photoresist composition
    1.
    发明申请
    photoresist composition 有权
    光致抗蚀剂组合物

    公开(公告)号:US20060128914A1

    公开(公告)日:2006-06-15

    申请号:US11330659

    申请日:2006-01-12

    IPC分类号: C08F220/22

    摘要: A photoresist composition is provided that includes a polymer having at least one acrylate or methacrylate monomer having a formula where R1 represents hydrogen (H), a linear or branched alkyl group of 1 to 20 carbons, or a semi- or perfluorinated linear or branched alkyl group of 1 to 20 carbons; and where R2 represents an unsubstituted aliphatic group or a substituted aliphatic group having zero or one trifluoromethyl (CF3) group attached to each carbon of the substituted aliphatic group, or a substituted or unsubstituted aromatic group; and where R3 represents hydrogen (H), methyl (CH3), trifluoromethyl (CF3), difluoromethyl (CHF2), fluoromethyl (CH2F), or a semi- or perfluorinated aliphatic chain; and where R4 represents trifluoromethyl (CF3), difluoromethyl (CHF2), fluoromethyl (CH2F), or a semi- or perfluorinated substituted or unsubstituted aliphatic group. A method of patterning a substrate using the photoresist composition is also provided herein.

    摘要翻译: 提供了一种光致抗蚀剂组合物,其包括具有至少一个具有下式的丙烯酸酯或甲基丙烯酸酯单体的聚合物,其中R 1表示氢(H),1至20个碳的直链或支链烷基或 1至20个碳的半或全氟化的直链或支链烷基; 其中R 2表示未取代的脂族基团或具有与取代的脂族基团的每个碳上连接的具有0或1个三氟甲基(CF 3 N 3)基团的取代的脂族基团,或 取代或未取代的芳基; 其中R 3表示氢(H),甲基(CH 3),三氟甲基(CF 3),二氟甲基(CHF 2) (CH 2 CO 2),或半或全氟化脂族链; 并且其中R 4表示三氟甲基(CF 3 S),二氟甲基(CH 2)2,氟甲基(CH 2 CH 2) )或半或全氟取代或未取代的脂族基团。 本文还提供了使用光致抗蚀剂组合物图案化衬底的方法。

    Photoresist composition
    2.
    发明申请
    Photoresist composition 失效
    光刻胶组成

    公开(公告)号:US20050019696A1

    公开(公告)日:2005-01-27

    申请号:US10916934

    申请日:2004-08-12

    摘要: A photoresist composition is provided that includes a polymer having at least one acrylate or methacrylate monomer having a formula where R1 represents hydrogen (H), a linear or branched alkyl group of 1 to 20 carbons, or a semi- or perfluorinated linear or branched alkyl group of 1 to 20 carbons; and where R2 represents an unsubstituted aliphatic group or a substituted aliphatic group having zero or one trifluoromethyl(CF3) group attached to each carbon of the substituted aliphatic group, or a substituted or unsubstituted aromatic group; and where R3 represents hydrogen (H), methyl(CH3), trifluoromethyl(CF3), difluoromethyl(CHF2), fluoromethyl (CH2F), or a semi- or perfluorinated aliphatic chain; and where R4 represents trifluoromethyl(CF3), difluoromethyl(CHF2), fluoromethyl(CH2F), or a semi- or perfluorinated substituted or unsubstituted aliphatic group. A method of patterning a substrate using the photoresist composition is also provided herein.

    摘要翻译: 提供了一种光致抗蚀剂组合物,其包括具有至少一个具有下式的丙烯酸酯或甲基丙烯酸酯单体的聚合物:其中R 1表示氢(H),1至20个碳的直链或支链烷基,或半或全氟化线性 或碳原子数为1〜20的支链烷基; 并且其中R 2表示未取代的脂族基团或具有连接在取代的脂族基团的每个碳上的零个或一个三氟甲基(CF 3)基团的取代的脂族基团,或取代或未取代的芳族基团; 并且其中R 3表示氢(H),甲基(CH 3),三氟甲基(CF 3),二氟甲基(CHF 2),氟甲基(CH 2 F)或半或全氟化脂族链; 并且其中R 4表示三氟甲基(CF 3),二氟甲基(CHF 2),氟甲基(CH 2 F)或半或全氟取代或未取代的脂族基团。 本文还提供了使用光致抗蚀剂组合物图案化衬底的方法。

    NEGATIVE RESISTS BASED ON A ACID-CATALYZED ELIMINATION OF POLAR MOLECULES
    3.
    发明申请
    NEGATIVE RESISTS BASED ON A ACID-CATALYZED ELIMINATION OF POLAR MOLECULES 有权
    基于酸性催化消除极性分子的负性电阻

    公开(公告)号:US20070026339A1

    公开(公告)日:2007-02-01

    申请号:US10449181

    申请日:2003-05-29

    IPC分类号: G03C1/00

    摘要: The present invention provides polymers that are useful in negative resist compositions. Polymers of the present invention comprise (1) a first monomer having a polar functional group; (2) a second monomer; and optionally, (3) a third monomer that imparts at least one characteristic selected from crosslinkable functionality, etch resistance, and solubility modulation. The first monomer provides an acid catalyzed polarity switch upon elimination of the polar functional group, whereas, the second monomer provides aqueous dissolution. The polymers of the present invention may be incorporated into negative resist compositions, which may also include photoacid generators, crosslinking agents, basic compounds, solvents, dissolution accelerators, photobase generators, latent basic compounds, surfactants, adhesion promoters, and anti-foaming agents.

    摘要翻译: 本发明提供了可用于负性抗蚀剂组合物的聚合物。 本发明的聚合物包含(1)具有极性官能团的第一单体; (2)第二单体; 和(3)赋予选自可交联官能团,耐蚀刻性和溶解度调制中的至少一种特性的第三单体。 第一单体在消除极性官能团时提供酸催化的极性开关,而第二单体提供水溶解。 本发明的聚合物可以并入负性抗蚀剂组合物,其还可以包括光酸产生剂,交联剂,碱性化合物,溶剂,溶解促进剂,光碱产生剂,潜碱性化合物,表面活性剂,粘合促进剂和消泡剂。

    Negative resists based on acid-catalyzed elimination of polar molecules
    4.
    发明申请
    Negative resists based on acid-catalyzed elimination of polar molecules 失效
    基于酸催化消除极性分子的负电阻

    公开(公告)号:US20070259274A1

    公开(公告)日:2007-11-08

    申请号:US11820862

    申请日:2007-06-20

    IPC分类号: G03C1/705 G03C5/16

    摘要: The present invention provides polymers that are useful in negative resist compositions. Polymers of the present invention comprise (1) a first monomer having a polar functional group; (2) a second monomer; and optionally, (3) a third monomer that imparts at least one characteristic selected from crosslinkable functionality, etch resistance, and solubility modulation. The first monomer provides an acid catalyzed polarity switch upon elimination of the polar functional group, whereas, the second monomer provides aqueous dissolution. The polymers of the present invention may be incorporated into negative resist compositions, which may also include photoacid generators, crosslinking agents, basic compounds, solvents, dissolution accelerators, photobase generators, latent basic compounds, surfactants, adhesion promoters, and anti-foaming agents.

    摘要翻译: 本发明提供了可用于负性抗蚀剂组合物的聚合物。 本发明的聚合物包含(1)具有极性官能团的第一单体; (2)第二单体; 和(3)赋予选自可交联官能团,耐蚀刻性和溶解度调制中的至少一种特性的第三单体。 第一单体在消除极性官能团时提供酸催化的极性开关,而第二单体提供水溶解。 本发明的聚合物可以并入负性抗蚀剂组合物,其还可以包括光酸产生剂,交联剂,碱性化合物,溶剂,溶解促进剂,光碱产生剂,潜碱性化合物,表面活性剂,粘合促进剂和消泡剂。

    ADVANCED CHEMICALLY AMPLIFIED RESIST FOR SUB 30NM DENSE FEATURE RESOLUTION
    8.
    发明申请
    ADVANCED CHEMICALLY AMPLIFIED RESIST FOR SUB 30NM DENSE FEATURE RESOLUTION 有权
    先进的化学放大电阻,用于30NM密度特征分辨率

    公开(公告)号:US20070248908A1

    公开(公告)日:2007-10-25

    申请号:US11380098

    申请日:2006-04-25

    IPC分类号: G03C1/00

    CPC分类号: G03F7/0392 G03F7/38

    摘要: The present invention discloses a chemically amplified (CA) resist composition for printing features having a dimension of about 30 nm or less and a method of forming a material structure having a pattern containing features having a dimension of about 30 nm or less by using the inventive CA resist. The CA resist composition comprises (a) about 1 to about 50 weight % of a copolymer, (b) about 0.02 to about 25 weight % of a photoacid generator, (c) about 47 to about 99 weight % of a solvent, and (d) about 0.004 to about 25 weight % of a base additive. The copolymer comprises at least one hydrophilic monomer unit containing one or more polar functional groups and at least one hydrophobic monomer unit containing one or more aromatic groups. Some, but not all, of the one or more polar functional groups in the copolymer are protected with acid labile moieties having a low activation energy.

    摘要翻译: 本发明公开了一种用于印刷尺寸为约30nm或更小的特征的化学放大(CA)抗蚀剂组合物,以及通过使用本发明形成具有尺寸为约30nm或更小的特征的图案的材料结构的方法 CA抗拒。 CA抗蚀剂组合物包含(a)约1至约50重量%的共聚物,(b)约0.02至约25重量%的光酸产生剂,(c)约47至约99重量%的溶剂和( d)约0.004至约25重量%的基础添加剂。 共聚物包含至少一个含有一个或多个极性官能团的亲水性单体单元和至少一个含有一个或多个芳族基团的疏水性单体单元。 共聚物中一个或多个极性官能团的一些但不是全部由具有低活化能的酸不稳定部分保护。

    Antireflective hardmask and uses thereof
    9.
    发明申请
    Antireflective hardmask and uses thereof 有权
    防反射硬质掩模及其用途

    公开(公告)号:US20050042538A1

    公开(公告)日:2005-02-24

    申请号:US10646307

    申请日:2003-08-22

    摘要: Antireflective hardmask compositions and techniques for the use of antireflective hardmask compositions for processing of semiconductor devices are provided. In one aspect of the invention, an antireflective hardmask layer for lithography is provided. The antireflective hardmask layer comprises a carbosilane polymer backbone comprising at least one chromophore moiety and at least one transparent moiety; and a crosslinking component. In another aspect of the invention, a method for processing a semiconductor device is provided. The method comprises the steps of: providing a material layer on a substrate; forming an antireflective hardmask layer over the material layer. The antireflective hardmask layer comprises a carbosilane polymer backbone comprising at least one chromophore moiety and at least one transparent moiety; and a crosslinking component.

    摘要翻译: 提供了用于半导体器件加工的抗反射硬掩模组​​合物的抗反射硬掩模组​​合物和技术。 在本发明的一个方面,提供了用于光刻的抗反射硬掩模层。 抗反射硬掩模层包含含有至少一个发色团部分和至少一个透明部分的碳硅烷聚合物主链; 和交联组分。 在本发明的另一方面,提供一种用于处理半导体器件的方法。 该方法包括以下步骤:在衬底上提供材料层; 在材料层上形成抗反射硬掩模层。 抗反射硬掩模层包含含有至少一个发色团部分和至少一个透明部分的碳硅烷聚合物主链; 和交联组分。

    Antireflective Hardmask and Uses Thereof
    10.
    发明申请
    Antireflective Hardmask and Uses Thereof 有权
    防反射硬掩模及其用途

    公开(公告)号:US20070105363A1

    公开(公告)日:2007-05-10

    申请号:US11614799

    申请日:2006-12-21

    IPC分类号: H01L21/4763

    摘要: Antireflective hardmask compositions and techniques for the use of antireflective hardmask compositions for processing of semiconductor devices are provided. In one aspect of the invention, an antireflective hardmask layer for lithography is provided. The antireflective hardmask layer comprises a carbosilane polymer backbone comprising at least one chromophore moiety and at least one transparent moiety; and a crosslinking component. In another aspect of the invention, a method for processing a semiconductor device is provided. The method comprises the steps of: providing a material layer on a substrate; forming an antireflective hardmask layer over the material layer. The antireflective hardmask layer comprises a carbosilane polymer backbone comprising at least one chromophore moiety and at least one transparent moiety; and a crosslinking component.

    摘要翻译: 提供了用于半导体器件加工的抗反射硬掩模组​​合物的抗反射硬掩模组​​合物和技术。 在本发明的一个方面,提供了用于光刻的抗反射硬掩模层。 抗反射硬掩模层包含含有至少一个发色团部分和至少一个透明部分的碳硅烷聚合物主链; 和交联组分。 在本发明的另一方面,提供一种用于处理半导体器件的方法。 该方法包括以下步骤:在衬底上提供材料层; 在材料层上形成抗反射硬掩模层。 抗反射硬掩模层包含含有至少一个发色团部分和至少一个透明部分的碳硅烷聚合物主链; 和交联组分。