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    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    1.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    复合电子元件及其相应的板

    公开(公告)号：US20160133386A1

    公开(公告)日：2016-05-12

    申请号：US14869935

    申请日：2015-09-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Soo PARK ,  Kyoung Jin JUN ,  Young Ghyu AHN ,  Heung Kil PARK

    IPC: H01G4/40 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H01G4/40 ,  H01G2/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H05K3/301 ,  H05K3/321 ,  H05K3/3431 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/2045 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.

    Abstract translation: 复合电子部件包括多层陶瓷电容器和陶瓷电子部件彼此结合的复合体。 所述多层陶瓷电容器包括：第一陶瓷体，其包含电介质层和内部电极，所述内部电极具有介于其间的介质层中的至少一个; 以及设置在第一陶瓷体的第一和第二端部上的第一和第二外部电极。 陶瓷电子部件包括：第二陶瓷体，其与多层陶瓷电容器的下部连接并由陶瓷制成; 以及第一和第二端子电极，其设置在第二陶瓷体的第一和第二端部并且连接到第一和第二外部电极，并且多层陶瓷电容器和陶瓷电子部件具有不同的长度。

    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    5.
    发明申请
    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    具有相同功能的电子元件和板

    公开(公告)号：US20160217926A1

    公开(公告)日：2016-07-28

    申请号：US15003614

    申请日：2016-01-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kyoung Jin JUN ,  Su Jung KIM ,  Young Ghyu AHN ,  Sang Soo PARK ,  Heung Kil PARK ,  Soon Ju LEE

    IPC: H01G4/228 ,  H01G4/30

    CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/30

    Abstract: An electronic component and a board having the same are provided. The electronic component according to an exemplary embodiment in the present disclosure may include a body having upper and lower surfaces, first and second side surfaces, and third and fourth side surfaces; external electrodes disposed on at least one of the upper and lower surfaces and the third and fourth side surfaces of the body; and connection terminals disposed on the external electrodes, wherein the connection terminals are disposed inwardly to be spaced apart from an edge of a surface of the body on which the connection terminals are disposed.

    Abstract translation: 提供电子部件和具有该电子部件的电路板。 根据本公开的示例性实施例的电子部件可以包括具有上表面和下表面的主体，第一和第二侧表面以及第三和第四侧表面; 设置在所述主体的上表面和下表面以及所述第三和第四侧表面中的至少一个上的外部电极; 以及设置在外部电极上的连接端子，其中连接端子向内设置成与设置有连接端子的主体的表面的边缘间隔开。

    LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
    6.
    发明申请
    LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME 审中-公开
    层叠电子元件和电路板，用于安装它们

    公开(公告)号：US20170011854A1

    公开(公告)日：2017-01-12

    申请号：US15065521

    申请日：2016-03-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Seung Hyun RA ,  Kyoung Jin JUN ,  Sang Soo PARK ,  Young Key KIM ,  Soon Ju LEE

    IPC: H01G4/38 ,  H01G4/12 ,  H05K1/11 ,  H01G4/30 ,  H05K1/18 ,  H01G4/012 ,  H01G4/228

    CPC classification number: H01G4/38 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/10015

    Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

    Abstract translation: 层叠电子部件包括：第一电容器，包括第一陶瓷体，设置在第一陶瓷体的上表面和下表面上的第一外部电极;以及第一外部电极，设置在第一陶瓷的上表面和下表面上的第一外部电极 以及包括第二陶瓷体的第二电容器和设置在第二陶瓷体的下表面上的第三外部电极和在第二陶瓷体的下表面上与第三外部电极分离的第四外部电极，以及 设置在第一电容器上并电连接到第一电容器。 形成通过第一陶瓷体的上表面和第二陶瓷体的下表面的电流环。

    MULTILAYER CERAMIC COMPONENT AND BOARD HAVING THE SAME
    7.
    发明申请
    MULTILAYER CERAMIC COMPONENT AND BOARD HAVING THE SAME 有权
    多层陶瓷组件和板

    公开(公告)号：US20160217928A1

    公开(公告)日：2016-07-28

    申请号：US14940946

    申请日：2015-11-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil PARK ,  Young Ghyu AHN ,  Sang Soo PARK ,  Soon Ju LEE ,  Kyoung Jin JUN ,  So Yeon SONG

    IPC: H01G4/30 ,  H05K1/18 ,  H05K1/11 ,  H01G4/005

    CPC classification number: H05K1/111 ,  H01G2/06 ,  H01G4/228

    Abstract: A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed therebetween, and first and second external electrodes respectively including first and second connection portions, and first and second band portions extended from the first and second connection portions, and first and second metal frames respectively including first and second upper horizontal portions, first and second lower horizontal portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions, respectively.

    Abstract translation: 多层陶瓷组件包括多层陶瓷电容器，其包括陶瓷体，陶瓷体包括介于其间的各介电层的多个第一和第二内部电极，以及分别包括第一和第二连接部分的第一和第二外部电极，以及第一和第二带状部分延伸 以及第一和第二金属框架，分别包括第一和第二上部水平部分，第一和第二下部水平部分，以及第一和第二倾斜支撑部分，其对角地连接第一和第二上部水平部分以及第一和第二上部水平部分， 分别为第二下部水平部分。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    8.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    多层陶瓷电子元件及其相应的板

    公开(公告)号：US20160126013A1

    公开(公告)日：2016-05-05

    申请号：US14880049

    申请日：2015-10-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil PARK ,  Kyoung Jin JUN ,  Soon Ju LEE ,  So Yeon SONG

    IPC: H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/012 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045

    Abstract: A multilayer ceramic electronic component includes: a plurality of active parts disposed to be distinguishable from each other in a stacking direction, wherein internal electrodes of an upper active part include protrusion portions which correspond to band portions of external electrodes and extend in a width direction, and internal electrodes of a lower active part positioned to be adjacent to a mounting surface include recess portions which correspond to the band portions of the external electrodes and are recessed in the width direction.

    Abstract translation: 多层陶瓷电子部件包括：多个有源部，其被布置为在层叠方向上彼此区分，其中，上部有源部的内部电极包括与外部电极的带状部分对应并在宽度方向上延伸的突出部， 位于与安装面相邻的下部有源部的内部电极具有与外部电极的带状部分对应且在宽度方向上凹陷的凹部。

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