摘要:
The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vandium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..
摘要:
The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..
摘要:
The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium-containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..
摘要:
The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..
摘要:
The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..
摘要:
Precision measuring instruments having highly parallel and wear-resistant contact members and a method for fabricating these contact areas are disclosed. The measuring instruments preferably include two contact members each having diamond coated ceramic substrates. The method for diamond coating the contact members of the measuring instruments includes, for each contact member, preparing a ceramic substrate to high tolerance so that it has two surfaces which are parallel within 0.25 microns, diamond coating one surface of the substrate by any one of several chemical vapor deposition (CVD) techniques, and metalizing the other surface of the substrate for affixing it to the contact member of the measuring instrument. The metalized surface of the substrate is preferably affixed to the contact members of the measuring instrument by brazing, gluing or welding. Preferred embodiments of the measuring instruments with diamond coated contact areas include calipers and micrometers. The provided measuring instruments can be used to measure extremely abrasive materials such as sandpaper and grinding wheels without suffering any appreciable wear to their contact surfaces over a long period of time.
摘要:
Precision measuring instruments having highly parallel and wear-resistant contact members and a method for fabricating these contact areas are disclosed. The measuring instruments preferably include two contact members each having diamond coated ceramic substrates. The method for diamond coating the contact members of the measuring instruments includes, for each contact member, preparing a ceramic substrate to high tolerance so that it has two surfaces which are parallel within 0.25 microns, diamond coating one surface of the substrate by any one of several chemical vapor deposition (CVD) techniques, and metalizing the other surface of the substrate for affixing it to the contact member of the measuring instrument. The metalized surface of the substrate is preferably affixed to the contact members of the measuring instrument by brazing, gluing or welding. Preferred embodiments of the measuring instruments with diamond coated contact areas include calipers and micrometers. The provided measuring instruments can be used to measure extremely abrasive materials such as sandpaper and grinding wheels without suffering any appreciable wear to their contact surfaces over a long period of time.
摘要:
A lead frame and die sub-assembly is first manufactured by a conventional method including bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is stacked first adjacent a dielectric plastic sheet that is in turn stacked against a metal heat spreader block. The dielectric sheet has a centrally located hole registered with the die attach pad. A dollop of an uncured resin is dispensed in the gap between the die attach pad and block. This assembly is compressed between two hot platens whereby the lead fingers, dielectric sheet and the block are bonded together and the resin dollop is flattened to a controlled thickness, namely the thickness of the dielectric sheet. The thickness of the dielectric sheet controls the flattened thickness of the cured resin dollop. After the platens are withdrawn, the local portion of the lead frame having been bonded in the stack is then put into a mold and the stack assembly encapsulated in a thermosetting resin to produce the semiconductor package.
摘要:
An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond or diamond-coated silicon carbide or molybdenum, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate. The thermal connection can be by bonding the pins directly to the substrate.
摘要:
A combination measuring and ablation laser apparatus is provided which generally includes an ablating laser, a profilometer laser, an automatic feedback control unit and electro-mechanical positioning apparatus. The combination measuring and ablation laser apparatus can have a single multi-mode laser having an ablating mode and a measuring mode and a positioning means for positioning the laser between ablating and measuring modes. In operation, the profilometer laser measures the thickness of a diamond sample and compares it to the desired thickness. Where the measured thickness is too large, the feedback control unit activates the ablating laser for a predetermined time interval to smoothen any irregularities which may be contributing to the diamond sample thickness. At the end of the time interval, the portion is remeasured by the profilometer laser to determine if it conforms to the desired thickness. If the portion still fails to conform to the desired thickness, the feedback control unit repeats the steps of positioning and activating the ablation laser to further ablate the portion. This process is repeated until the thickness of the portion is equal or less than the desired thickness, after which the same procedure is used on the rest of the diamond sample until a uniform desired thickness is achieved throughout.