公开(公告)号：US20180316319A1

公开(公告)日：2018-11-01

申请号：US15584000

申请日：2017-05-01

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Shu ZHANG ,  Bonhoon KOO ,  Manuel ALDRETE ,  Jie FU ,  Chin-Kwan KIM ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H03F1/52 ,  H03F3/189 ,  H03F3/20 ,  H03F1/56 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L23/12

CPC classification number: H01L23/12 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/16237 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49175

Abstract: In exemplary aspects of the disclosure, magnetic coupling problems in a power amplifier/antenna circuit may be address by using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate to offer full RF isolation of both PA output match inductors (self-shielded and embedded) or using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate along with a component level conformal shield around the self-shielded inductor on the assembly structure.

公开(公告)号：US20190252316A1

公开(公告)日：2019-08-15

申请号：US16254735

申请日：2019-01-23

Applicant: QUALCOMM Incorporated

Inventor： Shu ZHANG ,  Daniel Daeik KIM ,  Chenqian GAN ,  Bonhoon KOO ,  Babak NEJATI

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/64 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01L23/5227 ,  H01F17/0013 ,  H01F17/02 ,  H01F27/2804 ,  H01F41/042 ,  H01F2017/002 ,  H01F2017/0073 ,  H01F2027/2809 ,  H01L23/52 ,  H01L23/645 ,  H01L28/10

Abstract: Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.

公开(公告)号：US20180374622A1

公开(公告)日：2018-12-27

申请号：US15722446

申请日：2017-10-02

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Bonhoon KOO ,  Babak NEJATI

IPC: H01F17/00 ,  H01F41/04

Abstract: A multi-layer spiral inductive array includes a first multi-layer spiral inductor with a second layer matching a spiral pattern of a first layer. The multi-layer spiral inductive array also includes a second multi-layer spiral inductor with a third layer matching a spiral pattern of a fourth layer. The second multi-layer spiral inductor is coupled in series with the first multi-layer spiral inductor.

公开(公告)号：US20180033537A1

公开(公告)日：2018-02-01

申请号：US15288967

申请日：2016-10-07

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H03H7/46 ,  H01F41/04 ,  H01F27/28 ,  H03H7/01

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F41/041 ,  H01F2017/004 ,  H01F2017/0086 ,  H01L23/49822 ,  H01L23/5227 ,  H01L28/10 ,  H03H7/0138 ,  H03H7/463 ,  H03H2001/0078

Abstract: A stepped-width, co-spiral inductor structure includes a first exterior layer having a first exterior width. The stepped-width, co-spiral inductor structure also includes a first interior layer coupled to the first exterior layer. The first interior layer includes a first interior width that is wider than the first exterior width of the first exterior layer. The stepped-width, co-spiral inductor structure further includes a second exterior layer coupled to the first interior layer. The second exterior layer includes a second exterior width that is narrower than the first interior width of the first interior layer.

公开(公告)号：US20200219822A1

公开(公告)日：2020-07-09

申请号：US16241958

申请日：2019-01-07

Applicant: QUALCOMM Incorporated

Inventor： Daniel Daeik KIM ,  Manuel ALDRETE ,  Babak NEJATI

IPC: H01L23/552 ,  H01L23/00 ,  H05K1/02 ,  H01L25/065

Abstract: An RF/EMI shield has a substrate, a plurality of solder balls on a first side of the substrate, and a plurality of wire-bonds on a periphery of the first side of the substrate to form a shield which can be soldered in a surface mount process directly around components needing shielding. Each of the plurality of wire-bonds has a width selected as a fraction of the wavelength of interest.

公开(公告)号：US20200020474A1

公开(公告)日：2020-01-16

申请号：US16034653

申请日：2018-07-13

Applicant: QUALCOMM Incorporated

Inventor： Daniel Daeik KIM ,  Bonhoon KOO ,  Babak NEJATI

IPC: H01F17/02 ,  H03F1/08

Abstract: A spiral inductor includes a spiral trace and a plurality of first projections extending along a first edge of the spiral trace. The spiral inductor may further include a plurality of second projections extending along a second edge of the spiral trace, the second edge being opposite the first edge.

公开(公告)号：US20180315540A1

公开(公告)日：2018-11-01

申请号：US15857478

申请日：2017-12-28

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H01F27/28 ,  H05K1/02 ,  H05K1/11 ,  H01F27/29 ,  H01F41/04

Abstract: A laminate substrate inductor reduces insertion loss and improves isolation while reducing the area for integrating the laminate substrate inductor. The laminate substrate includes a spiral trace. The laminate substrate also includes a first capture pad at a first end of the spiral trace. The first end is located at a corner of the spiral trace. The first capture pad is substantially within a bounding box of the spiral trace. At least a portion of the first capture pad and an outer edge of the spiral trace have a same distance from a ground.

公开(公告)号：US20180228016A1

公开(公告)日：2018-08-09

申请号：US15429144

申请日：2017-02-09

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Jie FU ,  Manuel ALDRETE ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/11 ,  H05K13/00 ,  H05K3/40

CPC classification number: H05K1/023 ,  H01L23/552 ,  H01L24/49 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/115 ,  H05K3/30 ,  H05K3/4038 ,  H05K9/0024 ,  H05K13/00 ,  H05K2201/0715 ,  H01L2224/45099

Abstract: In a package such as a radio frequency (RF) module, an external shield may be provided to shield the package from external influences as well as to shield the devices within the package from undesirable affecting devices outside of the package. The package may also include an internal shield to suppress adverse effects of the signal generated by an aggressor device within the external shield to other devices within the external shield.