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    LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光装置模块及其制造方法

    公开(公告)号：US20140299898A1

    公开(公告)日：2014-10-09

    申请号：US14310885

    申请日：2014-06-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hak Hwan KIM ,  Kyung Mi MOON ,  Ho Sun PAEK ,  Young Hee SONG

    IPC: H01L33/50 ,  H01L33/58 ,  H01L27/15

    CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

    Abstract: A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.

    Abstract translation: 提供了可应用于各种应用的发光器件（LED）模块及其制造方法。 通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量，可以提高价格竞争力。 在制造LED模块的方法中，通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作，可以最小化和简化操作。 可以通过使用金属材料作为基板和凸块来增强散热特性。

    OPTICAL DEVICE AND LIGHT SOURCE MODULE INCLUDING THE SAME
    4.
    发明申请
    OPTICAL DEVICE AND LIGHT SOURCE MODULE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20190155009A1

    公开(公告)日：2019-05-23

    申请号：US16021729

    申请日：2018-06-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sang Woo HA ,  Tetsuo ARIYOSHI ,  Kyung Mi MOON ,  Jong Sup SONG ,  Jong Pil WON

    IPC: G02B19/00 ,  F21V5/04 ,  F21V7/00 ,  F21V13/04

    Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.

    LIGHT EMITTING DEVICE PACKAGE, WAVELENGTH CONVERSION FILM, AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE, WAVELENGTH CONVERSION FILM, AND MANUFACTURING METHOD THEREOF 有权
    发光器件封装，波长转换膜及其制造方法

    公开(公告)号：US20160359089A1

    公开(公告)日：2016-12-08

    申请号：US15098123

    申请日：2016-04-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyung Mi MOON ,  Won Soo JI

    IPC: H01L33/50

    CPC classification number: H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2933/0041

    Abstract: A light emitting device package is provided. The package includes a light emitting device including a substrate, and a light emitting structure having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on the substrate; and a wavelength conversion film disposed in a path of light emitted by the light emitting device and having phosphor layers stacked on each other. A portion of the phosphor layers includes phosphor structures including a wavelength conversion material receiving light emitted from the light emitting device and converting a wavelength thereof and a binding resin binding the wavelength conversion material, and a transparent resin filling spaces between the phosphor structures.

    Abstract translation: 提供发光器件封装。 该封装包括包括衬底的发光器件和堆叠在衬底上的具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 以及波长转换膜，其设置在由所述发光器件发射的并且具有彼此堆叠的荧光体层的光的路径中。 荧光体层的一部分包括荧光体结构，所述荧光体结构包括接收从发光器件发射的光并转换​​其波长的波长转换材料和结合波长转换材料的结合树脂以及荧光体结构之间的透明树脂填充空间。

    LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME
    6.
    发明申请
    LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME 审中-公开
    光源模块和具有相同功能的照明设备

    公开(公告)号：US20160131327A1

    公开(公告)日：2016-05-12

    申请号：US14825112

    申请日：2015-08-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD

    Inventor： Kyung Mi MOON ,  Tetsuo ARIYOSHI ,  Jong Pil WON ,  Seung Gyun JUNG ,  Jun CHO ,  Won Soo JI ,  Sung A CHOI

    IPC: F21V3/00 ,  H01L33/50 ,  H01L33/60

    CPC classification number: H01L33/58 ,  F21V5/008 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60

    Abstract: There is provided a light source module including a light emitting device, and an optical device including a first surface disposed above the light emitting device and having a hollow recessed in a light emitting direction in a central portion through which an optical axis passes, and a second surface disposed to be opposite to the first surface and configured to refract light incident through the hollow to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge connected to the first surface.

    Abstract translation: 提供了一种包括发光器件的光源模块和包括设置在发光器件上方的第一表面的光学器件，并且在光轴通过的中心部分中具有在发光方向上凹陷的中空部分，以及 第二表面设置成与第一表面相对，并且被配置为折射入射通过中空的光以发射到外部。 光学装置包括设置在第二表面上并沿着从光轴到连接到第一表面的边缘的方向周期性地布置的多个脊。

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