Resist composition and patterning process

    公开(公告)号:US12050402B2

    公开(公告)日:2024-07-30

    申请号:US17082233

    申请日:2021-01-21

    IPC分类号: G03F7/004 G03F7/20

    CPC分类号: G03F7/0045 G03F7/2004

    摘要: A resist composition containing: (A) a resin containing a repeating unit having an acid-labile group and further containing at least one repeating unit having an aromatic substituent; (B) a photo-acid generator shown by a general formula (B-1); and (C) a solvent, where W1 represents a cyclic divalent hydrocarbon group having 4 to 12 carbon atoms with a heteroatom; W2 represents a cyclic monovalent hydrocarbon group having 4 to 14 carbon atoms without a heteroatom; Rf represents a divalent organic group shown by the following general formula; and M+ represents an onium cation. This provides a resist composition and a patterning process of using it that show a particularly favorable mask dimension dependency and CDU in photolithography where a light source is a high-energy beam such as a KrF excimer laser beam, an electron beam, or an extreme ultraviolet ray.

    Resist composition and patterning process

    公开(公告)号:US11340527B2

    公开(公告)日:2022-05-24

    申请号:US17082175

    申请日:2020-10-28

    摘要: A resist composition containing: (A) a resin containing a repeating unit having an acid-labile group and not containing a repeating unit having an aromatic substituent; (B) a photo-acid generator shown by a general formula (B-1); and (C) a solvent, where W1 represents a cyclic divalent hydrocarbon group having 4 to 12 carbon atoms and containing a heteroatom; W2 represents a cyclic monovalent hydrocarbon group having 4 to 14 carbon atoms and not containing a heteroatom; Rf represents a divalent organic group shown by the following general formula; and M+ represents an onium cation. This provides a resist composition and a patterning process that uses the resist composition that show a particularly favorable mask dimension dependency (mask error factor: MEF), LWR, and critical dimension uniformity (CDU) particularly in photolithography where a high-energy beam such as an ArF excimer laser beam is used as a light source.

    SULFONIUM SALT, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS
    7.
    发明申请
    SULFONIUM SALT, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS 有权
    硫酸盐,聚合物,耐腐蚀组合物和模式过程

    公开(公告)号:US20140272707A1

    公开(公告)日:2014-09-18

    申请号:US14172355

    申请日:2014-02-04

    IPC分类号: G03F7/039 G03F7/20

    摘要: A sulfonium salt having formula (1a) is provided wherein R1 is H, F, CH3 or CF3, R1a to R1m are each independently H or a monovalent hydrocarbon group, L is a single bond or divalent hydrocarbon group, X is a divalent alkylene group optionally substituted with fluorine, and n is 0 or 1. The sulfonium salt having a polymerizable anion provides for efficient scission of acid labile groups in a chemically amplified resist composition, and it is a very useful monomer from which a base resin for resist use is prepared.

    摘要翻译: 提供具有式(1a)的锍盐,其中R 1为H,F,CH 3或CF 3,R 1a至R 1a各自独立地为H或一价烃基,L为单键或二价烃基,X为二价亚烷基 任选被氟取代,并且n为0或1.具有可聚合阴离子的锍盐提供化学放大抗蚀剂组合物中酸不稳定基团的有效断裂,并且它是一种非常有用的单体,抗蚀剂使用的基础树脂是 准备