LIGHT-EMITTING DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    1.
    发明申请
    LIGHT-EMITTING DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME 审中-公开
    发光装置包及其制造方法

    公开(公告)号:US20140014990A1

    公开(公告)日:2014-01-16

    申请号:US13835921

    申请日:2013-03-15

    Abstract: Lights-emitting device (LED) packages, and methods of manufacturing the same, include at least one light-emitting structure. The at least one light-emitting structure includes a first compound semiconductor layer, an active layer, and a second compound semiconductor layer that are sequentially stacked, at least one first metal layer connected to the first compound semiconductor layer, a second metal layer connected to the second compound semiconductor layer, a substrate having a conductive bonding layer on a first surface of the substrate, and a bonding metal layer configured for eutectic bonding between the at least one first metal layer and the conductive bonding layer.

    Abstract translation: 发光装置(LED)封装及其制造方法包括至少一个发光结构。 所述至少一个发光结构包括依次堆叠的第一化合物半导体层,有源层和第二化合物半导体层,连接到第一化合物半导体层的至少一个第一金属层,连接到第一化合物半导体层的第二金属层 所述第二化合物半导体层,在所述基板的第一表面上具有导电接合层的基板以及被配置为在所述至少一个第一金属层和所述导电接合层之间共晶接合的接合金属层。

    LIGHT EMITTING DEVICE PACKAGE
    7.
    发明申请

    公开(公告)号:US20200027917A1

    公开(公告)日:2020-01-23

    申请号:US16244882

    申请日:2019-01-10

    Abstract: A light emitting device package includes a cell array having a first surface and a second surface located opposite to the first surface and including, on a portion of a horizontal extension line of the first surface, semiconductor light emitting units each including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer sequentially located on a layer surface including a sidewall of the first conductivity type semiconductor layer; wavelength converting units corresponding respectively to the semiconductor light emitting units and each arranged corresponding to the first conductivity type semiconductor layer; a barrier structure arranged between the wavelength converting units corresponding to the cell array; and switching units arranged in the barrier structure and electrically connected to the semiconductor light emitting units.

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20130309794A1

    公开(公告)日:2013-11-21

    申请号:US13950845

    申请日:2013-07-25

    Abstract: A light emitting device may include a substrate, an n-type clad layer, an active layer, and a p-type clad layer. A concave-convex pattern having a plurality of grooves and a mesa between each of the plurality of grooves may be formed on the substrate, and a reflective layer may be formed on the surfaces of the plurality of grooves or the mesa between each of the plurality of grooves. Therefore, light generated in the active layer may be reflected by the reflective layer, and extracted to an external location.

    Abstract translation: 发光器件可以包括衬底,n型覆盖层,有源层和p型覆盖层。 可以在基板上形成具有多个凹槽和每个凹槽之间的台面的凹凸图案,并且可以在多个凹槽或多个凹槽中的每一个之间的台面的表面上形成反射层 的凹槽。 因此,有源层中产生的光可以被反射层反射,并被提取到外部位置。

Patent Agency Ranking