公开(公告)号：US20170047266A1

公开(公告)日：2017-02-16

申请号：US15215800

申请日：2016-07-21

Applicant: Socionext Inc.

Inventor： Takumi Ihara ,  Nobutaka Shimizu ,  Masamitsu Ikumo

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/03 ,  H01L24/09 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/14051 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83201 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate and a semiconductor element mounted on the top surface of the substrate. On the top surface of the substrate, one or more pads are disposed outside the mounted semiconductor element when seen in a plan view. Then, a protrusion is disposed on each of the pads. A heat sink is disposed above the semiconductor element and the protrusions, and then bonded to the substrate by an adhesive provided between the heat sink and the substrate. The adhesive is provided in such a manner as to be in contact with the protrusions on the substrate.

Abstract translation: 半导体器件包括衬底和安装在衬底顶表面上的半导体元件。 在基板的顶表面上，当在平面图中看时，一个或多个焊盘设置在安装的半导体元件的外部。 然后，在每个焊盘上设置突起。 散热器设置在半导体元件和突起上方，然后通过设置在散热器和基板之间的粘合剂结合到基板。 粘合剂以与基板上的突起接触的方式设置。

公开(公告)号：US11694985B2

公开(公告)日：2023-07-04

申请号：US17580371

申请日：2022-01-20

Applicant: SOCIONEXT INC.

Inventor： Takumi Ihara ,  Masanori Natsuaki

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L23/49827 ,  H01L24/48

Abstract: A semiconductor device includes a wiring board, a semiconductor chip arranged on the wiring board, and a plurality of bumps arranged between the wiring board and the semiconductor chip, wherein the wiring board includes a first conductor, a second conductor, a third conductor, a first via, a second via, and a third via, wherein the second conductor is arranged at a position closer to a center of the semiconductor chip than the first conductor is to the center, as seen in a thickness direction, the first conductor and the second conductor are arranged next to each other without another conductor interposed therebetween, as seen in the thickness direction, and a first distance between the first conductor and the second conductor is larger than a second distance between the first conductor and the third conductor.

公开(公告)号：US11329019B2

公开(公告)日：2022-05-10

申请号：US16950789

申请日：2020-11-17

Applicant: SOCIONEXT INC.

Inventor： Takumi Ihara ,  Masanori Natsuaki

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor device includes a wiring board, a semiconductor chip arranged on the wiring board, and a plurality of bumps arranged between the wiring board and the semiconductor chip, wherein the wiring board includes a first conductor, a second conductor, a third conductor, a first via, a second via, and a third via, wherein the second conductor is arranged at a position closer to a center of the semiconductor chip than the first conductor is to the center, as seen in a thickness direction, the first conductor and the second conductor are arranged next to each other without another conductor interposed therebetween, as seen in the thickness direction, and a first distance between the first conductor and the second conductor is larger than a second distance between the first conductor and the third conductor.

公开(公告)号：US20210159199A1

公开(公告)日：2021-05-27

申请号：US16950789

申请日：2020-11-17

Applicant: SOCIONEXT INC.

Inventor： Takumi Ihara ,  Masanori Natsuaki

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor device includes a wiring board, a semiconductor chip arranged on the wiring board, and a plurality of bumps arranged between the wiring board and the semiconductor chip, wherein the wiring board includes a first conductor, a second conductor, a third conductor, a first via, a second via, and a third via, wherein the second conductor is arranged at a position closer to a center of the semiconductor chip than the first conductor is to the center, as seen in a thickness direction, the first conductor and the second conductor are arranged next to each other without another conductor interposed therebetween, as seen in the thickness direction, and a first distance between the first conductor and the second conductor is larger than a second distance between the first conductor and the third conductor.

公开(公告)号：US10008432B2

公开(公告)日：2018-06-26

申请号：US15215800

申请日：2016-07-21

Applicant: Socionext Inc.

Inventor： Takumi Ihara ,  Nobutaka Shimizu ,  Masamitsu Ikumo

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/552 ,  H01L23/31

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/03 ,  H01L24/09 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/14051 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83201 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate and a semiconductor element mounted on the top surface of the substrate. On the top surface of the substrate, one or more pads are disposed outside the mounted semiconductor element when seen in a plan view. Then, a protrusion is disposed on each of the pads. A heat sink is disposed above the semiconductor element and the protrusions, and then bonded to the substrate by an adhesive provided between the heat sink and the substrate. The adhesive is provided in such a manner as to be in contact with the protrusions on the substrate.