SEMICONDUCTOR DEVICE
    1.
    发明公开

    公开(公告)号:US20230402523A1

    公开(公告)日:2023-12-14

    申请号:US18103897

    申请日:2023-01-31

    CPC classification number: H01L29/42392 H01L29/775 H01L29/0673 H01L27/088

    Abstract: A semiconductor device includes first and second active patterns respectively provided on a first and second PMOSFET regions of a substrate, a first channel pattern on the first active pattern, the first channel pattern including first semiconductor patterns stacked and spaced apart from each other, a second channel pattern on the second active pattern, the second channel pattern including second semiconductor patterns stacked and spaced apart from each other, a first gate electrode on the first channel pattern, and a second gate electrode on the second channel pattern. A first concentration of aluminum (Al) or silicon (Si) in an inner gate electrode of the first gate electrode is different from a second concentration of aluminum (Al) or silicon (Si) in an inner gate electrode of the second gate electrode.

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20210358910A1

    公开(公告)日:2021-11-18

    申请号:US17384920

    申请日:2021-07-26

    Abstract: Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device comprises a first transistor on a substrate, and a second transistor on the substrate. Each of the first and second transistors includes a plurality of semiconductor patterns vertically stacked on the substrate and vertically spaced apart from each other, and a gate dielectric pattern and a work function pattern filling a space between the semiconductor patterns. The work function pattern of the first transistor includes a first work function metal layer, the work function pattern of the second transistor includes the first work function metal layer and a second work function metal layer, the first work function metal layer of each of the first and second transistors has a work function greater than that of the second work function metal layer, and the first transistor has a threshold voltage less than that of the second transistor.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    6.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20160372382A1

    公开(公告)日:2016-12-22

    申请号:US15158885

    申请日:2016-05-19

    Abstract: A semiconductor device includes a gate structure crossing an active pattern of a substrate. The semiconductor device may include a gate dielectric pattern between the substrate and the gate electrode. The gate structure includes a gate electrode, a capping pattern on the gate electrode, and one or more low-k dielectric layers at least partially covering one or more sidewalls of the capping pattern. The gate structure may include spacers at opposite sidewalk of the gate electrode and separate low-k dielectric layers between the capping pattern and the spacers. The capping pattern may have a width that is smaller than a width of the gate electrode. The capping pattern has a first dielectric constant, and the one or more low-k dielectric layers have a second dielectric constant. The second dielectric constant is smaller than the first dielectric constant. The second dielectric constant may he greater than or equal to 1.

    Abstract translation: 半导体器件包括与衬底的有源图案交叉的栅极结构。 半导体器件可以包括在衬底和栅电极之间的栅极电介质图案。 栅极结构包括栅电极,栅电极上的覆盖图案以及至少部分覆盖封盖图案的一个或多个侧壁的一个或多个低k电介质层。 栅极结构可以包括在栅电极的相对的人行道处的隔离物和封盖图案和间隔物之间​​的分离的低k电介质层。 封盖图案的宽度可以小于栅电极的宽度。 封盖图案具有第一介电常数,并且一个或多个低k电介质层具有第二介电常数。 第二介电常数小于第一介电常数。 第二介电常数可以大于或等于1。

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