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    COIL COMPONENT
    1.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20240145160A1

    公开(公告)日：2024-05-02

    申请号：US18374300

    申请日：2023-09-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun Kim ,  Dong Hwan Lee ,  Dong Jin Lee ,  Boum Seock Kim

    IPC: H01F27/29 ,  H01F27/02 ,  H01F27/34

    CPC classification number: H01F27/292 ,  H01F27/022 ,  H01F27/34

    Abstract: A coil component includes a body including a first surface and a second surface opposing each other and first to fourth side surfaces connecting the first and second surfaces; a first coil disposed within the body and including a first lead-out portion and a second lead-out portion extending to at least one of the first to fourth side surfaces of the body; a second coil disposed within the body and including a third lead-out portion and a fourth lead-out portion extending to at least one of the first to fourth side surfaces of the body; first to fourth external electrodes disposed on two adjacent side surfaces of the first to fourth side surfaces of the body and respectively connected to the first to fourth lead-out portions.

    COIL ELECTRONIC COMPONENT
    3.
    发明申请
    COIL ELECTRONIC COMPONENT 有权

    公开(公告)号：US20250022650A1

    公开(公告)日：2025-01-16

    申请号：US18634352

    申请日：2024-04-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Donghwan Lee ,  Dong Jin Lee ,  Soonkwang Kwon ,  Tae Hyun Kim ,  Daehyung You

    IPC: H01F27/28 ,  H01F27/26 ,  H01F27/29 ,  H01F27/30

    Abstract: A coil electronic component may include a magnetic body that has a first surface and a second surface facing each other, a first coil embedded in the magnetic body and wound around a first core, a second coil embedded in the magnetic body and wound around a second core that is spaced apart from the first core, a first external electrode and a second external electrode disposed on the second surface of the magnetic body and connected to the first coil, and a third external electrode and a fourth external electrode disposed on the second surface of the magnetic body and connected to the second coil, and a first distance from the first coil and the second coil to the first surface is larger than a second distance from the first coil and the second coil to the second surface.

    Microphone package and mounting structure thereof
    6.
    发明授权
    Microphone package and mounting structure thereof 有权
    麦克风包装及其安装结构

    公开(公告)号：US09120668B2

    公开(公告)日：2015-09-01

    申请号：US14268536

    申请日：2014-05-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Woo Park ,  Jong Woo Han ,  Tae Hyun Kim

    IPC: B81B3/00 ,  B81B7/00 ,  B81B7/02

    CPC classification number: B81B7/0077 ,  B81B7/0061 ,  B81B2201/0257

    Abstract: There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.

    Abstract translation: 提供了麦克风封装及其安装结构，允许增加背部体积，麦克风封装包括：封装基板; 声学元件，其安装在所述封装基板上并且具有形成在其下部的空间; 以及安装在所述封装基板上并具有形成在其下部的空间的至少一个电子部件，其中所述封装基板包括连接所述声学元件的空间和所述电子部件的空间的声学体积。

    UNIT POWER MODULE AND POWER MODULE PACKAGE COMPRISING THE SAME
    8.
    发明申请
    UNIT POWER MODULE AND POWER MODULE PACKAGE COMPRISING THE SAME 有权
    单元功率模块和功率模块包装盒

    公开(公告)号：US20140117408A1

    公开(公告)日：2014-05-01

    申请号：US13782859

    申请日：2013-03-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

    Inventor： Tae Hyun Kim ,  Bum Seok Suh ,  Do Jae Yoo ,  Kwang Soo Kim

    IPC: H01L27/07

    CPC classification number: H01L24/34 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.

    Abstract translation: 这里公开了一种单位功率模块，包括：第一半导体芯片，其具有一个表面，其上形成有与第1-1电极间隔开的第1-1电极和第1-2电极，另一个表面在 形成有第1-3电极的第二半导体芯片，形成有第2-1电极的一个表面的第二半导体芯片和形成有第2-2电极的另一表面，第一金属板接触 第一半导体芯片的第1-1电极和第二半导体芯片的第2-1电极，与第一半导体芯片的第1-2电极接触并与第一半导体芯片间隔开的第二金属板 与第一半导体芯片的第1-3电极和第二半导体芯片的第2-2电极接触的第三金属板和形成为围绕第一金属板，第二金属板， 和第三金属板。

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