公开(公告)号：US12040805B2

公开(公告)日：2024-07-16

申请号：US17853148

申请日：2022-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoyoung Shin ,  Bora Kim ,  Junho Kim

IPC: G06F7/58 ,  H03K19/173 ,  H03L7/081 ,  H03L7/083 ,  H03L7/099 ,  H03L7/107

CPC classification number: H03L7/0996 ,  G06F7/582 ,  H03K19/1737 ,  H03L7/0818 ,  H03L7/083 ,  H03L7/1077

Abstract: A random number generator includes a ring oscillator, an inversion selecting circuit, and controller. The ring oscillator includes an inverter chain having at least one inverter and generates an output signal. The inversion selecting circuit controlling a phase inverter configured to invert a signal of the inverter chain. The controller is configured to operate the inversion selecting circuit to provide an output of the first phase inverter to the inverter chain during a first operation mode to measure a frequency of the ring oscillator and operate the inversion selecting circuit to not provide the output of the phase inverter during a second operation mode for generating a random number.

公开(公告)号：US11974391B2

公开(公告)日：2024-04-30

申请号：US17573156

申请日：2022-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyoon Seo ,  Hwanwook Park ,  Dohyung Kim ,  Bora Kim ,  Seungyeong Lee ,  Wonseop Lee ,  Yunho Lee ,  Yejin Cho

IPC: H05K1/02 ,  G11C11/4076 ,  H05K1/11

CPC classification number: H05K1/0268 ,  G11C11/4076 ,  H05K1/11 ,  H05K1/116 ,  H05K2201/09445 ,  H05K2201/09481 ,  H05K2201/10159

Abstract: A PCB includes a plurality of layers spaced apart in a vertical direction, a first detection pattern and a second detection pattern and pads connected to the first detection pattern and the second detection pattern. The first detection pattern and the second detection pattern are provided in a respective one of a first layer and a second layer adjacent to each other such that the first detection pattern and the second detection pattern are opposed to each other. The pads are provided in an outmost layer. Each of the first detection pattern and the second detection includes at least one main segment extending in at least one of first and second horizontal directions and a diagonal direction. A time domain reflectometry connected to a pair of pads detects a misalignment of the PCB by measuring differential characteristic impedance of the first detection pattern and the second detection pattern.

公开(公告)号：US10319735B2

公开(公告)日：2019-06-11

申请号：US15455667

申请日：2017-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suk Koo Hong ,  Miyeong Kang ,  Hyosung Lee ,  Kyoungyong Cho ,  Bora Kim ,  Hyeji Kim ,  Sunkak Jo

IPC: H01L21/311 ,  H01L27/11582 ,  H01L21/28 ,  H01L27/11556 ,  G03F7/039 ,  G03F7/075 ,  G03F7/09 ,  H01L21/027 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575

Abstract: Embodiments of the inventive concept provide a method for manufacturing a semiconductor device. The method includes forming a stack structure by alternately and repeatedly stacking insulating layers and sacrificial layers on a substrate, sequentially forming a first lower layer and a first photoresist pattern on the stack structure, etching the first lower layer using the first photoresist pattern as an etch mask to form a first lower pattern. A first part of the stack structure is etched to form a stepwise structure using the first lower pattern as an etch mask. The first lower layer includes a novolac-based organic polymer, and the first photoresist pattern includes a polymer including silicon.