Measuring instrument with diamond coated contacts
    6.
    发明授权
    Measuring instrument with diamond coated contacts 失效
    带金刚石涂层触点的测量仪器

    公开(公告)号:US5596813A

    公开(公告)日:1997-01-28

    申请号:US298255

    申请日:1994-08-30

    CPC分类号: G01B1/00 G01B3/002 Y10S33/11

    摘要: Precision measuring instruments having highly parallel and wear-resistant contact members and a method for fabricating these contact areas are disclosed. The measuring instruments preferably include two contact members each having diamond coated ceramic substrates. The method for diamond coating the contact members of the measuring instruments includes, for each contact member, preparing a ceramic substrate to high tolerance so that it has two surfaces which are parallel within 0.25 microns, diamond coating one surface of the substrate by any one of several chemical vapor deposition (CVD) techniques, and metalizing the other surface of the substrate for affixing it to the contact member of the measuring instrument. The metalized surface of the substrate is preferably affixed to the contact members of the measuring instrument by brazing, gluing or welding. Preferred embodiments of the measuring instruments with diamond coated contact areas include calipers and micrometers. The provided measuring instruments can be used to measure extremely abrasive materials such as sandpaper and grinding wheels without suffering any appreciable wear to their contact surfaces over a long period of time.

    摘要翻译: 公开了具有高度平行和耐磨接触构件的精密测量仪器和用于制造这些接触区域的方法。 测量仪器优选地包括两个具有金刚石涂覆的陶瓷衬底的接触构件。 用于金刚石涂覆测量仪器的接触构件的方法包括对于每个接触构件,制备陶瓷衬底以具有高耐受性,使得其具有平行于0.25微米内的两个表面,金刚石通过以下任何一种将基底的一个表面 几种化学气相沉积(CVD)技术,并且将衬底的另一表面金属化以将其固定到测量仪器的接触构件上。 基板的金属化表面优选通过钎焊,胶合或焊接固定在测量仪器的接触构件上。 具有金刚石涂层的接触区域的测量仪器的优选实施例包括卡尺和微米。 所提供的测量仪器可用于测量非常磨蚀的材料,如砂纸和砂轮,而不会在长时间内对其接触表面造成明显的磨损。

    Method of making measuring instruments with diamond coated contacts
    7.
    发明授权
    Method of making measuring instruments with diamond coated contacts 失效
    制作带有金刚石涂层触点的测量仪器的方法

    公开(公告)号:US5653378A

    公开(公告)日:1997-08-05

    申请号:US450816

    申请日:1995-05-25

    CPC分类号: G01B1/00 G01B3/002 Y10S33/11

    摘要: Precision measuring instruments having highly parallel and wear-resistant contact members and a method for fabricating these contact areas are disclosed. The measuring instruments preferably include two contact members each having diamond coated ceramic substrates. The method for diamond coating the contact members of the measuring instruments includes, for each contact member, preparing a ceramic substrate to high tolerance so that it has two surfaces which are parallel within 0.25 microns, diamond coating one surface of the substrate by any one of several chemical vapor deposition (CVD) techniques, and metalizing the other surface of the substrate for affixing it to the contact member of the measuring instrument. The metalized surface of the substrate is preferably affixed to the contact members of the measuring instrument by brazing, gluing or welding. Preferred embodiments of the measuring instruments with diamond coated contact areas include calipers and micrometers. The provided measuring instruments can be used to measure extremely abrasive materials such as sandpaper and grinding wheels without suffering any appreciable wear to their contact surfaces over a long period of time.

    摘要翻译: 公开了具有高度平行和耐磨接触构件的精密测量仪器和用于制造这些接触区域的方法。 测量仪器优选地包括两个具有金刚石涂覆的陶瓷衬底的接触构件。 用于金刚石涂覆测量仪器的接触构件的方法包括:对于每个接触构件,制备陶瓷衬底以具有高耐受性,使得其具有平行于0.25微米内的两个表面,金刚石通过以下任何一种将基底的一个表面 几种化学气相沉积(CVD)技术,并且将衬底的另一表面金属化以将其固定到测量仪器的接触构件上。 基板的金属化表面优选通过钎焊,胶合或焊接固定在测量仪器的接触构件上。 具有金刚石涂层的接触区域的测量仪器的优选实施例包括卡尺和微米。 所提供的测量仪器可用于测量非常磨蚀的材料,如砂纸和砂轮,而不会在长时间内对其接触表面造成明显的磨损。

    Method for making a semiconductor package with the distance between a
lead frame die pad and heat spreader determined by the thickness of an
intermediary insulating sheet
    8.
    发明授权
    Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet 失效
    制造具有由中间绝缘片的厚度确定的引线框模片垫和散热器之间的距离的半导体封装的方法

    公开(公告)号:US5139973A

    公开(公告)日:1992-08-18

    申请号:US628513

    申请日:1990-12-17

    摘要: A lead frame and die sub-assembly is first manufactured by a conventional method including bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is stacked first adjacent a dielectric plastic sheet that is in turn stacked against a metal heat spreader block. The dielectric sheet has a centrally located hole registered with the die attach pad. A dollop of an uncured resin is dispensed in the gap between the die attach pad and block. This assembly is compressed between two hot platens whereby the lead fingers, dielectric sheet and the block are bonded together and the resin dollop is flattened to a controlled thickness, namely the thickness of the dielectric sheet. The thickness of the dielectric sheet controls the flattened thickness of the cured resin dollop. After the platens are withdrawn, the local portion of the lead frame having been bonded in the stack is then put into a mold and the stack assembly encapsulated in a thermosetting resin to produce the semiconductor package.

    摘要翻译: 引线框架和模具子组件首先通过常规方法制造,包括将管芯结合到引线框架的管芯连接焊盘并在管芯和引线框架指状物之间连接引线。 子组件首先堆叠在电介质塑料片上,该电介质塑料片又与金属散热器块堆叠在一起。 电介质片具有与管芯附接垫对准的位于中心的孔。 将未固化的树脂的多次分配在管芯附着垫和块之间的间隙中。 该组件在两个热压板之间被压缩,由此将引线指,电介质片和块结合在一起,并将树脂喷镀被压扁到受控的厚度,即电介质片的厚度。 电介质片的厚度控制固化树脂滴定的平整厚度。 在拉出压板之后,引线框架已经结合在堆叠中的局部部分然后被放入模具中,并将堆叠组件封装在热固性树脂中以产生半导体封装。

    Laser finishing and measurement of diamond surface roughness
    10.
    发明授权
    Laser finishing and measurement of diamond surface roughness 失效
    激光整理和测量金刚石表面粗糙度

    公开(公告)号:US5504303A

    公开(公告)日:1996-04-02

    申请号:US353753

    申请日:1994-12-12

    申请人: Bela G. Nagy

    发明人: Bela G. Nagy

    摘要: A combination measuring and ablation laser apparatus is provided which generally includes an ablating laser, a profilometer laser, an automatic feedback control unit and electro-mechanical positioning apparatus. The combination measuring and ablation laser apparatus can have a single multi-mode laser having an ablating mode and a measuring mode and a positioning means for positioning the laser between ablating and measuring modes. In operation, the profilometer laser measures the thickness of a diamond sample and compares it to the desired thickness. Where the measured thickness is too large, the feedback control unit activates the ablating laser for a predetermined time interval to smoothen any irregularities which may be contributing to the diamond sample thickness. At the end of the time interval, the portion is remeasured by the profilometer laser to determine if it conforms to the desired thickness. If the portion still fails to conform to the desired thickness, the feedback control unit repeats the steps of positioning and activating the ablation laser to further ablate the portion. This process is repeated until the thickness of the portion is equal or less than the desired thickness, after which the same procedure is used on the rest of the diamond sample until a uniform desired thickness is achieved throughout.

    摘要翻译: 提供了一种组合测量和消融激光设备,其通常包括消融激光器,轮廓仪激光器,自动反馈控制单元和机电定位设备。 组合测量和消融激光设备可以具有单个具有消融模式和测量模式的多模激光器,以及用于在激光和测量模式之间定位激光器的定位装置。 在操作中,轮廓仪激光测量金刚石样品的厚度并将其与期望的厚度进行比较。 在测量厚度太大的情况下,反馈控制单元激活烧蚀激光器预定的时间间隔,以平滑可能有助于金刚石样品厚度的任何不规则性。 在时间间隔结束时,通过轮廓仪激光器重新测量该部分,以确定其是否符合所需的厚度。 如果该部分仍然不符合所需的厚度,则反馈控制单元重复定位和激活消融激光器以进一步消融该部分的步骤。 重复该过程直到该部分的厚度等于或小于所需厚度,然后在金刚石样品的其余部分上使用相同的程序,直到达到均匀的所需厚度。