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1.发明授权Bonding pad for thermocompression bonding, process for producing a bonding pad and component 有权用于热压接合的接合垫，用于生产焊盘和部件的工艺公开(公告)号：US09281280B2
公开(公告)日：2016-03-08
申请号：US13954649
申请日：2013-07-30
申请人： Robert Bosch GmbH
CPC分类号： H01L23/564 , B81B7/007 , B81C2201/019 , B81C2203/035 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/11462 , H01L2224/1147 , H01L2224/1181 , H01L2224/11825 , H01L2224/13011 , H01L2224/13022 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13644 , H01L2224/13647 , H01L2224/13664 , H01L2224/13669 , H01L2224/27462 , H01L2224/2747 , H01L2224/2781 , H01L2224/27825 , H01L2224/29011 , H01L2224/29022 , H01L2224/29035 , H01L2224/29124 , H01L2224/29147 , H01L2224/29155 , H01L2224/29166 , H01L2224/29181 , H01L2224/29186 , H01L2224/29562 , H01L2224/2957 , H01L2224/29644 , H01L2224/29647 , H01L2224/29664 , H01L2224/29669 , H01L2224/32227 , H01L2224/73103 , H01L2224/73203 , H01L2224/81193 , H01L2224/81203 , H01L2224/8183 , H01L2224/83193 , H01L2224/83203 , H01L2224/8383 , H01L2224/9211 , H01L2924/00013 , H01L2924/1461 , H05K1/111 , H05K3/4007 , H01L2924/00012 , H01L2924/00014 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/01015 , H01L2924/01042 , H01L2924/01046 , H01L2924/01005 , H01L2924/01027 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/81205
摘要： A bonding pad for thermocompression bonding of a carrier material to a further carrier material includes a base layer and a top layer. The base layer is made of metal, is deformable, and is connected to the carrier material. The metal is nickel-based. The top layer is metallic and is connected directly to the base layer. The top layer is arranged at least on a side of the base layer which faces away from the carrier material. The top layer has a smaller layer thickness than the base layer. In at least one embodiment, the top layer has a greater oxidation resistance than the base layer.
摘要翻译： 用于将载体材料热压接合到另外的载体材料的接合焊盘包括基层和顶层。 基层由金属制成，可变形，并与载体材料连接。 金属为镍基。 顶层是金属的，并直接连接到基层。 顶层至少布置在基层的远离载体材料的一侧上。 顶层具有比基层更薄的层厚度。 在至少一个实施方案中，顶层具有比基层更高的抗氧化性。
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2.发明申请METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, AND BONDING PAD 审中-公开用于制造用于热压结合的粘合垫的方法和粘合垫公开(公告)号：US20140035167A1
公开(公告)日：2014-02-06
申请号：US13954346
申请日：2013-07-30
申请人： Robert Bosch GmbH
CPC分类号： H01L21/4814 , B81B7/007 , B81B2207/095 , B81C2203/0118 , B81C2203/019 , H01L23/48 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/02379 , H01L2224/0239 , H01L2224/0401 , H01L2224/05008 , H01L2224/05023 , H01L2224/05073 , H01L2224/05124 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05548 , H01L2224/05568 , H01L2224/05569 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/08148 , H01L2224/08221 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11825 , H01L2224/13008 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13564 , H01L2224/1357 , H01L2224/13647 , H01L2224/27825 , H01L2224/29011 , H01L2224/29023 , H01L2224/29035 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/29564 , H01L2224/2957 , H01L2224/29647 , H01L2224/3003 , H01L2224/30051 , H01L2224/33517 , H01L2224/73103 , H01L2224/73203 , H01L2224/81011 , H01L2224/81013 , H01L2224/81193 , H01L2224/81203 , H01L2224/8183 , H01L2224/83011 , H01L2224/83013 , H01L2224/83193 , H01L2224/83203 , H01L2224/8383 , H01L2224/9211 , H01L2924/1461 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01029 , H01L2924/01079 , H01L2924/01013 , H01L2924/04941 , H01L2924/04953
摘要： A method produces a bonding pad for thermocompression bonding. The method includes providing a carrier material having semiconductor structures, wherein an outermost edge layer of the carrier material is a wiring metal layer configured to make electrical contact with the semiconductor structures. The method also includes depositing a single-layered bonding metal layer directly on a surface of the wiring metal layer to produce the bonding pad.
摘要翻译： 一种方法产生用于热压接的接合焊盘。 该方法包括提供具有半导体结构的载体材料，其中载体材料的最外边缘层是配置为与半导体结构电接触的布线金属层。 该方法还包括在布线金属层的表面上直接沉积单层结合金属层以产生接合焊盘。
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3.发明申请BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A BONDING PAD AND COMPONENT 有权用于热连接接头的接合垫，用于生产粘接垫和部件的方法公开(公告)号：US20140035168A1
公开(公告)日：2014-02-06
申请号：US13954649
申请日：2013-07-30
申请人： Robert Bosch GmbH
CPC分类号： H01L23/564 , B81B7/007 , B81C2201/019 , B81C2203/035 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/11462 , H01L2224/1147 , H01L2224/1181 , H01L2224/11825 , H01L2224/13011 , H01L2224/13022 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13644 , H01L2224/13647 , H01L2224/13664 , H01L2224/13669 , H01L2224/27462 , H01L2224/2747 , H01L2224/2781 , H01L2224/27825 , H01L2224/29011 , H01L2224/29022 , H01L2224/29035 , H01L2224/29124 , H01L2224/29147 , H01L2224/29155 , H01L2224/29166 , H01L2224/29181 , H01L2224/29186 , H01L2224/29562 , H01L2224/2957 , H01L2224/29644 , H01L2224/29647 , H01L2224/29664 , H01L2224/29669 , H01L2224/32227 , H01L2224/73103 , H01L2224/73203 , H01L2224/81193 , H01L2224/81203 , H01L2224/8183 , H01L2224/83193 , H01L2224/83203 , H01L2224/8383 , H01L2224/9211 , H01L2924/00013 , H01L2924/1461 , H05K1/111 , H05K3/4007 , H01L2924/00012 , H01L2924/00014 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/01015 , H01L2924/01042 , H01L2924/01046 , H01L2924/01005 , H01L2924/01027 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/81205
摘要： A bonding pad for thermocompression bonding of a carrier material to a further carrier material includes a base layer and a top layer. The base layer is made of metal, is deformable, and is connected to the carrier material. The metal is nickel-based. The top layer is metallic and is connected directly to the base layer. The top layer is arranged at least on a side of the base layer which faces away from the carrier material. The top layer has a smaller layer thickness than the base layer. In at least one embodiment, the top layer has a greater oxidation resistance than the base layer.
摘要翻译： 用于将载体材料热压接合到另外的载体材料的接合焊盘包括基层和顶层。 基层由金属制成，可变形，并与载体材料连接。 金属为镍基。 顶层是金属的，并直接连接到基层。 顶层至少布置在基层的远离载体材料的一侧上。 顶层具有比基层更薄的层厚度。 在至少一个实施方案中，顶层具有比基层更高的抗氧化性。
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