ONE-TIME PROGRAMMABLE MEMORY DEVICES AND METHODS

    公开(公告)号:US20240321371A1

    公开(公告)日:2024-09-26

    申请号:US18355357

    申请日:2023-07-19

    CPC classification number: G11C17/165 G11C17/18 H10B20/25

    Abstract: An apparatus is provided that includes a memory cell having a reversible resistance-switching memory element coupled in series with a selector element. The selector element has a first resistance. The resistance-switching memory element is configured to reversibly switch between a second resistance and a third resistance. The memory cell may be selectively configured as either a re-writeable memory cell or a one-time programmable memory cell. The memory cell functions as a one-time programmable memory cell regardless of whether the resistance-switching memory element has the second resistance, the third resistance, or is electrically shorted.

    Methods and apparatus for programming barrier modulated memory cells

    公开(公告)号:US10354724B2

    公开(公告)日:2019-07-16

    申请号:US15706562

    申请日:2017-09-15

    Abstract: A memory device is provided that includes a memory controller coupled to a memory array. The memory controller is adapted to perform a closed loop training interval and perform an open loop programming interval. The closed loop training interval determines a corresponding first state successful voltage and a corresponding second state successful voltage for a first group of memory cells each including a barrier modulated switching structure. The open loop programming interval programs a second group of memory cells each including a barrier modulated switching structure to a first state and a second state using the corresponding first state successful voltage and the corresponding second state successful voltage, respectively.

    Methods and apparatus for three-dimensional nonvolatile memory

    公开(公告)号:US10109680B1

    公开(公告)日:2018-10-23

    申请号:US15622100

    申请日:2017-06-14

    Abstract: A method is provided that includes forming a word line above a substrate, forming a bit line above the substrate, forming a nonvolatile memory material between the word line and the bit line, the nonvolatile memory material including a semiconductor material layer and a conductive oxide material layer, forming a barrier material layer between the semiconductor material layer and the conductive oxide material layer, and forming a memory cell including the nonvolatile memory material at an intersection of the bit line and the word line. The word line is disposed in a first direction, the bit line is disposed in a second direction perpendicular to the first direction. The barrier material layer has an ionic conductivity of greater than about 0.1 Siemens/cm @ 1000° C.

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