DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220130934A1

    公开(公告)日:2022-04-28

    申请号:US17239150

    申请日:2021-04-23

    IPC分类号: H01L27/32 H01L51/56

    摘要: Provided are a display device and a method of manufacturing the display device. The display device includes a substrate including a display area and a peripheral area outside the display area, a plurality of data lines disposed in the display area, a plurality of lines disposed in the display area, respectively connected to the plurality of data lines, and configured to respectively transmit a data signal from a driving circuit disposed in the peripheral area to the plurality of data lines, an insulating layer covering the plurality of lines; and a light-emitting element disposed on the insulating layer, wherein each of the plurality of lines comprises a plurality of branches branched in a direction crossing an extending direction of the line, and a black layer is disposed on an insulating layer at a position corresponding to an interval between a plurality of adjacent branches in a vertical direction.

    METHOD OF MANUFACTURING DISPLAY DEVICE

    公开(公告)号:US20220209208A1

    公开(公告)日:2022-06-30

    申请号:US17506163

    申请日:2021-10-20

    IPC分类号: H01L51/56 H01L27/32

    摘要: The method of manufacturing a display device includes preparing a substrate having a first and second area surrounding a portion of the first area, forming a semiconductor layer in the first area, forming a first insulating layer covering the semiconductor layer, forming a gate electrode layer that at least partially overlaps the semiconductor layer, forming a pad electrode layer in the second area, forming a second insulating layer covering the gate electrode layer, forming contact holes that at least partially expose the semiconductor layer and the gate electrode layer, and forming a conductive layer positioned in the contact holes and including a first and second layer. The forming of the conductive layer includes forming a first layer material and a second layer material, and removing a portion of the first layer material and a portion of the second layer material to expose the second insulating layer.