公开(公告)号：US08822275B2

公开(公告)日：2014-09-02

申请号：US13459924

申请日：2012-04-30

申请人： Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Wayne Victor Sorin ,  Susant K Patra

发明人： Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Wayne Victor Sorin ,  Susant K Patra

IPC分类号： H01L21/78

CPC分类号： G02B6/12004 ,  B29D11/00307 ,  B29D11/0073 ,  G02B6/122 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83141 ,  H01L2224/8385 ,  H01L2224/83898 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06593 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

摘要翻译： 复合晶片包括模制晶片和第二晶片。 模制的晶片包括多个第一部件，并且第二晶片包括多个第二部件。 将第二晶片与模制晶片组合以形成复合晶片。 第一组分中的至少一个与至少一个第二组分对准以形成多组分元素。 多组分元素可从复合晶片中分离出来。

公开(公告)号：US09164249B2

公开(公告)日：2015-10-20

申请号：US14365129

申请日：2012-01-27

申请人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Wayne Victor Sorin ,  Paul Kessler Rosenberg ,  Georgios Panotopoulos ,  Susant K Patra

发明人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Wayne Victor Sorin ,  Paul Kessler Rosenberg ,  Georgios Panotopoulos ,  Susant K Patra

IPC分类号： G02B6/42 ,  H01L31/0232

CPC分类号： G02B6/423 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4279 ,  G02B6/4292 ,  H01L31/02325

摘要： A glass-silicon wafer stacked platform. The platform includes a plurality of silicon pillars defining a ferrule receptacle, a silicon spacer connected to bases of the pillars and enclosing an aperture, a glass wafer bonded to the spacer, a microlens array formed in a first surface of the glass wafer and located in the aperture, conductive material carried by a second surface of the glass wafer, and contacts in electrical communication with the conductive material.

摘要翻译： 玻璃硅片堆叠平台。 平台包括限定套圈插座的多个硅柱，连接到柱的基部并包围孔的硅隔离物，与间隔物接合的玻璃晶片，形成在玻璃晶片的第一表面中的微透镜阵列， 由玻璃晶片的第二表面承载的孔，导电材料和与导电材料电连通的触点。

公开(公告)号：US08934745B2

公开(公告)日：2015-01-13

申请号：US13563135

申请日：2012-07-31

申请人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin

发明人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin

IPC分类号： G02B6/26 ,  G02B6/42 ,  H01L31/0232 ,  G02B6/12 ,  H01L25/16

CPC分类号： G02B6/4228 ,  G02B6/12 ,  G02B6/42 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4246 ,  G02B6/4292 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L2224/16225 ,  H01L2924/0002 ,  Y10T29/49778 ,  H01L2924/00

摘要： According to an example, an apparatus for use in optoelectronics includes a bottom transparent layer, a top transparent layer having a top surface, a lens sandwiched between the bottom transparent layer and the top transparent layer, and a first alignment element attached to the top surface of the top transparent layer, wherein the first alignment element is offset with respect to the lens and is to mate with a mating alignment element on an optical transmission medium.

摘要翻译： 根据一个实例，用于光电子学的装置包括底部透明层，具有顶表面的顶部透明层，夹在底部透明层和顶部透明层之间的透镜以及附接到顶部表面的第一对准元件 其中第一对准元件相对于透镜偏移并且与光传输介质上的匹配对准元件配合。

公开(公告)号：US20150003792A1

公开(公告)日：2015-01-01

申请号：US14365194

申请日：2012-01-31

申请人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos

发明人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4293 ,  G02B6/423 ,  G02B6/4232 ,  G02B6/4285 ,  G02B6/43

摘要： A monolithically integrated, self-aligning, optical-fiber ferrule for a pigtailed opto-electronic module. The ferrule includes a body, a cavity defined within the body, a lateral alignment structure, and an optical-fiber stop. The cavity is to accept and align an optical fiber with an end of the cavity to face an optical aperture of an opto-electronic component. The lateral alignment structure is to self-align laterally the optical fiber with the optical aperture. The optical-fiber stop is coupled to the body, to self-align vertically the optical fiber. The body, the cavity, the lateral alignment structure and the optical-fiber stop are integrated together as a portion of a monolithically integrated chip. A system and a pigtailed opto-electronic engine that include the ferrule are also provided.

摘要翻译： 用于尾纤光电模块的单片集成自对准光纤套圈。 套圈包括主体，限定在主体内的空腔，横向对准结构和光纤停止件。 腔体是将光纤与腔的端部接合并对齐，以面对光电子部件的光学孔。 侧向对准结构是使光纤与光学孔径横向自对准。 光纤停止件耦合到主体，以使光纤自动对准。 主体，空腔，横向对准结构和光纤停止件作为单片集成芯片的一部分集成在一起。 还提供了包括套圈的系统和尾纤光电发动机。

公开(公告)号：US20140328596A1

公开(公告)日：2014-11-06

申请号：US14371537

申请日：2012-01-31

申请人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos ,  Susant K. Patra ,  Joseph Straznicky

发明人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos ,  Susant K. Patra ,  Joseph Straznicky

IPC分类号： H04B10/25 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/167

CPC分类号： H04B10/2504 ,  G02B6/4245 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/0305 ,  H05K2201/10121 ,  H05K2201/10977

摘要： A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

摘要翻译： 用于光电发动机的组合底部填充坝和电互连结构。 该结构包括第一多个电互连焊料体。 第一组多个电互连焊料体包括多个电互连。 第一组多个电互连焊料体设置成阻止底部填充材料侵入光电子发动机的光电子部件的光路中。 还提供了包括组合底部填充坝和电互连结构的系统和光电发动机。

公开(公告)号：US09917647B2

公开(公告)日：2018-03-13

申请号：US14371537

申请日：2012-01-31

申请人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos ,  Susant K. Patra ,  Joseph Straznicky

发明人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos ,  Susant K. Patra ,  Joseph Straznicky

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/167 ,  H04B10/25 ,  G02B6/42 ,  H05K1/02

CPC分类号： H04B10/2504 ,  G02B6/4245 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/0305 ,  H05K2201/10121 ,  H05K2201/10977

摘要： A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

公开(公告)号：US09354410B2

公开(公告)日：2016-05-31

申请号：US14365194

申请日：2012-01-31

申请人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos

发明人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg ,  Wayne Victor Sorin ,  Georgios Panotopoulos

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4293 ,  G02B6/423 ,  G02B6/4232 ,  G02B6/4285 ,  G02B6/43

摘要： A monolithically integrated, self-aligning, optical-fiber ferrule for a pigtailed opto-electronic module. The ferrule includes a body, a cavity defined within the body, a lateral alignment structure, and an optical-fiber stop. The cavity is to accept and align an optical fiber with an end of the cavity to face an optical aperture of an opto-electronic component. The lateral alignment structure is to self-align laterally the optical fiber with the optical aperture. The optical-fiber stop is coupled to the body, to self-align vertically the optical fiber. The body, the cavity, the lateral alignment structure and the optical-fiber stop are integrated together as a portion of a monolithically integrated chip. A system and a pigtailed opto-electronic engine that include the ferrule are also provided.

摘要翻译： 用于尾纤光电模块的单片集成自对准光纤套圈。 套圈包括主体，限定在主体内的空腔，横向对准结构和光纤停止件。 腔体是将光纤与腔的端部接合并对齐，以面对光电子部件的光学孔。 侧向对准结构是使光纤与光学孔径横向自对准。 光纤停止件耦合到主体，以使光纤自动对准。 主体，空腔，横向对准结构和光纤停止件作为单片集成芯片的一部分集成在一起。 还提供了包括套圈的系统和尾纤光电发动机。

公开(公告)号：US20140341516A1

公开(公告)日：2014-11-20

申请号：US14365129

申请日：2012-01-27

申请人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Wayne Victor Sorin ,  Paul Kessler Rosenberg ,  Georgios Panotopoulos ,  Susant K Patra

发明人： Sagi Varghese Mathai ,  Michael Renne Ty Tan ,  Wayne Victor Sorin ,  Paul Kessler Rosenberg ,  Georgios Panotopoulos ,  Susant K Patra

IPC分类号： G02B6/42 ,  H01L31/0232

CPC分类号： G02B6/423 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4279 ,  G02B6/4292 ,  H01L31/02325

摘要： A glass-silicon wafer stacked platform. The platform includes a plurality of silicon pillars defining a ferrule receptacle, a silicon spacer connected to bases of the pillars and enclosing an aperture, a glass wafer bonded to the spacer, a microlens array formed in a first surface of the glass wafer and located in the aperture, conductive material carried by a second surface of the glass wafer, and contacts in electrical communication with the conductive material

摘要翻译： 玻璃硅片堆叠平台。 平台包括限定套圈插座的多个硅柱，连接到柱的基部并包围孔的硅隔离物，与间隔物接合的玻璃晶片，形成在玻璃晶片的第一表面中的微透镜阵列， 由玻璃晶片的第二表面承载的孔，导电材料和与导电材料电连通的触点

公开(公告)号：US20130286614A1

公开(公告)日：2013-10-31

申请号：US13459924

申请日：2012-04-30

申请人： Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Wayne Victor Sorin ,  Susant K. Patra

发明人： Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Wayne Victor Sorin ,  Susant K. Patra

IPC分类号： H05K7/06 ,  H01L21/78

CPC分类号： G02B6/12004 ,  B29D11/00307 ,  B29D11/0073 ,  G02B6/122 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83141 ,  H01L2224/8385 ,  H01L2224/83898 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06593 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

摘要翻译： 复合晶片包括模制晶片和第二晶片。 模制的晶片包括多个第一部件，并且第二晶片包括多个第二部件。 将第二晶片与模制晶片组合以形成复合晶片。 第一组分中的至少一个与至少一个第二组分对准以形成多组分元素。 多组分元素可从复合晶片中分离出来。

公开(公告)号：US09971088B2

公开(公告)日：2018-05-15

申请号：US14390587

申请日：2012-04-16

申请人： Paul Kessler Rosenberg ,  Michael Renne Ty Tan ,  Sagi Varghese Mathai ,  Joseph Straznicky

发明人： Paul Kessler Rosenberg ,  Michael Renne Ty Tan ,  Sagi Varghese Mathai ,  Joseph Straznicky

IPC分类号： G02B6/12 ,  G02B6/42 ,  H01L21/02

CPC分类号： G02B6/12 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/425 ,  G02B6/4259 ,  G02B6/4274 ,  G02B6/4279 ,  G02B6/4295 ,  H01L21/02 ,  Y10T29/41

摘要： An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).