公开(公告)号：US20240294731A1

公开(公告)日：2024-09-05

申请号：US18575176

申请日：2022-07-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Qing WANG ,  Qianfa LIU ,  Dongliang LIU ,  Jinchao DONG ,  Songgang CHAI ,  Yongjing XU ,  Yanhua ZHANG

IPC: C08K3/36 ,  C08J5/24 ,  C08L63/00 ,  C09J163/00

CPC classification number: C08K3/36 ,  C08J5/247 ,  C08L63/00 ,  C09J163/00 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2433/24 ,  C08J2461/06 ,  C08J2467/00 ,  C08K2201/005

Abstract: A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.

公开(公告)号：US20240425730A1

公开(公告)日：2024-12-26

申请号：US18385287

申请日：2023-10-30

Applicant: SHENGYI TECHNOLOGY CO.,LTD.

Inventor： Zengbiao HUANG ,  Jianlong HUANG ,  Yanhua ZHANG

IPC: C09J157/00 ,  C08K5/14 ,  C08K5/23 ,  C08K9/06 ,  C09J11/06

Abstract: The present application provides a resin composition, and the resin composition comprises the following components: (A) a resin containing unsaturated bonds, (B) an initiator, and (C) an inorganic filler which has been subjected to surface treatment by a silane coupling agent; the silane coupling agent contains a structure shown in formula (I). In the present application, the inorganic filler is subjected to surface treatment by a silane coupling agent containing the structure shown in formula (I), which can improve the binding force at the interface between the inorganic filler and the unsaturated resin matrix, and the prepared insulating adhesive film has excellent dielectric properties, good dielectric stability, and a small change amplitude of ΔDf (10 GHz) after HAST, which can be applied to a high-frequency and high-speed printed circuit board prepared by a semi-additive process or additive process.

公开(公告)号：US20240218217A1

公开(公告)日：2024-07-04

申请号：US18525254

申请日：2023-11-30

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Jinchao DONG ,  Naidong SHE ,  Yanhua ZHANG ,  Junqi TANG

IPC: C09J163/00 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09J7/30

CPC classification number: C09J163/00 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09J7/30 ,  C08K2201/005 ,  C08L2203/30 ,  C09J2400/10 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2479/08

Abstract: Thermosetting resin composition and insulating adhesive film. The thermosetting resin composition comprises 30-70 parts of epoxy resin, 5-500 parts of a modified spherical silica powder, and 30-70 parts of a curing agent; the modified spherical silica powder comprises an amino-modified spherical silica powder with a D50 particle size of 0.1-2.0 μm and a coefficient of variation of ≥35% in particle size distribution. By using modified spherical silica powder in epoxy resin system and controlling its D50 particle size and coefficient of variation in particle size distribution, the resin composition can reduce melt viscosity of high-filling system and achieve a low melt viscosity in an insulating adhesive film conducive to the filling of fine circuits. The resin composition for preparation of a build-up adhesive FC-BGA film of a high-filling system has strong bite-etching resistance, low surface roughness after Desmear treatment, high adhesive force with electroless copper and low dielectric loss.

公开(公告)号：US20240287282A1

公开(公告)日：2024-08-29

申请号：US18575212

申请日：2022-07-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Naidong SHE ,  Qianfa LIU ,  Zengbiao HUANG ,  Yongjing XU ,  Songgang CHAI ,  Yanhua ZHANG

IPC: C08K3/36 ,  C08J5/24 ,  C09D7/40 ,  C09D7/61 ,  C09J7/30 ,  C09J11/04 ,  H05K1/03

CPC classification number: C08K3/36 ,  C08J5/244 ,  C08J5/249 ,  C09D7/61 ,  C09D7/68 ,  C09D7/69 ,  C09J7/30 ,  C09J11/04 ,  C08J2363/00 ,  C08K2201/005 ,  C09J2400/166 ,  C09J2463/00 ,  H05K1/0366

Abstract: The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silicon dioxide prepared by means of organosilicon hydrolysis, the average particle diameter D50 of the silicon dioxide being 0.1-3 μm, the ratio of D100:D10 thereof being less than or equal to 2.5, and the purity of the silicon dioxide being greater than 99.9%. The resin composition of the present invention can make prepared adhesive films and resin-coated copper foils have relatively high tensile strength and peel strength, relatively good drilling processability, controllable fluidity, good filling ability, and higher electric strength, and can achieve finer line processing ability; it is a printed circuit board material applicable to multilayer laminates, especially a printed circuit board material for multilayer laminates of thin lines.