摘要:
A system and method are provided for reliable and customer-friendly delivery of documents. One method of the present invention include the steps of: producing document data for printing documents; accepting requests to print selected documents; determining whether a selected document is accepted for electronic delivery or for non-electronic delivery; printing documents accepted for non-electronic delivery; and electronically delivering documents accepted for electronic delivery.
摘要:
A piñata-like device is formed from cardboard panels and sub-panels. The structure is formed and held together by masking tape which is partially cut, across the seams of the panels and sub-panels. The container has an access opening to facilitate placement of goodies into the cavity. Each panel and sub-panel is provided with a ribbon. By pulling on the ribbons, the panels are frangibly detachable from one another. The strength of the attachment of the ribbons to the panels and sub-panels exceeds the strength of the masking tape holding the panels and sub-panels into a container form. When the ribbons are pulled, preferably substantially simultaneously, the panels substantially detach from one another, and any contents disposed within the cavity are made available, usually in a somewhat explosive manner. An end of each ribbon is passed through one or more slits in each panel and securely attached to a surface of the panel.
摘要:
A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing fluid can flow between the first and second flow systems, and the processing component can impart a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.
摘要:
The invention provides an apparatus for cleaning and drying a container for semiconductor workpieces. The apparatus comprises a load port with a fixture that receives a dirty container and delivers it to a deck assembly with a carrier that removably receives the container for further handling. While the container is received by the carrier, a robot with a first end effector removes the container door and places it on a portion of the carrier. The robot includes a second end effector that engages the carrier and elevates the carrier and container for insertion into a process chamber. The process chamber includes a rotor with at least one receptacle wherein the rotor is rotated to create both high pressure and low pressure regions. Once the container and carrier are loaded into the rotor, the rotor is rotated and means for cleaning injects a processing fluid onto the container and carrier. After a rinse stage and while the rotor is rotating, the means for drying delivers air across the container and carrier. Upon completion of the drying stage, the robot removes both the container and the carrier from the process chamber and reassembles the door to the container such that container can be returned to use.
摘要:
End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.
摘要:
End-effectors and associated control and guidance systems and methods are disclosed. A transfer device in one embodiment includes a base unit, an arm carried by the base unit and movable relative to the base unit, and an end-effector carried by the arm and rotatable relative to the arm. The end-effector includes two grippers, at least one being movable toward and away from the other between a grip position and a release position. A transmission is coupled between a motor and the movable gripper to receive an input force from the motor and apply an output force to the gripper that increases as the gripper moves to the grip position.
摘要:
Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit. The field shaping unit, for example, can be a dielectric assembly coupled to the second outlet to receive the secondary flow and configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container. The field shaping unit can also have at least one electrode compartment through which the secondary flow can pass separately from the primary flow. The electrode is positioned in the electrode compartment.
摘要:
Interchangeable workpiece handling apparatuses and associated tools for processing microfeature workpieces are disclosed. In one embodiment, an apparatus includes a device support having a first alignment surface at an alignment plane. A processing chamber is received in an aperture at the alignment plane. A workpiece handling device is positioned proximate to the processing chamber and includes a workpiece support, a drive unit operatively coupled to the workpiece support to move the workpiece support along a generally linear motion axis, and a mounting portion coupled to the workpiece support and having a second alignment surface removably mated with the first alignment surface. In a particular embodiment, the workpiece handling device is supported relative to the device support only at or above the alignment plane. Accordingly, the workpiece handling device can be easily removed from the device support and need not impede access to components beneath the alignment plane.
摘要:
A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotate assembly is removably and pivotally mounted to an exposed outer surface of the frame. The lift and rotate assembly has a body, a process head movably connected to the body, and control components mounted within the body and configured to move the process head relative to the body. The lift and rotate assembly in one embodiment is positionable in a forward, operating position with the body adjacent to the frame, and in a tilted, service position with the body tilted away from the frame.
摘要:
A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.