公开(公告)号：US20220146078A1

公开(公告)日：2022-05-12

申请号：US17379530

申请日：2021-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsoo LIM ,  Chinwoo KIM ,  Yongchul KANG ,  Heejin KIM ,  Jeongje MOON ,  Jaeyoo JEONG ,  Jun CHO ,  Jongwook JU

IPC: F21V14/00 ,  F21V33/00

Abstract: Provided is a light source module including a package body having a groove portion, a semiconductor light emitting diode (LED) chip provided on a bottom surface of the groove portion, the semiconductor LED chip being configured to emit light based on a first driving voltage applied thereto, a variable light transmission unit provided on the groove portion and having light transmissivity varying based on a second driving voltage applied thereto, a first electrode side surface and a second electrode side surface provided on side surfaces of the groove portion and connecting the bottom surface of the groove portion to the variable light transmission unit, and a processor configured to control application of the first driving voltage to the semiconductor LED chip and the second driving voltage to the variable light transmission unit.

公开(公告)号：US20170261161A1

公开(公告)日：2017-09-14

申请号：US15280253

申请日：2016-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Mi MOON ,  Sang Woo HA ,  Jong Sup SONG ,  Tetsuo ARIYOSHI ,  Jun CHO ,  Won Soo JI

IPC: F21K9/61 ,  F21V15/015 ,  H01L33/48 ,  F21V9/00 ,  F21V3/02 ,  H01L33/60 ,  F21V29/77 ,  F21K9/27

CPC classification number: F21K9/61 ,  F21K9/27 ,  F21V3/02 ,  F21V3/049 ,  F21V9/00 ,  F21V15/015 ,  F21V29/74 ,  F21V29/77 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02B6/00 ,  H01L33/486 ,  H01L33/60

Abstract: A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.

公开(公告)号：US20170082262A1

公开(公告)日：2017-03-23

申请号：US15072499

申请日：2016-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Gyun JUNG ,  Jun CHO ,  Won Soo JI

IPC: F21V5/04 ,  F21V23/00 ,  F21V23/02 ,  F21V3/00

CPC classification number: F21V5/04 ,  F21V3/049 ,  F21V5/002 ,  F21V5/08 ,  F21V23/001 ,  F21Y2103/33 ,  F21Y2115/10

Abstract: An exemplary embodiment discloses a lighting apparatus including: a base; a first light emitting device (LED) array disposed on the base; a second LED array disposed on the base; and an optical device disposed on the base, the optical device including: a first lens covering the first LED array; and a second lens covering the second LED array, wherein a first beam angle of the first lens is different from a second beam angle of the second lens.

公开(公告)号：US20230197701A1

公开(公告)日：2023-06-22

申请号：US17948298

申请日：2022-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsoo LIM ,  Chinwoo KIM ,  Jeongje MOON ,  Jaeyoo JEONG ,  Jun CHO ,  Yongchul KANG ,  Jongwook JU

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/60 ,  H01L31/02 ,  G03B15/06 ,  G03B15/05 ,  H04M1/22 ,  H04N5/225 ,  H04M1/02

CPC classification number: H01L25/167 ,  H01L33/62 ,  H01L33/60 ,  H01L31/02005 ,  H01L25/165 ,  G03B15/06 ,  G03B15/05 ,  H04M1/22 ,  H04N5/2256 ,  H04M1/0264 ,  H01L31/09

Abstract: A flash light emitting diode (LED) package includes a circuit board, a flash LED device disposed on an upper surface of the circuit board n, first and third optical sensors arranged to be adjacent to a first side of the flash LED device on the upper surface of the circuit board and configured to detect light of a first wavelength and light of a second wavelength, respectively, second and fourth optical sensors arranged to be adjacent to a second side of the flash LED device on the upper surface of the circuit board and configured to detect light of the first wavelength and light of the second wavelength, respectively, and an integrated circuit (IC) chip disposed to face a third side between the first and second sides of the flash LED device on the upper surface of the circuit board.

公开(公告)号：US20160131327A1

公开(公告)日：2016-05-12

申请号：US14825112

申请日：2015-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Kyung Mi MOON ,  Tetsuo ARIYOSHI ,  Jong Pil WON ,  Seung Gyun JUNG ,  Jun CHO ,  Won Soo JI ,  Sung A CHOI

IPC: F21V3/00 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/58 ,  F21V5/008 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60

Abstract: There is provided a light source module including a light emitting device, and an optical device including a first surface disposed above the light emitting device and having a hollow recessed in a light emitting direction in a central portion through which an optical axis passes, and a second surface disposed to be opposite to the first surface and configured to refract light incident through the hollow to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge connected to the first surface.

Abstract translation: 提供了一种包括发光器件的光源模块和包括设置在发光器件上方的第一表面的光学器件，并且在光轴通过的中心部分中具有在发光方向上凹陷的中空部分，以及 第二表面设置成与第一表面相对，并且被配置为折射入射通过中空的光以发射到外部。 光学装置包括设置在第二表面上并沿着从光轴到连接到第一表面的边缘的方向周期性地布置的多个脊。