公开(公告)号：US07307775B2

公开(公告)日：2007-12-11

申请号：US10167361

申请日：2002-06-11

申请人： Satayadev R. Patel ,  Andrew G. Huibers ,  Steve Chiang ,  Robert M. Duboc ,  Thomas J. Grobelny ,  Hung Nan Chen ,  Dietrich Dehlinger ,  Peter W. Richards ,  Hongqin Shi ,  Anthony Sun

发明人： Satayadev R. Patel ,  Andrew G. Huibers ,  Steve Chiang ,  Robert M. Duboc ,  Thomas J. Grobelny ,  Hung Nan Chen ,  Dietrich Dehlinger ,  Peter W. Richards ,  Hongqin Shi ,  Anthony Sun

IPC分类号： G02B26/00

CPC分类号： B81B7/0077 ,  B81B2201/042 ,  B81C1/00269 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  G02B26/0841 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.

摘要翻译： 公开了投影系统，空间光调制器和用于形成MEMS器件的方法。 空间光调制器可以具有与包括微镜阵列的基板中的一个结合在一起的两个基板。 在一个或两个晶片上沉积吸气材料和固体或液体润滑剂之后，两个基底可以在晶片级结合。 如果需要，晶片可以密封在一起，并且两个基板之间的压力可以低于大气。

公开(公告)号：US07380947B2

公开(公告)日：2008-06-03

申请号：US10894703

申请日：2004-07-19

申请人： Robert M. Duboc ,  Andrew G. Huibers

发明人： Robert M. Duboc ,  Andrew G. Huibers

IPC分类号： G03B21/00 ,  G03B21/26 ,  G03B21/20 ,  G03B21/28 ,  G02F1/1335

CPC分类号： H04N5/7416 ,  G03B21/2053 ,  H04N5/63 ,  H04N9/3141

摘要： Disclosed herein is a method of operating display systems with reduction of the warm-up time of an arc lamp in the event of an accidental or unintentional turn-off.

摘要翻译： 本文公开了一种在意外或无意关闭的情况下操作显示系统的方法，其减少了电弧灯的预热时间。

公开(公告)号：US06844959B2

公开(公告)日：2005-01-18

申请号：US10305509

申请日：2002-11-26

申请人： Andrew G. Huibers ,  Satyadev R. Patel ,  Robert M. Duboc, Jr.

发明人： Andrew G. Huibers ,  Satyadev R. Patel ,  Robert M. Duboc, Jr.

IPC分类号： B81B3/00 ,  B81B7/04 ,  G02B26/08 ,  G02B26/00 ,  B32B9/00 ,  G09G3/34

CPC分类号： G02B26/0841 ,  B82Y30/00 ,  Y10T428/30

摘要： A projection system, a spatial light modulator, and a method for forming micromirrors are disclosed. A substrate comprises circuitry and electrodes for electrostatically deflecting micromirror elements that are disposed within an array of such elements forming the spatial light modulator. In one embodiment, the substrate is a silicon substrate having circuitry and electrodes thereon for electrostatically actuating adjacent micromirror elements, and the substrate is fully or selectively covered with a light absorbing material.

摘要翻译： 公开了投影系统，空间光调制器和用于形成微镜的方法。 衬底包括用于静电偏转微镜元件的电路和电极，微镜元件设置在形成空间光调制器的这种元件的阵列内。 在一个实施例中，衬底是具有电路和电极的硅衬底，用于静电地驱动相邻的微镜元件，并且衬底被完全或选择性地覆盖有光吸收材料。

公开(公告)号：US08693082B2

公开(公告)日：2014-04-08

申请号：US12853411

申请日：2010-08-10

申请人： Satyadev Patel ,  Andrew G. Huibers ,  Peter Richards ,  Terry Tarn ,  Dietrich Dehlinger

发明人： Satyadev Patel ,  Andrew G. Huibers ,  Peter Richards ,  Terry Tarn ,  Dietrich Dehlinger

IPC分类号： G02B26/00 ,  G02B26/08

CPC分类号： G02B26/0841 ,  B81C3/001 ,  Y10S359/90 ,  Y10T156/10

摘要： The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

摘要翻译： 本发明提供了一种微结构器件，其包括多个衬底，其中器件的部件形成在衬底上。 为了保持基板之间的间隙的均匀性，提供并分布在间隙中的多个支柱以防止间隙尺寸的减小。 可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。 或者，可以通过将间隙内的压力维持在微结构将在其中操作的压力以下来防止间隙尺寸的增加。 形成微反射镜和电极的基板的电接触可以通过许多方式制成，例如电接触区域，电接触焊盘和电接触弹簧。

公开(公告)号：US07586668B2

公开(公告)日：2009-09-08

申请号：US11094087

申请日：2005-03-29

申请人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

发明人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC分类号： G02B26/00 ,  G02B26/08

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US07449358B2

公开(公告)日：2008-11-11

申请号：US11093927

申请日：2005-03-29

申请人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

发明人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC分类号： H01L21/00

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

摘要翻译： 公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。 除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。 该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。

公开(公告)号：US07286278B2

公开(公告)日：2007-10-23

申请号：US11102204

申请日：2005-04-07

申请人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

发明人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC分类号： G02B26/00 ,  G02B5/08 ,  G03B21/00 ,  G03B21/28 ,  H01L21/00

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

摘要翻译： 公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。 除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。 该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。

公开(公告)号：US07198982B2

公开(公告)日：2007-04-03

申请号：US11093550

申请日：2005-03-29

申请人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

发明人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steve S. Chiang

IPC分类号： H01L21/06 ,  H01L21/00

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

公开(公告)号：US07041224B2

公开(公告)日：2006-05-09

申请号：US10104109

申请日：2002-03-22

申请人： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald ,  Hongqin Shi ,  Andrew G. Huibers ,  Peter Heureux

发明人： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald ,  Hongqin Shi ,  Andrew G. Huibers ,  Peter Heureux

IPC分类号： B81C1/00

CPC分类号： B81C1/00 ,  B81B2201/045 ,  B81C1/00476 ,  B81C1/00531 ,  B81C1/00595 ,  B81C99/0025 ,  B81C2201/0138 ,  B82Y30/00 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/32135

摘要： The etching of a material in a vapor phase etchant is disclosed where a vapor phase etchant is provided to an etching chamber at a total gas pressure of 10 Torr or more, preferably 20 Torr or even 200 Torr or more. The vapor phase etchant can be gaseous acid etchant, a noble gas halide or an interhalogen. The sample/workpiece that is etched can be, for example, a semiconductor device or MEMS device, etc. The material that is etched/removed by the vapor phase etchant is preferably silicon and the vapor phase etchant is preferably provided along with one or more diluents. Another feature of the etching system includes the ability to accurately determine the end point of the etch step, such as by creating an impedance at the exit of the etching chamber (or downstream thereof) so that when the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber. A first plasma or wet chemical etch (or both) can be performed prior to the vapor phase etch.

公开(公告)号：US06969635B2

公开(公告)日：2005-11-29

申请号：US10005308

申请日：2001-12-03

申请人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steven S. Chiang

发明人： Satyadev R. Patel ,  Andrew G. Huibers ,  Steven S. Chiang

IPC分类号： B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  H01L21/44

CPC分类号： B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

摘要翻译： 公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。 除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。 该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。