Abstract:
A METHOD FOR ELECTROLESSLY PLATING NICKEL FROM A BATH COMPRISING (I) A NICKEL SALT; (II) A NICKEL ION COMPLEXING AGENT; (III) A SOURCE OF HYDROPHOSPHITE IONS; AND (IV) AMMONIUM HYDROXIDE, IN WHICH THE MOLAR CONCENTRATION RATIO OF NICKEL TO HYPOPHOSPHITE IONS IS LESS THAN 0.2. THE BATH EXHIBITS A PLATING RATE SUBSTANTIALLY INDEPENDENT OF HYPOPHOSPHITE ION CONCENTRATION.
Abstract:
The tendency of an electroless plating bath having a considerable amount of oxygen dissolved therein to ''''skipplate'''' on catalytic surfaces of objects immersed therein, is inhibited by the removal of at least most of the oxygen initially present in the bath.
Abstract:
STRATE AND MASKING FILM ARE NEXT TREATED WITH A CATALYTIC ACTIVATING SOLUTION, AND A THIN LAYER OF THE CATALYST IS DEPOSITED ONLY ON THE SENSITIZED SELECTED PORTIONS OF THE SUBSTRATE SURFACE.
A METHOD OF PREPARING A SUBSTRATE FOR THE DEPOSITION OF A METAL ON SELECTED PORTIONS OF THE SUBSTRATE SURFACE BY ELECTROLESS PLATING, IN THE PRESENCE OF A CATALYST COMPRISES FIRST COVERING THE UNSELECTED PORTIONS OF THE SUBSTRATE SURFACE WITH A MASKING FILM THAT INCLUDES AN OXIDIZING AGENT. THE SUBSTRATE, INCLUDING THE MASKING FILM, IS THEN TREATED WITH A SENSITIZING SOLUTION AND HEATED TO CAUSE THE OXIDIZING AGENT TO OXIDIZE, AND DESENSITIZE, THE SENSITIZING SOLUTION THAT IS ADSORBED ON THE MASKING FILM, RENDERING THE MASKING FILM INCAPABLE OF ACCEPTING A CATALYST. THE SUB-
Abstract:
A method of making a patterned metal film article comprising depositing an organic resist material on the surface of a relatively nonporous insulating substrate in the pattern desired for the metal, leaving portions of the substrate surface exposed, treating both the exposed substrate surface portions and the resist surface with a sensitizer and with an activator for electroless deposition of a metal on both these surfaces, treating both said surfaces with an etching solution so that only the exposed substrate surface portions become deactivated, and treating both the surfaces with an electroless metal plating solution such that metal deposits only on the resist surface.
Abstract:
A method of making a semi-transparent photomask of the iron oxide type comprising depositing a thin film of nickel or of a nickel alloy on a glass substrate, forming on the nickel or nickel alloy film a pattern of a resist which is the negative of the desired photomask, electrolytically depositing a layer of iron on the areas of the alloy film not covered by the resist, removing the resist and heating the assembly in an oxidizing atmosphere to convert the iron layer to iron oxide and also to convert the nickel or nickel alloy film to transparent oxides, at the same time providing improved adherence.
Abstract:
A thin layer of nickel or a nickel alloy, having a thickness such that it transmits about 30-40% of the visible and ultraviolet light, is deposited on an insulating substrate. A pattern of opaque metal areas is deposited on the thin layer of metal and the thin metal layer is heat-treated in air for a time and at a temperature sufficient to make the thin layer sufficiently transparent, adherent, and durable for the intended purpose.
Abstract:
The method comprises depositing a thin layer of a first metal having a relatively high degree of solubility in a particular etchant on a substrate, this first metal being catalytic to electroless deposition of a second metal to be subsequently deposited, electrolessly depositing on the first metal a pattern of areas of a second metal which has a relatively low degree of solubility in the etchant, and then treating the plated areas with the etchant, so that the first metal is removed where it is not covered by the second metal but the second metal is substantially unaffected.
Abstract:
The matrix comprises a highly polished degenerately doped silicon single crystal substrate having a layer of an inorganic dielectric thereon and a pattern of grooves in the dielectric coating, exposing the silicon surface.
Abstract:
A photomask which comprises a transparent, smooth glass plate and a pattern of opaque, light-absorbing areas of oxides of cobalt on a surface of the plate is obtained by sequentially coating the glass plate with layers of cobalt and a photoresist, exposing the photoresist, developing the photoresist to expose areas of cobalt, etching away the exposed areas of cobalt, and heating the remaining areas of cobalt in the presence of oxgen to convert the same to cobalt oxides.