公开(公告)号：US20190139871A1

公开(公告)日：2019-05-09

申请号：US16242227

申请日：2019-01-08

Applicant: ROHM CO., LTD.

Inventor： Katsuhiro IWAI

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.

公开(公告)号：US20170213782A1

公开(公告)日：2017-07-27

申请号：US15416261

申请日：2017-01-26

Applicant: ROHM CO., LTD.

Inventor： Katsuhiro IWAI

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/562 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.

公开(公告)号：US20240347426A1

公开(公告)日：2024-10-17

申请号：US18753892

申请日：2024-06-25

Applicant: ROHM CO., LTD.

Inventor： Katsuhiro IWAI

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49582 ,  H01L23/562 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3512

Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.

公开(公告)号：US20180012826A1

公开(公告)日：2018-01-11

申请号：US15643159

申请日：2017-07-06

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO ,  Katsuhiro IWAI

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/29111 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/33505 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2224/83986 ,  H01L2224/97 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/2076 ,  H01L2924/01026 ,  H01L2924/00

Abstract: An aspect of the present disclosure provides a method of manufacturing a semiconductor device. The method includes: preparing a first semiconductor element and a second semiconductor element, each of the first semiconductor element and the second semiconductor element having an element main surface and an element back surface that face opposite sides to each other; die bonding the element back surface of the first semiconductor element to a pad main surface by using a first solder; and die bonding the element back surface of the second semiconductor element to the pad main surface by using a second solder having a melting point lower than a melting point of the first solder, after die bonding the element back surface of the first semiconductor element to the pad main surface by using the first solder.

公开(公告)号：US20230253298A1

公开(公告)日：2023-08-10

申请号：US18301807

申请日：2023-04-17

Applicant: ROHM CO., LTD.

Inventor： Katsuhiro IWAI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49548 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49582 ,  H01L23/562 ,  H01L2924/181 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/49113 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/18301 ,  H01L2924/3512

Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.

公开(公告)号：US20210407893A1

公开(公告)日：2021-12-30

申请号：US17472362

申请日：2021-09-10

Applicant: ROHM CO., LTD.

Inventor： Katsuhiro IWAI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.

公开(公告)号：US20210090978A1

公开(公告)日：2021-03-25

申请号：US17109675

申请日：2020-12-02

Applicant: ROHM CO., LTD.

Inventor： Katsuhiro IWAI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.