公开(公告)号：US09677002B2

公开(公告)日：2017-06-13

申请号：US14879835

申请日：2015-10-09

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sang Won Bae ,  Yongsun Ko ,  Byoungho Kwon ,  Bo yun Kim ,  Hongjin Kim ,  Sungoh Park ,  Kuntack Lee ,  Hyosan Lee ,  Sol Han

IPC分类号： C09K13/06 ,  C23F1/26 ,  H01L21/768 ,  H01L21/02 ,  H01L21/3213

CPC分类号： C09K13/06 ,  C23F1/26 ,  H01L21/02074 ,  H01L21/32134 ,  H01L21/76865 ,  H01L21/76883

摘要： An etching composition includes about 1 wt % to about 7 wt % of hydrogen peroxide, about 20 wt % to about 80 wt % of phosphoric acid, about 0.001 wt % to about 1 wt % of an amine or amide polymer, 0 wt % to about 55 wt % of sulfuric acid, and about 10 wt % to about 45 wt % of deionized water.

公开(公告)号：US20230339523A1

公开(公告)日：2023-10-26

申请号：US18094827

申请日：2023-01-09

申请人： SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

发明人： In Kyeong HWANG ,  Hyuk Jae Sung ,  Hyungsik Um ,  Hongjin Kim ,  Won Young Kim ,  Bo Seung Hwang ,  Sangjune Bae ,  Byeong Hyeon Lim

IPC分类号： B61D15/12 ,  B61D49/00

CPC分类号： B61D15/12 ,  B61D49/00

摘要： A rail inspection device is provided. The rail inspection device includes: a drive part configured to drive on a lower rail; side wheels configured to rotate such that the drive part moves in a first direction on the lower rail, wherein the side wheels are provided on two side surfaces of the drive part opposite to each other in a second direction that intersects the first direction; upper wheels provided on an upper surface of the drive part and configured to rotate in contact with a branch guide rail provided above an upper portion of the drive part; a body connected to a lower surface of the drive part in a third direction that is perpendicular to the first direction and the second direction; and an inclination sensor provided on the upper surface of the drive part and configured to measure an inclination of the body.

公开(公告)号：US11262649B2

公开(公告)日：2022-03-01

申请号：US16901466

申请日：2020-06-15

申请人： Samsung Electronics Co., Ltd.

发明人： Ginam Park ,  Sangmin Kim ,  Jongsam Kim ,  Hongjin Kim ,  Chuljun Park ,  Yongjun Ahn ,  Sangkyung Lee ,  Junyong Lee ,  Taijo Jeon ,  Kyubum Cho

IPC分类号： G03F1/66 ,  B01D46/00 ,  B01D46/44 ,  F25B21/02 ,  F24F3/14 ,  H05B1/02 ,  F24H3/04 ,  B01D46/42 ,  B01D50/00

摘要： An apparatus for storing a mask includes a main body comprising a first region and a second region, the first region having a plurality of mask containers, a gas supply pipe having an outer portion outside of the main body, a fan in the first region to propel the gas from the second region to the first region, a filter disposed at a front end and/or a rear end of the fan, a heat exchanger in the second region and configured to exchange heat with the flowing gas, a Peltier element at the outer portion of the gas supply pipe, a first sensor installed in the gas supply pipe upstream of the Peltier element, a second sensor installed in the second region in a lower position to the heat exchanger, and a controller connected to the first and second sensors and the Peltier element.

公开(公告)号：US09721801B2

公开(公告)日：2017-08-01

申请号：US14972505

申请日：2015-12-17

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hongjin Kim ,  Kyoungseob Kim ,  Sungho Shin ,  Kuntack Lee ,  Kihong Cho

IPC分类号： H01L21/306 ,  H01L21/465 ,  H01L21/02 ,  H01L21/67 ,  B24C1/08

CPC分类号： H01L21/30625 ,  B24C1/08 ,  H01L21/02021 ,  H01L21/02057 ,  H01L21/465 ,  H01L21/67219

摘要： A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.

公开(公告)号：US20240347499A1

公开(公告)日：2024-10-17

申请号：US18391942

申请日：2023-12-21

申请人： Samsung Electronics Co., Ltd.

发明人： Hongjin Kim

IPC分类号： H01L23/00 ,  H01L25/065

CPC分类号： H01L24/49 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45166 ,  H01L2224/45171 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562

摘要： A semiconductor package includes a package substrate including a power pad and a ground pad that are spaced apart from each other in a first horizontal direction, first and second semiconductor chips on the package substrate, the first and second semiconductor chips being stacked in a stepped shape that extends in a second horizontal direction perpendicular to the first horizontal direction, and a plurality of connection wires that electrically connect the package substrate to the first semiconductor chip and/or the second semiconductor chip. The first semiconductor chip includes a plurality of lower option pads. The second semiconductor chip includes a plurality of upper option pads. The plurality of connection wires include a conductive wire that electrically connects at least one of first and second upper chip pads of the second semiconductor chip to at least one of the lower option pads of the first semiconductor chip.

公开(公告)号：US09165759B2

公开(公告)日：2015-10-20

申请号：US14086426

申请日：2013-11-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sang Won Bae ,  Yongsun Ko ,  Byoungho Kwon ,  Bo yun Kim ,  Hongjin Kim ,  Sungoh Park ,  Kuntack Lee ,  Hyosan Lee ,  Sol Han

IPC分类号： H01L21/302 ,  H01L21/02 ,  H01L21/3213 ,  H01L21/768

CPC分类号： C09K13/06 ,  C23F1/26 ,  H01L21/02074 ,  H01L21/32134 ,  H01L21/76865 ,  H01L21/76883

摘要： An etching composition includes about 1 wt % to about 7 wt % of hydrogen peroxide, about 20 wt % to about 80 wt % of phosphoric acid, about 0.001 wt % to about 1 wt % of an amine or amide polymer, 0 wt % to about 55 wt % of sulfuric acid, and about 10 wt % to about 45 wt % of deionized water.

摘要翻译： 蚀刻组合物包含约1重量％至约7重量％的过氧化氢，约20重量％至约80重量％的磷酸，约0.001重量％至约1重量％的胺或酰胺聚合物，0重量％ 约55重量％的硫酸和约10重量％至约45重量％的去离子水。