公开(公告)号：US20190304941A1

公开(公告)日：2019-10-03

申请号：US16447158

申请日：2019-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-woo KIM ,  Woon-bae KIM ,  Bo-in NOH ,  Go-woon SEONG ,  Ji-yong PARK

IPC: H01L23/00 ,  H01L23/498

Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.

公开(公告)号：US20180090459A1

公开(公告)日：2018-03-29

申请号：US15456882

申请日：2017-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-woo KIM ,  Woon-bae KIM ,  Bo-in NOH ,  Go-woon SEONG ,  Ji-yong PARK

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/08 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05584 ,  H01L2224/05666 ,  H01L2224/05686 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/1162 ,  H01L2224/13021 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16227 ,  H01L2224/16502 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2924/19105 ,  H01L2924/0105 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/013

Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.