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公开(公告)号:US09236555B2
公开(公告)日:2016-01-12
申请号:US13349009
申请日:2012-01-12
申请人: Po-Jui Chen , Ando Feyh , Gary O'Brien
发明人: Po-Jui Chen , Ando Feyh , Gary O'Brien
IPC分类号: H01L41/083 , H01L41/09 , G01L1/16 , H01L41/047 , H01L41/113
CPC分类号: H01L41/096 , G01L1/16 , H01L41/047 , H01L41/094 , H01L41/1132 , Y10T29/42
摘要: In one embodiment, a method of deforming a MEMS structure includes providing a base layer, providing a first piezoelectric slab operably connected to a surface of the base layer, determining a desired deformation of the base layer, applying a first potential to a first electrode operably connected to the first piezoelectric slab, applying a second potential to a second electrode operably connected to the first piezoelectric slab, and deforming the base layer with the first piezoelectric slab using the applied first potential and the applied second potential based upon the determined desired deformation.
摘要翻译: 在一个实施例中,使MEMS结构变形的方法包括提供基底层,提供可操作地连接到基底层的表面的第一压电片,确定基底层的期望变形,将第一电位可操作地施加到第一电极 连接到所述第一压电板,将第二电位施加到可操作地连接到所述第一压电板的第二电极,以及基于所确定的期望变形,使用所施加的第一电位和所施加的第二电位,使所述基层与所述第一压电板发生变形。
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公开(公告)号:US20130181575A1
公开(公告)日:2013-07-18
申请号:US13349009
申请日:2012-01-12
申请人: Po-Jui Chen , Ando Feyh , Gary O'Brien
发明人: Po-Jui Chen , Ando Feyh , Gary O'Brien
IPC分类号: H01L41/083 , H01L41/22 , H01L41/02
CPC分类号: H01L41/096 , G01L1/16 , H01L41/047 , H01L41/094 , H01L41/1132 , Y10T29/42
摘要: In one embodiment, a method of deforming a MEMS structure includes providing a base layer, providing a first piezoelectric slab operably connected to a surface of the base layer, determining a desired deformation of the base layer, applying a first potential to a first electrode operably connected to the first piezoelectric slab, applying a second potential to a second electrode operably connected to the first piezoelectric slab, and deforming the base layer with the first piezoelectric slab using the applied first potential and the applied second potential based upon the determined desired deformation.
摘要翻译: 在一个实施例中,使MEMS结构变形的方法包括提供基底层,提供可操作地连接到基底层的表面的第一压电片,确定基底层的期望变形,将第一电位可操作地施加到第一电极 连接到所述第一压电板,将第二电位施加到可操作地连接到所述第一压电板的第二电极,以及基于所确定的期望变形,使用所施加的第一电位和所施加的第二电位,使所述基层与所述第一压电板发生变形。
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公开(公告)号:US08779533B2
公开(公告)日:2014-07-15
申请号:US13180954
申请日:2011-07-12
申请人: Ando Feyh , Po-Jui Chen
发明人: Ando Feyh , Po-Jui Chen
IPC分类号: H01L29/84
CPC分类号: F16K99/003 , F16K99/0044
摘要: In one embodiment, a method of opening a passageway to a cavity includes providing a donor portion, forming a heating element adjacent to the donor portion, forming a first sacrificial slab abutting the donor portion, wherein the donor portion and the sacrificial slab are a shrinkable pair, forming a first cavity, a portion of the first cavity bounded by the first sacrificial slab, generating heat with the heating element, forming a first reduced volume slab from the first sacrificial slab using the generated heat and the donor portion, and forming a passageway to the first cavity by forming the first reduced volume slab.
摘要翻译: 在一个实施例中,将通道打开到空腔的方法包括提供供体部分,形成邻近供体部分的加热元件,形成邻接供体部分的第一牺牲板,其中供体部分和牺牲板是可收缩的 形成第一空腔,由第一牺牲板限定的第一空腔的一部分,用加热元件产生热量,使用产生的热量和供体部分从第一牺牲板形成第一减小体积的板坯,并形成 通过形成第一减小体积的板坯到第一空腔的通道。
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公开(公告)号:US09638524B2
公开(公告)日:2017-05-02
申请号:US13690932
申请日:2012-11-30
申请人: Ando Feyh , Po-Jui Chen
发明人: Ando Feyh , Po-Jui Chen
IPC分类号: G01C19/5712 , B81B7/02 , G01P15/12 , G01C19/5755 , G01C19/5769 , G01P15/125 , G01C25/00 , G01P15/08 , G01P15/18
CPC分类号: G01C19/5712 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/053 , G01C19/5755 , G01C19/5769 , G01C25/00 , G01P15/123 , G01P15/125 , G01P15/18 , G01P2015/0808 , G01P2015/0814 , G01P2015/0848 , G01P2015/0882 , Y10T29/42
摘要: A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
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公开(公告)号:US20140150552A1
公开(公告)日:2014-06-05
申请号:US13690932
申请日:2012-11-30
申请人: Ando Feyh , Po-Jui Chen
发明人: Ando Feyh , Po-Jui Chen
IPC分类号: G01C19/5712 , G01C25/00
CPC分类号: G01C19/5712 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/053 , G01C19/5755 , G01C19/5769 , G01C25/00 , G01P15/123 , G01P15/125 , G01P15/18 , G01P2015/0808 , G01P2015/0814 , G01P2015/0848 , G01P2015/0882 , Y10T29/42
摘要: A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
摘要翻译: 感测组装装置包括衬底,位于衬底上方的腔室,位于室内的第一压电陀螺仪传感器和位于腔室内的第一加速计。
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公开(公告)号:US20130015536A1
公开(公告)日:2013-01-17
申请号:US13180954
申请日:2011-07-12
申请人: Ando Feyh , Po-Jui Chen
发明人: Ando Feyh , Po-Jui Chen
IPC分类号: H01L29/84 , H01L21/283
CPC分类号: F16K99/003 , F16K99/0044
摘要: In one embodiment, a method of opening a passageway to a cavity includes providing a donor portion, forming a heating element adjacent to the donor portion, forming a first sacrificial slab abutting the donor portion, wherein the donor portion and the sacrificial slab are a shrinkable pair, forming a first cavity, a portion of the first cavity bounded by the first sacrificial slab, generating heat with the heating element, forming a first reduced volume slab from the first sacrificial slab using the generated heat and the donor portion, and forming a passageway to the first cavity by forming the first reduced volume slab.
摘要翻译: 在一个实施例中,将通道打开到空腔的方法包括提供供体部分,形成邻近供体部分的加热元件,形成邻接供体部分的第一牺牲板,其中供体部分和牺牲板是可收缩的 形成第一空腔,由第一牺牲板限定的第一空腔的一部分,用加热元件产生热量,使用产生的热量和供体部分从第一牺牲板形成第一减小体积的板坯,并形成 通过形成第一减小体积的板坯到第一空腔的通道。
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公开(公告)号:US10717645B2
公开(公告)日:2020-07-21
申请号:US15535687
申请日:2015-12-17
申请人: Robert Bosch GmbH , Ando Feyh , Gary O'Brien
发明人: Ando Feyh , Gary O'Brien
IPC分类号: H01L31/02 , H01L27/146 , H01L21/56 , B81C1/00 , H01L23/28 , H01L23/31 , H01L23/24 , G01L19/14 , G01L19/00 , B81B7/00
摘要: A method of encapsulating a sensor device includes providing at least one sensor device that has a sensor portion on a substrate. An exclusionary zone is formed above an upper surface of the sensor portion. An outer boundary is formed on or about the sensor device with the outer boundary encircling the exclusionary zone. A mold material is deposited into a volume defined in part by the sensor device, the exclusionary zone, and the outer boundary to encapsulate portions of the sensor device. The exclusionary zone in one embodiment is an inner boundary that is formed on the sensor portion. The inner boundary encircles a portion of the upper surface of the sensor portion. The exclusionary zone in another embodiment is a selectively removable material deposited on the upper surface of the sensor portion. The selectively removable material occupies a space above a portion of the upper surface.
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公开(公告)号:US10224540B2
公开(公告)日:2019-03-05
申请号:US14910695
申请日:2014-08-08
申请人: Ashwin K. Samarao , Gary O'Brien , Ando Feyh , Robert Bosch GmbH
发明人: Ashwin K. Samarao , Gary O'Brien , Ando Feyh
IPC分类号: H01M4/36 , H01M10/0525 , H01M10/0562 , C23C16/40 , C23C16/455 , C23C16/52 , H01M4/04 , H01M4/38 , H01M4/134 , H01M10/058 , C23C16/04 , H01M4/02
摘要: A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.
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公开(公告)号:US20160190564A1
公开(公告)日:2016-06-30
申请号:US14910695
申请日:2014-08-08
申请人: Ashwin K. SAMARAO , Gary O'BRIEN , Ando FEYH , ROBERT BOSCH GMBH
发明人: Ashwin K. Samarao , Gary O'Brien , Ando Feyh
IPC分类号: H01M4/36 , H01M4/38 , C23C16/40 , H01M4/04 , C23C16/455 , C23C16/52 , H01M10/0525 , H01M10/0562
CPC分类号: H01M4/366 , C23C16/045 , C23C16/403 , C23C16/45555 , C23C16/52 , H01M4/0428 , H01M4/134 , H01M4/382 , H01M4/386 , H01M10/0525 , H01M10/0562 , H01M10/058 , H01M2004/021 , H01M2220/20 , H01M2220/30 , H01M2300/0071 , H01M2300/0094 , Y02E60/122 , Y02T10/7011
摘要: A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.
摘要翻译: 一个实施方案中的锂离子电池包括阴极中的锂基化合物,阳极中的第一多孔硅部分和涂覆第一多孔硅部分并与阴极接触的原子层沉积(ALD)氧化物层。
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公开(公告)号:US20170314995A1
公开(公告)日:2017-11-02
申请号:US15516821
申请日:2015-10-09
申请人: Thomas ROCZNIK , Fabian PURKL , Gary O'BRIEN , Ando FEYH , Bongsang KIM , Ashwin SAMARAO , Gary YAMA , Robert Bosch GmbH
发明人: Thomas Rocznik , Fabian Purkl , Gary O'Brien , Ando Feyh , Bongsang Kim , Ashwin Samarao , Gary Yama
CPC分类号: G01J5/06 , G01J5/0809 , G01J5/0853 , G01J5/20 , G01J5/24 , G01J2005/066 , G01J2005/067
摘要: A semiconductor sensor system, in particular a bolometer, includes a substrate, an electrode supported by the substrate, an absorber spaced apart from the substrate, a voltage source, and a current source. The electrode can include a mirror, or the system may include a mirror separate from the electrode. Radiation absorption efficiency of the absorber is based on a minimum gap distance between the absorber and mirror. The current source applies a DC current across the absorber structure to produce a signal indicative of radiation absorbed by the absorber structure. The voltage source powers the electrode to produce a modulated electrostatic field acting on the absorber to modulate the minimum gap distance. The electrostatic field includes a DC component to adjust the absorption efficiency, and an AC component that cyclically drives the absorber to negatively interfere with noise in the signal.
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