公开(公告)号：US20140054072A1

公开(公告)日：2014-02-27

申请号：US13800715

申请日：2013-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Sang Hyun Shin ,  Hye Suk Shin ,  Joon Seok Kang

IPC: H05K1/05

CPC classification number: H05K1/05 ,  H05K1/0256 ,  H05K1/053 ,  H05K1/09 ,  H05K3/287

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate; an Insulating layer formed on one surface or both surfaces of the base substrate; an electrode layer formed on a top surface of the insulating layer; and an insulating film covering a surface of the insulating layer except for a bonding surface between the electrode layer and the insulating layer so as to secure high dielectric breakdown voltage while keeping high thermal conductivity.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：基底; 绝缘层，形成在所述基底基板的一个表面或两个表面上; 形成在所述绝缘层的上表面上的电极层; 以及绝缘膜，覆盖除了电极层和绝缘层之间的接合面以外的绝缘层的表面，以便确保高绝缘击穿电压同时保持高导热性。

公开(公告)号：US20140187112A1

公开(公告)日：2014-07-03

申请号：US14140160

申请日：2013-12-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Hyun Shin ,  Joon Seok Kang ,  Jang Bae Son ,  Kwang Jik Lee ,  Hye Sook Shin ,  Hyun Chul Jung

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/05

CPC classification number: H05K1/0366 ,  B32B5/00 ,  B32B15/00 ,  C08J5/047 ,  C08J5/06 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0203 ,  H05K2201/0129 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T442/2861 ,  Y10T442/2926 ,  Y10T442/2951 ,  Y10T442/2992 ,  Y10T442/3415

Abstract: Disclosed herein are a prepreg, including: an inorganic fiber, an organic fiber, or a hybrid fiber obtained by mix-weaving the inorganic fiber and the organic fiber, coated with a thermally conductive component or impregnated with a thermally conductive component; and a cross-linkable resin for impregnating the fiber therewith, a method for manufacturing the same, and a copper clad laminate using the same, so that the prepreg and the copper clad laminate can maintain a low coefficient of thermal expansion and a high modulus of elasticity and have excellent heat radiation property.

Abstract translation: 本发明公开了一种预浸料坯，其包括无机纤维，有机纤维或混合编织无机纤维和有机纤维的复合纤维，所述无机纤维和有机纤维涂覆有导热组分或浸渍有导热组分; 以及用于浸渍纤维的可交联树脂，其制造方法和使用其的覆铜层压板，使得预浸料和覆铜层压板可以保持低的热膨胀系数和高模量 弹性好，散热性好。

公开(公告)号：US20140034358A1

公开(公告)日：2014-02-06

申请号：US13956302

申请日：2013-07-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kwang Jik Lee ,  Sang Hyun Shin ,  Hye Suk Shin ,  Joon Seok Kang

IPC: H05K1/02 ,  H05K3/02

CPC classification number: H05K1/0271 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/02 ,  H05K3/4644 ,  H05K2203/1142

Abstract: Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same.

Abstract translation: 这里公开了电极图案及其制造方法，以及应用电极图案的印刷电路板及其制造方法。 为了增加散热效果，这里公开了包括具有预定图案的电极层的电极图案; 绝缘子彼此绝缘，其中绝缘体由金属氧化物制成，其制造方法和应用电极图案的印刷电路板及其制造方法。

公开(公告)号：US20140353004A1

公开(公告)日：2014-12-04

申请号：US14270131

申请日：2014-05-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Chul Jung ,  Joon Seok Kang ,  Jang Bae Son ,  Sang Hyun Shin ,  Kwang Jik Lee ,  Hye Sook Shin

IPC: H05K1/03 ,  B05D3/00 ,  C08K3/22 ,  C08K3/38 ,  C08K3/36

CPC classification number: H05K1/0373 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/14 ,  C08K3/16 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08K3/38 ,  C08K2003/164 ,  C08K2003/221 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/003 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0266 ,  C08L63/00

Abstract: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.

Abstract translation: 本发明公开了一种用于印刷电路板的绝缘树脂组合物，其包括：环氧树脂，导热率为20W / mK以上的第一无机填料和相对介电常数小于10的第二无机填料，以及绝缘膜， 预浸料和印刷电路板。

公开(公告)号：US20140187674A1

公开(公告)日：2014-07-03

申请号：US13831693

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik Lee ,  Joon Seok Kang ,  Jang Bae Son ,  Sang Hyun Shin ,  Hye Sook Shin ,  Hyun Chul Jung

IPC: C09J185/02 ,  C09J163/00

CPC classification number: C09J185/02 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/00 ,  C08J2367/02 ,  C08K3/042 ,  C08K3/20 ,  C08L63/00 ,  C08L67/02 ,  C09J163/00

Abstract: This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.

Abstract translation: 本发明涉及具有提高散热性能的树脂组合物，包括液晶低聚物，环氧树脂或其树脂混合物，以及作为填料的氧化石墨烯，以及电子设备用散热膜， 用于印刷电路板的绝缘膜和使用该树脂组合物制造的预浸料。

公开(公告)号：US20140174792A1

公开(公告)日：2014-06-26

申请号：US13845831

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Bae Son ,  Joon Seok Kang ,  Sang Hyun Shin ,  Kwang Jik Lee ,  Hye Sook Shin ,  Hyun Chul Jung

IPC: H01B3/30 ,  H05K1/02

CPC classification number: H01B3/305 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4676 ,  H05K2201/0141 ,  H05K2201/0209

Abstract: This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a hydrophilic compound with a hydrophobic compound.

Abstract translation: 本发明涉及一种具有改进导热性的印刷电路板用绝缘膜及其制造方法和使用该绝缘膜的印刷电路板，其中该绝缘膜包括通过化学方法沿厚度方向形成垂直结构的两亲性嵌段共聚物 将亲水性化合物与疏水化合物偶联。