公开(公告)号：US20070287005A1

公开(公告)日：2007-12-13

申请号：US11893420

申请日：2007-08-15

申请人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

IPC分类号： B32B5/16 ,  B32B18/00 ,  H01S4/00

CPC分类号： H01L23/3737 ,  C08K3/08 ,  C08K3/22 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49099 ,  Y10T29/4913 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/23 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2982 ,  H01L2924/00

摘要： A thermal interface material made with a phase change polymer and a fusible filler material.

摘要翻译： 由相变聚合物和易熔填料制成的热界面材料。

公开(公告)号：US20070251639A1

公开(公告)日：2007-11-01

申请号：US11825400

申请日：2007-07-06

申请人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

IPC分类号： B29C65/02 ,  C09J201/00

CPC分类号： H05K13/0465 ,  H01L23/42 ,  H01L23/4275 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T156/10 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/31917 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2224/0401

摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.

公开(公告)号：US20050214523A1

公开(公告)日：2005-09-29

申请号：US11129516

申请日：2005-05-13

申请人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul Koning ,  Ashay Dani

IPC分类号： C08K3/08 ,  C08K3/22 ,  C08K3/10

CPC分类号： H01L23/3737 ,  C08K3/08 ,  C08K3/22 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49099 ,  Y10T29/4913 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/23 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2982 ,  H01L2924/00

摘要： A thermal interface material made with a phase change polymer and a fusible filler material.

摘要翻译： 由相变聚合物和易熔填料制成的热界面材料。

公开(公告)号：US20050040507A1

公开(公告)日：2005-02-24

申请号：US10956162

申请日：2004-09-30

申请人： James Matayabas ,  Paul Koning ,  Ashay Dani ,  Christopher Rumer

发明人： James Matayabas ,  Paul Koning ,  Ashay Dani ,  Christopher Rumer

IPC分类号： H01L23/31 ,  H01L23/373 ,  H01L23/42 ,  H01L21/44

CPC分类号： H01L23/3737 ,  H01L23/3128 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

摘要： A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.

公开(公告)号：US07794623B2

公开(公告)日：2010-09-14

申请号：US12151332

申请日：2008-05-06

申请人： James Christopher Matayabas, Jr. ,  Paul Koning

发明人： James Christopher Matayabas, Jr. ,  Paul Koning

IPC分类号： G03C5/00 ,  C09K19/52 ,  H01L27/15 ,  H01L23/28 ,  C08G59/00

CPC分类号： C09K19/3411 ,  Y10T428/10 ,  Y10T428/25

摘要： Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140° C. and may be liquid crystalline at a temperature greater than 150° C.

摘要翻译： 公开了液晶环氧化合物，包括该化合物的组合物和使用该组合物的方法。 一方面，环氧化合物的熔点可以低于140℃，并且在大于150℃的温度下可以是液晶。

公开(公告)号：USD569663S1

公开(公告)日：2008-05-27

申请号：US29297897

申请日：2007-11-21

申请人： Errol Pearsons ,  Paul Koning

设计人： Errol Pearsons ,  Paul Koning

公开(公告)号：US20070182010A1

公开(公告)日：2007-08-09

申请号：US11724887

申请日：2007-03-16

申请人： Paul Koning

发明人： Paul Koning

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/0108 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mounting substrate includes an imprinted structure on one side for containing electrical bumps. The imprinted structure is imprinted and also cured under conditions that allow retention of significant features of the cured polymer film. A chip package is also made of the imprinted structure. A computing system is also disclosed that includes the imprinted structure.

公开(公告)号：US20050287714A1

公开(公告)日：2005-12-29

申请号：US10881377

申请日：2004-06-29

申请人： Michael Walk ,  Paul Koning

发明人： Michael Walk ,  Paul Koning

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498

CPC分类号： H01L23/145 ,  H01L21/481 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/12044

摘要： An embodiment of the present invention is a technique to provide a substrate with enhanced strength. A kaolin filler is added to an epoxy resin. The kaolin filler is mixed with the epoxy resin to form a mixture. A substrate is formed from the mixture. The substrate is processed in a package containing a semiconductor device.

摘要翻译： 本发明的一个实施方案是提供具有增强强度的基材的技术。 向环氧树脂中加入高岭土填料。 将高岭土填料与环氧树脂混合以形成混合物。 由混合物形成基材。 在包含半导体器件的封装中处理衬底。

公开(公告)号：US20050221597A1

公开(公告)日：2005-10-06

申请号：US10815561

申请日：2004-03-31

申请人： Paul Koning

发明人： Paul Koning

IPC分类号： H01L21/50 ,  H01L21/56 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/0108 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mounting substrate includes an imprinted structure on one side for containing electrical bumps. The imprinted structure is imprinted and also cured under conditions that allow retention of significant features of the cured polymer film. A chip package is also made of the imprinted structure. A computing system is also disclosed that includes the imprinted structure.

摘要翻译： 安装基板在一侧包括用于容纳电凸起的压印结构。 印迹结构被印记并且在允许保留固化的聚合物膜的显着特征的条件下固化。 芯片封装也由印刷结构制成。 还公开了包括打印结构的计算系统。

公开(公告)号：US20050116387A1

公开(公告)日：2005-06-02

申请号：US10750534

申请日：2003-12-31

申请人： Peter Davison ,  Paul Koning

发明人： Peter Davison ,  Paul Koning

IPC分类号： B05C1/00 ,  B05D3/12 ,  H01L21/44 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/46

CPC分类号： H05K3/005 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/1189 ,  H05K2203/122 ,  H01L2924/00

摘要： A method and apparatus to imprint or emboss dielectric substrates for high-density electronic circuitry using tool foils having a special release coating.

摘要翻译： 一种用于使用具有特殊释放涂层的工具箔来压印或压印用于高密度电子电路的电介质基片的方法和装置。