公开(公告)号：US20060076241A1

公开(公告)日：2006-04-13

申请号：US10526149

申请日：2003-08-28

申请人： Reinhard Schneider ,  Stephan Kenny ,  Torsten Kussner ,  Wolfgang Plose ,  Bert Reents ,  Heribert Streup

发明人： Reinhard Schneider ,  Stephan Kenny ,  Torsten Kussner ,  Wolfgang Plose ,  Bert Reents ,  Heribert Streup

IPC分类号： C25D5/02 ,  C25D17/04

CPC分类号： C25D17/28 ,  C25D17/06 ,  H05K3/241

摘要： A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

摘要翻译： 在具有非常薄的碱性金属化的印刷电​​路板的电解处理期间的问题是，处理在印刷电路板的表面上的各个区域产生不规则的结果。 在克服这个问题时，本发明提供一种用于电解处理至少表面上导电的工件的装置，其具有至少两个基本相对的侧边缘。 该装置包括用于工件的电流供应装置，所述电流供应装置各自包括位于相对的侧边缘上的接触条，其能够在大致相对的侧边缘处电接触工件。

公开(公告)号：US07767065B2

公开(公告)日：2010-08-03

申请号：US10526149

申请日：2003-08-28

申请人： Reinhard Schneider ,  Stephan Kenny ,  Torsten Küssner ,  Wolfgang Plöse ,  Bert Reents ,  Heribert Streup

发明人： Reinhard Schneider ,  Stephan Kenny ,  Torsten Küssner ,  Wolfgang Plöse ,  Bert Reents ,  Heribert Streup

IPC分类号： C25D17/06 ,  C25D17/02 ,  C25D17/08 ,  C25D21/10

CPC分类号： C25D17/28 ,  C25D17/06 ,  H05K3/241

摘要： A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

摘要翻译： 在具有非常薄的碱性金属化的印刷电​​路板的电解处理期间的问题是，处理在印刷电路板的表面上的各个区域产生不规则的结果。 在克服这个问题时，本发明提供一种用于电解处理至少表面上导电的工件的装置，其具有至少两个基本相对的侧边缘。 该装置包括用于工件的电流供应装置，所述电流供应装置各自包括位于相对的侧边缘上的接触条，其能够在大致相对的侧边缘处电接触工件。

公开(公告)号：US20090236230A1

公开(公告)日：2009-09-24

申请号：US11661704

申请日：2005-08-30

申请人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

发明人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

IPC分类号： C25D5/18

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  C25D7/12 ,  C25D21/12 ,  H05K1/115 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating

摘要翻译： 本发明涉及用金属填充通孔的电镀工艺。 该工艺特别适用于用铜填充印刷电路板的通孔。 该方法包括以下步骤：（i）通过电镀在通孔的中心形成窄部分; 和（ii）通过电镀用金属填充步骤（i）中获得的通孔

公开(公告)号：US09445510B2

公开(公告)日：2016-09-13

申请号：US11661704

申请日：2005-08-30

申请人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

发明人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

IPC分类号： C25D5/18 ,  C25D3/38 ,  C25D21/12 ,  H05K3/42 ,  C25D7/12

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  C25D7/12 ,  C25D21/12 ,  H05K1/115 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

摘要翻译： 本发明涉及用金属填充通孔的电镀工艺。 该工艺特别适用于用铜填充印刷电路板的通孔。 该方法包括以下步骤：（i）通过电镀在通孔的中心形成窄部分; 和（ii）通过电镀用金属填充步骤（i）中获得的通孔。

公开(公告)号：US08784634B2

公开(公告)日：2014-07-22

申请号：US12295513

申请日：2007-03-30

申请人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  René Wenzel ,  Soungsoo Kim

发明人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  René Wenzel ,  Soungsoo Kim

IPC分类号： C25D21/18 ,  C25D5/18 ,  C25D3/38 ,  C25D3/58 ,  H05K3/42

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

摘要翻译： 公开了一种用金属填充工件的空腔，通孔，盲孔或微盲孔的电镀方法。 根据所述方法，将包含空腔，通孔，盲孔或微盲孔的工件与金属沉积电解质接触，并且在工件和至少一个阳极之间施加电压，使得电流 被送入工件。 本发明的方法的特征在于电解质包含氧化还原体系。

公开(公告)号：US20090301889A1

公开(公告)日：2009-12-10

申请号：US12295513

申请日：2007-03-30

申请人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  Rene Wenzel ,  Soungsoo Kim

发明人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  Rene Wenzel ,  Soungsoo Kim

IPC分类号： C25D5/00 ,  C25D5/10

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

摘要翻译： 公开了一种用金属填充工件的空腔，通孔，盲孔或微盲孔的电镀方法。 根据所述方法，将包含空腔，通孔，盲孔或微盲孔的工件与金属沉积电解质接触，并且在工件和至少一个阳极之间施加电压，使得电流 被送入工件。 本发明的方法的特征在于电解质包含氧化还原体系。

公开(公告)号：US20060151328A1

公开(公告)日：2006-07-13

申请号：US10544252

申请日：2004-02-04

申请人： Bert Reents ,  Tafadzwa Magaya

发明人： Bert Reents ,  Tafadzwa Magaya

IPC分类号： C25D5/18

CPC分类号： C25D5/18 ,  C25D5/08 ,  C25D7/12 ,  H01L21/2885 ,  H05K3/423 ,  H05K2203/1492 ,  H05K2203/1572

摘要： In order to electroplate workpieces comprising high-aspect ratio holes a method is disclosed comprising the steps bringing the workpiece and at least one anode into contact with a metal plating electrolyte, and applying a voltage between the workpiece and the anodes, to the effect that a current flow is provided to the workpiece. The current flow is a pulse reverse current flow having a frequency of at most about 6 Hertz. According to the frequency each cycle time comprises at least one forward current pulse and least one reverse current pulse.

摘要翻译： 为了电镀包括高纵横比孔的工件，公开了一种方法，其包括使工件和至少一个阳极与金属电镀电解质接触并在工件和阳极之间施加电压的步骤，使得 向工件提供电流。 电流是具有至多约6赫兹频率的脉冲反向电流。 根据频率，每个周期时间包括至少一个正向电流脉冲和至少一个反向电流脉冲。