Process for manufacturing a microelectromechanical interaction system for a storage medium

    公开(公告)号:US10221066B2

    公开(公告)日:2019-03-05

    申请号:US15220267

    申请日:2016-07-26

    Abstract: A process for manufacturing an interaction system of a microelectromechanical type for a storage medium, the interaction system provided with a supporting element and an interaction element carried by the supporting element, envisages the steps of: providing a wafer of semiconductor material having a substrate with a first type of conductivity and a top surface; forming a first interaction region having a second type of conductivity, opposite to the first type of conductivity, in a surface portion of the substrate in the proximity of the top surface; and carrying out an electrochemical etch of the substrate starting from the top surface, the etching being selective with respect to the second type of conductivity, so as to remove the surface portion of the substrate and separate the first interaction region from the substrate, thus forming the supporting element.

    PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL INTERACTION SYSTEM FOR A STORAGE MEDIUM
    7.
    发明申请
    PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL INTERACTION SYSTEM FOR A STORAGE MEDIUM 审中-公开
    用于制造存储介质的微电子交互系统的方法

    公开(公告)号:US20160332871A1

    公开(公告)日:2016-11-17

    申请号:US15220267

    申请日:2016-07-26

    Abstract: A process for manufacturing an interaction system of a microelectromechanical type for a storage medium, the interaction system provided with a supporting element and an interaction element carried by the supporting element, envisages the steps of: providing a wafer of semiconductor material having a substrate with a first type of conductivity and a top surface; forming a first interaction region having a second type of conductivity, opposite to the first type of conductivity, in a surface portion of the substrate in the proximity of the top surface; and carrying out an electrochemical etch of the substrate starting from the top surface, the etching being selective with respect to the second type of conductivity, so as to remove the surface portion of the substrate and separate the first interaction region from the substrate, thus forming the supporting element.

    Abstract translation: 一种用于制造用于存储介质的微机电类型的相互作用系统的方法,具有支撑元件的相互作用系统和由支撑元件承载的相互作用元件,其设想是提供具有基板的半导体材料晶片,其具有 第一类导电性和顶面; 在所述顶表面附近的所述衬底的表面部分中形成具有与所述第一类型导电性相反的第二导电类型的第一相互作用区域; 并且从顶表面开始进行基板的电化学蚀刻,蚀刻相对于第二类型的导电性是选择性的,以便去除基板的表面部分并将第一相互作用区域与基板分离,从而形成 支撑元件。

    INTEGRATED MAGNETORESISTIVE SENSOR, IN PARTICULAR THREE-AXIS MAGNETORESISTIVE SENSOR AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    INTEGRATED MAGNETORESISTIVE SENSOR, IN PARTICULAR THREE-AXIS MAGNETORESISTIVE SENSOR AND MANUFACTURING METHOD THEREOF 审中-公开
    集成磁传感器,特别是三轴磁传感器及其制造方法

    公开(公告)号:US20160072057A1

    公开(公告)日:2016-03-10

    申请号:US14938121

    申请日:2015-11-11

    Abstract: An integrated magnetoresistive device includes a substrate of semiconductor material that is covered, on a first surface, by an insulating layer. A magnetoresistor of ferromagnetic material extends within the insulating layer and defines a sensitivity plane of the sensor. A concentrator of ferromagnetic material includes at least one arm that extends in a transversal direction to the sensitivity plane and is vertically offset from the magnetoresistor. The concentrator concentrates deflects magnetic flux lines perpendicular to the sensitivity plane so as to generate magnetic-field components directed in a parallel direction to the sensitivity plane.

    Abstract translation: 集成磁阻器件包括半导体材料的衬底,其在第一表面上被绝缘层覆盖。 铁磁材料的磁阻电阻在绝缘层内延伸并限定传感器的灵敏度平面。 铁磁材料的集中器包括沿横向方向延伸到灵敏度平面并且与磁电阻器垂直偏移的至少一个臂。 集中器集中使垂直于灵敏度平面的磁通线偏转,以产生指向与感光平面平行的方向的磁场分量。

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