摘要:
An electrically erasable programmable read-only memory is disclosed which has programmable memory cells connected to parallel bit lines provided above a semiconductor substrate. The memory cells include NAND cell blocks each of which has a series array of memory cell transistors. Parallel word lines are connected to the control gates of the memory cell transistors, respectively. In a data write mode, a selection transistor in a certain NAND cell block including a selected memory cell is rendered conductive to connect the certain cell block to a corresponding bit line associated therewith. Under such a condition, electrons are tunnel-injected into a floating gate of the selected memory cell transistor, and the threshold value of the certain transistor is increased to be a positive value. A logical data is thus written in the selected memory cell transistor. The data in the selected cell transistor is erased by discharging carriers accumulated in the floating gate thereof to its drain or the substrate, so that the threshold value of the certain transistor is decreased to be a negative value.
摘要:
A NAND cell type EEPROM has parallel data transmission lines formed above a substrate, and a memory cell section including a plurality of NAND type cell units containing a NAND type cell unit that is associated with a certain bit line of the bit lines. This NAND type cell unit has a series-circuit of a preselected number of data storage transistors with control gates, and a selection transistor. A substrate voltage-stabilizing layer is insulatively provided above the substrate and positioned in the field area in adjacent to the certain bit line. The conductive layer is connected to the substrate by a contact portion so that the substrate voltage can be constantly set to a preselected voltage potential of a fixed value during the NAND type cell unit is being subjected to the write and erase modes.
摘要:
An erasable programmable read-only memory with NAND cell structure includes NAND cell blocks, each of which has a selection transistor connected to the corresponding bit line and a series array of memory cell transistors, and a switching transistor connected between the series array of memory cell transistors and ground. Each cell transistor has a floating gate and a control gate. Word lines are connected to the control gates of the cell transistors. In a data writing mode, a selection transistor of a certain cell block containing a selected cell is rendered conductive, so that this cell block is connected to the corresponding bit line. Under such a condition, a decoder circuit stores a desired data (a logic "one" e.g.) in the selected cell, by applying an "H" level voltage to the bit line, applying an "L" level voltage to a word line connected to the selected cell, applying the "H" level voltage to a memory cell or cells positioned between the selected cell and the bit line, and applying the "L" level voltage to a memory cell or cells positioned between the selected cell and the ground. The selection transistor and switching transistor for a corresponding series array of memory cell transistors have different channel lengths to reduce punch through.
摘要:
An erasable programmable read-only memory with NAND cell structure is disclosed which includes NAND cell blocks each of which has a selection transistor connected to a corresponding bit line and a series array of memory cell transistors. Each cell transistor has a floating gate and a control gate. Word lines are connected to the control gates of the cell transistors. In a data erase mode all the memory cells are simultaneously erased by applying a "H" level potential to the control gates of the memory cells and a "L" level potential to the bit lines. Prior to such a simultaneous erase, charges are removed from charge accumulation layers of the memory cells so that the threshold values of the memory cells are initialized. The threshold initialization is performed on the series-arrayed memory cell transistors in the NAND cell block in sequence.
摘要:
An erasable programmable read-only memory with NAND cell structure is disclosed which has memory cells provided on a N type substrate. The memory cells are divided into NAND cell blocks each of which has a series array of memory cell transistors. Each of the transistors has a floating gate, a control gate connected to a word line and N type diffusion layers serving as its source and drain. These semiconductor layers are formed in a P type well layer formed in a surface area of a substrate. The well layer serves as a surface breakdown prevention layer. During a data erase mode data stored in all the memory cells are erased simultaneously. During the data write mode subsequent to the erase mode, when a certain NAND cell block is selected, memory cells in the NAND cell block are subjected to data writing in sequence. When data is written into a certain memory cell in the selected NAND cell block, a control gate of the certain memory cell is supplied with a voltage which is so high as to form a strong electric field to allow the tunneling of electrons between the floating gate of the memory cell and the well layer. Consequently, only the selected cell can be written into.
摘要:
An erasable programmable read-only memory with a NAND cell structure including NAND cell blocks, each of which has a selection transistor connected to the corresponding bit line and memory cell transistors connected is series. Word lines are connected to control gates of the cell transistors. In a data write mode, a selection transistor of a certain cell block containing a selected cell is rendered conductive to connect the cell block to the corresponding bit line. A control circuit is provided for applying an "L" Level voltage (approximately O V) to a word line connected to the selected cell, applying an "H" level voltage (approximately 20 V) to a word line or word lines positioned between the selected word line and a contact node connecting the cell block and a specific bit line associated therewith, applying a voltage corresponding to data to be written to the specific bit line, and applying an intermediate voltage between the "H" and "L" level voltages to non-selected bit lines, thereby writing the data in the selected cell by tunneling. If the data is logic "0" data, the intermediate voltage is applied also to the specific bit line.
摘要:
An erasable programmable read-only memory (EPROM) with a NAND cell structure includes NAND cell blocks, each of which has a selection transistor connected to the corresponding bit line and memory cell transistors connected in series. Word lines are connected to control gates of the cell transistors. In a data write mode, a selection transistor of a certain cell block containing a selected cell is rendered conductive to connect the cell block to the corresponding bit line. A control circuit is provided for applying an "L" level voltage (approximately 0 V) to a word line connected to the selected cell, applying an "H" level voltage (approximately 20 V) to a word line or word lines positioned between the selected word line and a contact node connecting the cell block and a specific bit line associated therewith, applying a voltage corresponding to data to be written to the specific bit line, and applying an intermediate voltage between the "H" and "L" level voltages to non-selected bit lines, thereby writing the data in the selected cell by tunneling. If the data is logic "0" data, the intermediate voltage is applied also to the specific bit line.
摘要:
An erasable programmable read-only memory with NAND cell structure is disclosed which has memory cells provided on a N type substrate. The memory cells are divided into NAND cell blocks each of which has a series array of memory cell transistors. Each of the transistors has a floating gate, a control gate connected to a word line and N type diffusion layers serving as its source and drain. These semiconductor layers are formed in a P type well layer formed in a surface area of a substrate. The well layer serves as a surface breakdown prevention layer. During a data erase mode data stored in all the memory cells are erased simultaneously. During the data write mode subsequent to the erase mode, when a certain NAND cell block is selected, memory cells in the NAND cell block are subjected to data writing in sequence. When data is written into a certain memory cell in the selected NAND cell block, a control gate of the certain memory cell is supplied with a voltage which is so high as to form a strong electric field to allow the tunneling of electrons between the floating gate of the memory cell and the well layer. Consequently, only the selected cell can be written into.
摘要:
The present invention relates to a non-volatile semiconductor memory having non-volatile memory cells capable of electrically erasing and writing data. Each memory cell has a floating gate formed on the surface of the semiconductor substrate above the channel region, and a control gate. The floating gate partially covers the channel region. Each memory cell is thereby constructed of a parallel connection of a floating gate transistor and an enhancement type transistor. The floating gate transistor is displaced in one of the widthwise directions of the channel region, or partially covers only the central portion of the channel region in the widthwise direction thereof. A plurality of memory cells are connected in series to constitute a basic block. Adjacent basic blocks are separated by an enhancement type MOS transistor. In this memory, a memory cell (floating gate) and an enhancement type MOS transistor (gate) are formed in self alignment with each other using the same mask. In addition, in this memory, a control gate and a floating gate are formed in self alignment with each other using the same mask.
摘要:
The present invention relates to a non-volatile semiconductor memory having non-volatile memory cells capable of electrically erasing and writing data. Each memory cell has a floating gate formed on the surface of the semiconductor substrate above the channel region, and a control gate. The floating gate partially covers the channel region. Each memory cell is thereby constructed of a parallel connection of a floating gate transistor and an enhancement type transistor. The floating gate transistor is displaced in one of the widthwise directions of the channel region, or partially covers only the central portion of the channel region in the widthwise direction thereof. A plurality of memory cells are connected in series to constitute a basic block. Adjacent basic blocks are separated by an enhancement type MOS transistor. In this memory, a memory cell (floating gate) and an enhancement type MOS transistor (gate) are formed in self alignment with each other using the same mask. In addition, in this memory, a control gate and a floating gate are formed in self alignment with each other using the same mask.