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公开(公告)号：US20240098899A1
公开(公告)日：2024-03-21
申请号：US18244983
申请日：2023-09-12
CPC分类号： H05K1/141 , H05K1/0209 , H05K1/112
摘要： An electrical module and a circuit board arrangement including an electrical module are disclosed. The electrical module includes an upper side and an underside, the upper side having four rectangularly arranged side edges, an electrical component embedded in the electrical module, and at least three electrical solder pads formed on the upper side configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer. The solder pads of the electrical module are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or the solder pads are arranged axially symmetrically on the upper side of the electrical module, and/or the solder pads extend along two opposite side edges on the upper side of the electrical module.
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公开(公告)号：US20240038651A1
公开(公告)日：2024-02-01
申请号：US18227895
申请日：2023-07-28
发明人： Stanley BUCHERT , Uwe WALTRICH
IPC分类号： H01L23/498 , H01L23/00 , H01L21/48 , H05K3/34
CPC分类号： H01L23/49838 , H01L24/20 , H01L21/4846 , H05K3/3436 , H01L2224/215 , H01L2224/211 , H01L2924/01029 , H01L23/3121
摘要： A circuit board arrangement includes a circuit board having an upper side and an underside, and an electrical module having an upper side and an underside. The upper side of the electrical module is arranged on the underside of the circuit board. The electrical module includes a solder pad that is in electrical contact via a solder layer with an associated solder pad of the circuit board. The electrical module includes a metallization layer located at a distance from the upper side, an electrical component that is arranged on the metallization layer and is electrically connected thereto, and at least one via extending from the solder pad on the upper side of the electrical module up to the metallization layer. A solder resist is partially arranged on the solder pad such that the at least one via, applied to the solder pad, is shielded from the solder.
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公开(公告)号：US20240145323A1
公开(公告)日：2024-05-02
申请号：US18484304
申请日：2023-10-10
发明人： Uwe WALTRICH , Stanley BUCHERT
IPC分类号： H01L23/15 , H01L23/00 , H01L23/367 , H01L23/373 , H01L23/498
CPC分类号： H01L23/15 , H01L23/3675 , H01L23/3735 , H01L23/49822 , H01L24/32 , H01L2224/32146 , H01L2224/32165 , H01L2924/13055 , H01L2924/13091 , H05K2201/0355
摘要： An electrical module and a method of producing such an electrical module are disclosed. The electrical module includes: a ceramic circuit carrier, an electrical component arranged on the ceramic circuit carrier, and a substrate having a potting material, wherein the ceramic circuit carrier and the electrical component are arranged in the substrate. The electrical module has an upper side that forms electrical contact areas. and stepped metal structures arranged on the upper side of the electrical module. Each metal structure has regions of different thickness. The metal structures form on their upper side in each case one of the electrical contact areas of the electrical module and contact on their underside in a region of increased thickness in each case one of the electrical contacts on the upper side of the electrical component.
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4.发明公开公开(公告)号：US20240105548A1
公开(公告)日：2024-03-28
申请号：US18372085
申请日：2023-09-23
发明人： Uwe WALTRICH
CPC分类号： H01L23/4006 , H01L24/20 , H01L25/115 , H05K1/181 , H05K3/284 , H01L23/49838 , H01L2224/214
摘要： A circuit board arrangement includes a circuit board having an upper side and an underside, and an electrical module, having an upper side and an underside, that is arranged with its upper side on the underside of the circuit board. The circuit board arrangement also includes a heat sink, means for providing a pressure, with which the underside of the electrical module is pressed against the heat sink, and a heat-conducting material that is arranged between the underside of the electrical module and the heat sink. The at least one electrical module is embedded in an encapsulating material that terminates with the underside of the electrical module without covering the underside of the electrical module. The encapsulating material is provided and configured to press the heat-conducting material against the heat sink in a region adjacent to the electrical module.
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公开(公告)号：US20240268027A1
公开(公告)日：2024-08-08
申请号：US18569529
申请日：2022-06-15
发明人： Stanley BUCHERT , Uwe WALTRICH
CPC分类号： H05K1/144 , H05K3/0091 , H05K3/022 , H05K3/101 , H05K2201/041
摘要： A circuit board is disclosed that includes a plurality of circuit board layers located one on top of the other. The plurality of circuit board layers includes a topmost circuit board layer and a bottommost circuit board layer, wherein the topmost circuit board layer forms a top of the circuit board, wherein the bottommost circuit board layer forms a bottom of the circuit board, and wherein the plurality of circuit board layers together forms an end circuit-board edge that runs perpendicularly to the top and the bottom of the circuit board. The end circuit-board edge is provided with a coating made of an insulating material.
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公开(公告)号：US20240098872A1
公开(公告)日：2024-03-21
申请号：US18274376
申请日：2022-01-21
发明人： Uwe WALTRICH
IPC分类号： H05K1/02
CPC分类号： H05K1/0201 , H05K2201/066
摘要： The disclosure relates to an electronic device including a thermally and electrically conductive transmission element configured to dissipate heat from a heat source, wherein the transmission element is at a first electric potential and includes rounded edges. The electronic device further includes a heat sink at a second electric potential and an electrically insulating layer arranged between the heat sink and the transmission element in order to connect the transmission element to the heat sink in a thermally conductive manner.
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公开(公告)号：US20240057255A1
公开(公告)日：2024-02-15
申请号：US18229816
申请日：2023-08-03
发明人： Stanley BUCHERT , Uwe WALTRICH
CPC分类号： H05K1/144 , H05K3/1283 , H05K3/022 , H05K1/181 , H05K2201/0212 , H05K2203/125
摘要： A method for producing a circuit board arrangement includes: providing a first board in which electrical components and electrical contacts assigned thereto are integrated and include upper first contact surfaces and lower second contact surfaces; providing a second board in which ceramic substrates are integrated and include upper third contact surfaces; providing a multi-layered circuit board that forms lower fourth contact surfaces; simultaneously connecting the upper side of the first board to the lower side of the circuit board and the upper side of the second board to the lower side of the first board, wherein the upper first contact surfaces of the first board are connected to the lower fourth contact surfaces of the circuit board by a first sintering layer, and the lower second contact surfaces of the first board are connected to the upper third contact surfaces of the second board by a second sintering layer.
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公开(公告)号：US20230389229A1
公开(公告)日：2023-11-30
申请号：US18203609
申请日：2023-05-30
发明人： Stanley BUCHERT , Uwe WALTRICH
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , H05K7/20409 , H05K2201/066
摘要： A circuit board arrangement includes a circuit board that has an upper side and an underside, at least one electrical component that is arranged on the underside of the circuit board, and a heat sink that has a cavity, into which the electrical component projects. In this case, the circuit board lies on the cavity and covers the cavity. The cavity of the heat sink is sealed such that neither particles nor a fluid may escape from or enter the cavity between the circuit board and the heat sink.
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