Ligong Liu

发明人： Michael West ,  Peter Andrews ,  Tracie Elizabeth Ramsdale ,  Wim Meutermans ,  Giang Thanh Le ,  Chris Clark ,  Giovanni Abbenante ,  Ligong Liu

IPC分类号： C07H15/04 ,  C07H15/10 ,  C07H15/14 ,  C07H15/20 ,  C07H5/06 ,  C07H17/00

CPC分类号： C07H23/00 ,  C07H5/06 ,  C07H15/18

摘要： New compounds and methods for the preparation of combinatorial libraries of potentially biologically active compounds are based on monosaccharides of formula I being a derivative of a furanose or pyranose form of a monosaccharide, .

摘要翻译： 用于制备潜在生物活性化合物的组合文库的新化合物和方法基于式I的单糖，其为呋喃糖或吡喃糖形式的单糖。

公开(公告)号：US07442564B2

公开(公告)日：2008-10-28

申请号：US11334922

申请日：2006-01-19

申请人： Peter Andrews

发明人： Peter Andrews

IPC分类号： H01L21/00

CPC分类号： H05K3/4685 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/142 ,  H05K3/1241 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0126 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

摘要翻译： 电子设备包括基板，基板上的电气元件，基板上的非导电粘合剂材料，以及电气元件上的导电粘合剂材料并延伸到非导电粘合剂材料上。 形成封装的LED的方法包括提供其上具有电元件的基板，以及在基板上分配非导电粘合剂材料。 非导电粘合剂材料至少部分固化，并且导电粘合剂材料分配在电气元件上以及至少部分固化的非导电材料上。 导电粘合剂材料至少部分固化。 导电粘合剂材料可以在电气元件和衬底上或另一衬底上的第二电气元件之间提供电连接。

公开(公告)号：US07362115B2

公开(公告)日：2008-04-22

申请号：US11655605

申请日：2007-01-19

申请人： Peter Andrews ,  Brad Froemke ,  John Dunklee

发明人： Peter Andrews ,  Brad Froemke ,  John Dunklee

IPC分类号： G01R31/02

CPC分类号： G01R31/2887

摘要： An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

摘要翻译： 具有提升销的改进的卡盘组件。 卡盘组件可以具有外周边和上表面。 提升销可以定位在卡盘组件的周边内，并且可以相对于卡盘组件的上表面相对垂直运动。

公开(公告)号：US20080087910A1

公开(公告)日：2008-04-17

申请号：US11953110

申请日：2007-12-10

申请人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

发明人： Peter Andrews ,  Thomas Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald Negley ,  Eric Tarsa

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/52

摘要： Reflectors for a semiconductor light emitting device include a lower sidewall portion defining a reflective cavity. A substantially horizontal shoulder portion extends outwardly from the sloped lower sidewall portion. The horizontal shoulder portion has a circumferentially extending moat formed therein. An upper sidewall portion extends upwardly from the horizontal shoulder portion.

摘要翻译： 用于半导体发光器件的反射器包括限定反射腔的下侧壁部分。 大致水平的肩部从倾斜的下侧壁部分向外延伸。 水平肩部具有形成在其中的周向延伸的护城河。 上侧壁部分从水平肩部部分向上延伸。

公开(公告)号：US20080001160A1

公开(公告)日：2008-01-03

申请号：US11476836

申请日：2006-06-29

申请人： Peter Andrews

发明人： Peter Andrews

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L27/156 ,  H01L33/52 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/00014

摘要： A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may be formed so as to include a basin and at least one light emitting die may be placed within the basin. The flextape may be provided to include at least one metal trace that is electrically connected to the light emitting die.

摘要翻译： 发光二极管（LED）封装可以包括基底，在基底上的至少一个发光管芯和基底上的柔性件。 柔性包括连接到发光模具的至少一个金属迹线。 在制造LED封装的方法中，基底可以形成为包括盆，并且至少一个发光管可以放置在盆内。 柔性件可以设置成包括电连接到发光管芯的至少一个金属迹线。

公开(公告)号：US20070164454A1

公开(公告)日：2007-07-19

申请号：US11334922

申请日：2006-01-19

申请人： Peter Andrews

发明人： Peter Andrews

IPC分类号： H01L23/48

CPC分类号： H05K3/4685 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/142 ,  H05K3/1241 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0126 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

摘要翻译： 电子设备包括基板，基板上的电气元件，基板上的非导电粘合剂材料，以及电气元件上的导电粘合剂材料并延伸到非导电粘合剂材料上。 形成封装的LED的方法包括提供其上具有电元件的基板，以及在基板上分配非导电粘合剂材料。 非导电粘合剂材料至少部分固化，并且导电粘合剂材料分配在电气元件上以及至少部分固化的非导电材料上。 导电粘合剂材料至少部分固化。 导电粘合剂材料可以在电气元件和衬底上或另一衬底上的第二电气元件之间提供电连接。

公开(公告)号：US20070161137A1

公开(公告)日：2007-07-12

申请号：US11688605

申请日：2007-03-20

申请人： David Slater ,  Bradley Williams ,  Peter Andrews ,  John Edmond ,  Scott Allen

发明人： David Slater ,  Bradley Williams ,  Peter Andrews ,  John Edmond ,  Scott Allen

IPC分类号： H01L21/00

CPC分类号： H01L33/60 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01057 ,  H01L2924/12041 ,  H01L2924/00

摘要： Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on the epitaxial region. A barrier layer is provided on the reflector layer and extending on a sidewall of the reflector layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers.

摘要翻译： 诸如发光二极管的半导体发光器件包括衬底，在衬底上的包括诸如发光二极管区域的发光区域的外延区域和在外延区域上包括反射器层的多层导电堆叠。 阻挡层设置在反射器层上并在反射器层的侧壁上延伸。 多层导电叠层还可以包括在反射器和外延区之间的欧姆层。 阻挡层进一步在欧姆层的侧壁上延伸。 阻挡层还可以延伸到多层导电叠层外的外延区域上。 阻挡层可以制成一系列交替的第一和第二子层。