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1.发明授权Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly 有权集成散热器，散热器或具有预附加相变热界面材料的热管和制造电子组件的方法公开(公告)号：US07846778B2
公开(公告)日：2010-12-07
申请号：US10261676
申请日：2002-10-02
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。
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公开(公告)号：US08703286B2
公开(公告)日：2014-04-22
申请号：US13090855
申请日：2011-04-20
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
CPC分类号： H05K13/0465 , H01L23/42 , H01L23/4275 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T156/10 , Y10T428/24926 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31917 , H01L2924/00 , H01L2924/01022 , H01L2924/01083 , H01L2224/29099 , H01L2224/0401
摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。
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公开(公告)号：US07252877B2
公开(公告)日：2007-08-07
申请号：US10358526
申请日：2003-02-04
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
IPC分类号： B32B27/00
CPC分类号： H05K13/0465 , H01L23/42 , H01L23/4275 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T156/10 , Y10T428/24926 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31917 , H01L2924/00 , H01L2924/01022 , H01L2924/01083 , H01L2224/29099 , H01L2224/0401
摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。
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4.发明授权公开(公告)号：US06926955B2
公开(公告)日：2005-08-09
申请号：US10071743
申请日：2002-02-08
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
CPC分类号： H01L23/3737 , C08K3/08 , C08K3/22 , H01L23/4275 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T29/49002 , Y10T29/49083 , Y10T29/49099 , Y10T29/4913 , Y10T428/12701 , Y10T428/12896 , Y10T428/23 , Y10T428/25 , Y10T428/252 , Y10T428/2982 , H01L2924/00
摘要： According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.
摘要翻译： 根据本发明的一个方面，公开了一种用于提供由相变聚合物基体和易熔填料制成的热界面材料（TIM）的改进导热性的结构和方法。 TIM还可以具有不可熔填料和添加到相变聚合物基质中的百分比的非相变聚合物。 用于在两个或多个组分之间配合和传导热量的TIM可以是聚合物基质中的高度填充体系，其中填料的热导率高于聚合物基质。
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公开(公告)号：US20110194254A1
公开(公告)日：2011-08-11
申请号：US13090855
申请日：2011-04-20
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
CPC分类号： H05K13/0465 , H01L23/42 , H01L23/4275 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T156/10 , Y10T428/24926 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31917 , H01L2924/00 , H01L2924/01022 , H01L2924/01083 , H01L2224/29099 , H01L2224/0401
摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。
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公开(公告)号：US07967942B2
公开(公告)日：2011-06-28
申请号：US11825400
申请日：2007-07-06
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
CPC分类号： H05K13/0465 , H01L23/42 , H01L23/4275 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T156/10 , Y10T428/24926 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31917 , H01L2924/00 , H01L2924/01022 , H01L2924/01083 , H01L2224/29099 , H01L2224/0401
摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。
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7.发明授权Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly 有权集成散热器，散热器或具有预附加相变热界面材料的热管和制造电子组件的方法公开(公告)号：US07473995B2
公开(公告)日：2009-01-06
申请号：US10103801
申请日：2002-03-25
IPC分类号： H01L23/28 , H01L23/495 , H01L23/12 , H01L23/10 , H01L21/00
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。
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8.发明授权公开(公告)号：US07294394B2
公开(公告)日：2007-11-13
申请号：US11129516
申请日：2005-05-13
申请人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul A. Koning , Ashay Dani
IPC分类号： B23B5/16
CPC分类号： H01L23/3737 , C08K3/08 , C08K3/22 , H01L23/4275 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T29/49002 , Y10T29/49083 , Y10T29/49099 , Y10T29/4913 , Y10T428/12701 , Y10T428/12896 , Y10T428/23 , Y10T428/25 , Y10T428/252 , Y10T428/2982 , H01L2924/00
摘要： According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.
摘要翻译： 根据本发明的一个方面，公开了一种用于提供由相变聚合物基体和易熔填料制成的热界面材料（TIM）的改进导热性的结构和方法。 TIM还可以具有不可熔填料和添加到相变聚合物基质中的百分比的非相变聚合物。 用于在两个或多个组分之间配合和传导热量的TIM可以是聚合物基质中的高度填充体系，其中填料的热导率高于聚合物基质。
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9.发明申请公开(公告)号：US20070287005A1
公开(公告)日：2007-12-13
申请号：US11893420
申请日：2007-08-15
申请人： Saikumar Jayaraman , Paul Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul Koning , Ashay Dani
CPC分类号： H01L23/3737 , C08K3/08 , C08K3/22 , H01L23/4275 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T29/49002 , Y10T29/49083 , Y10T29/49099 , Y10T29/4913 , Y10T428/12701 , Y10T428/12896 , Y10T428/23 , Y10T428/25 , Y10T428/252 , Y10T428/2982 , H01L2924/00
摘要： A thermal interface material made with a phase change polymer and a fusible filler material.
摘要翻译： 由相变聚合物和易熔填料制成的热界面材料。
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公开(公告)号：US20070251639A1
公开(公告)日：2007-11-01
申请号：US11825400
申请日：2007-07-06
申请人： Saikumar Jayaraman , Paul Koning , Ashay Dani
发明人： Saikumar Jayaraman , Paul Koning , Ashay Dani
IPC分类号： B29C65/02 , C09J201/00
CPC分类号： H05K13/0465 , H01L23/42 , H01L23/4275 , H01L24/29 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , Y10T156/10 , Y10T428/24926 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31917 , H01L2924/00 , H01L2924/01022 , H01L2924/01083 , H01L2224/29099 , H01L2224/0401
摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
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