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    Flat panel display with magnetic focusing layer
    3.
    发明授权
    Flat panel display with magnetic focusing layer 失效
    带有磁性聚焦层的平板显示器

    公开(公告)号：US6008577A

    公开(公告)日：1999-12-28

    申请号：US980637

    申请日：1997-12-01

    申请人： Robert T. Rasmussen ,  Charles M. Watkins ,  Surjit S. Chadha

    发明人： Robert T. Rasmussen ,  Charles M. Watkins ,  Surjit S. Chadha

    IPC分类号： H01J29/68 ,  H01J31/12 ,  H01J1/30 ,  H01J1/54

    CPC分类号： H01J29/68 ,  H01J31/126

    摘要： A flat panel display includes a magnetic material for focusing electrons onto a faceplate or phosphors of each pixel on a screen. In one embodiment, a display screen includes a faceplate having a magnetic material (30) deposited thereon. In an alternate embodiment, a field emission display including a substrate (11) with a cathode conductor (12); electron emitting tips (13) disposed over the cathode conductor (12); an insulator (14) disposed around the electron emitting tips (13); a conductive gate (15) over the insulator (14); and a magnetic material layer (19) for focusing electrons emitted from the emitting tips (13).

    摘要翻译： 平板显示器包括用于将电子聚焦到屏幕上的每个像素的面板或荧光体上的磁性材料。 在一个实施例中，显示屏幕包括其上沉积有磁性材料（30）的面板。 在替代实施例中，包括具有阴极导体（12）的衬底（11）的场致发射显示器。 设置在阴极导体（12）上的电子发射尖端（13）; 设置在电子发射尖端（13）周围的绝缘体（14）; 绝缘体（14）上的导电栅极（15）; 以及用于聚焦从发射尖端（13）发射的电子的磁性材料层（19）。

    LIGHT EMITTING DEVICES WITH BUILT-IN CHROMATICITY CONVERSION AND METHODS OF MANUFACTURING
    7.
    发明申请
    LIGHT EMITTING DEVICES WITH BUILT-IN CHROMATICITY CONVERSION AND METHODS OF MANUFACTURING 有权
    具有内置色度转换的发光装置和制造方法

    公开(公告)号：US20120298950A1

    公开(公告)日：2012-11-29

    申请号：US13116366

    申请日：2011-05-26

    申请人： Cem Basceri ,  Thomas Gehrke ,  Charles M. Watkins

    发明人： Cem Basceri ,  Thomas Gehrke ,  Charles M. Watkins

    IPC分类号： H01L33/04 ,  H01L33/58 ,  H01L33/02

    CPC分类号： H01L33/0075 ,  H01L33/005 ,  H01L33/06 ,  H01L33/08 ,  H01L33/38 ,  H01L33/502 ,  H01L33/508 ,  H01L2933/0033 ,  H01L2933/0041

    摘要： Various embodiments of light emitting devices with built-in chromaticity conversion and associated methods of manufacturing are described herein. In one embodiment, a method for manufacturing a light emitting device includes forming a first semiconductor material, an active region, and a second semiconductor material on a substrate material in sequence, the active region being configured to produce a first emission. A conversion material is then formed on the second semiconductor material. The conversion material has a crystalline structure and is configured to produce a second emission. The method further includes adjusting a characteristic of the conversion material such that a combination of the first and second emission has a chromaticity at least approximating a target chromaticity of the light emitting device.

    摘要翻译： 本文描述了具有内置色度转换和相关制造方法的发光器件的各种实施例。 在一个实施例中，制造发光器件的方法包括依次在衬底材料上形成第一半导体材料，有源区和第二半导体材料，所述有源区被配置为产生第一发射。 然后在第二半导体材料上形成转换材料。 转换材料具有晶体结构并且被配置为产生第二发射。 该方法还包括调整转换材料的特性，使得第一和第二发射的组合具有至少近似于发光器件的目标色度的色度。

    METHOD FOR FORMING A LIGHT CONVERSION MATERIAL
    8.
    发明申请
    METHOD FOR FORMING A LIGHT CONVERSION MATERIAL 有权
    形成光转换材料的方法

    公开(公告)号：US20110217800A1

    公开(公告)日：2011-09-08

    申请号：US12716014

    申请日：2010-03-02

    申请人： Charles M. Watkins ,  Kevin Tetz ,  Thomas Gehrke

    发明人： Charles M. Watkins ,  Kevin Tetz ,  Thomas Gehrke

    IPC分类号： H01L21/56 ,  B05C11/02

    CPC分类号： H01L33/44 ,  H01L33/507 ,  H01L2933/0041

    摘要： A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.

    摘要翻译： 公开了一种用于制造发光二极管（LED）的光转换结构的方法和系统。 该方法包括在LED芯片上形成透明的隔热盖。 该方法还包括将转换材料分配到盖上以在盖上形成转化涂层，并且将密封剂中的LED，硅树脂盖和转化膜封装。 可以添加额外的盖子和转换涂层。

    MICROELECTRONIC WORKPIECE PROCESSING SYSTEMS AND ASSOCIATED METHODS OF COLOR CORRECTION
    9.
    发明申请
    MICROELECTRONIC WORKPIECE PROCESSING SYSTEMS AND ASSOCIATED METHODS OF COLOR CORRECTION 有权
    微电子工件加工系统及相关的颜色校正方法

    公开(公告)号：US20110217794A1

    公开(公告)日：2011-09-08

    申请号：US12715820

    申请日：2010-03-02

    申请人： Kevin Tetz ,  Charles M. Watkins

    发明人： Kevin Tetz ,  Charles M. Watkins

    IPC分类号： H01L21/66 ,  B05C11/00

    CPC分类号： H01L33/005 ,  B05C11/00

    摘要： Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.

    摘要翻译： 本文公开了半导体系统的几个实施例和颜色校正的相关联的方法。 在一个实施例中，一种制造发光二极管（LED）的方法包括在衬底上形成（LED），测量形成的LED的基极发射特性，并且基于所形成的LED的测量的基极发射特性来选择荧光体 使得来自LED和磷光体的组合发射至少近似于白光。 该方法还包括通过例如喷墨印刷将所选择的荧光体引入到LED上。

    Packaged microelectronic imagers and methods of packaging microelectronic imagers
    10.
    发明授权
    Packaged microelectronic imagers and methods of packaging microelectronic imagers 有权
    封装的微电子成像器和包装微电子成像器的方法

    公开(公告)号：US07858429B2

    公开(公告)日：2010-12-28

    申请号：US11863087

    申请日：2007-09-27

    申请人： Salman Akram ,  Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  William M. Hiatt

    发明人： Salman Akram ,  Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  William M. Hiatt

    IPC分类号： H01L21/00 ,  G02F1/13

    CPC分类号： H01L27/146 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/148 ,  H01L31/02016 ,  H01L2224/48227 ,  H01L2924/01046 ,  H01L2924/01066 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

    摘要： Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.

    摘要翻译： 本文公开了微电子成像器，用于封装微电子成像器的方法，以及用于在微电子成像器中形成导电晶片间互连的方法。 在一个实施例中，微电子成像管芯可以包括微电子衬底，集成电路和电耦合到集成电路的图像传感器。 接合焊盘由衬底承载并电耦合到集成电路。 导电晶片互连延伸穿过衬底并与接合焊盘接触。 互连可以包括完全延伸穿过衬底和接合焊盘的通道，沉积到通道中并与衬底接触的电介质衬垫，沉积在电介质衬垫的至少一部分上的第一和第二导电层以及导电 在第二导电层的至少一部分上沉积到通道中并且电耦合到接合焊盘的填充材料。